Patents by Inventor Feng-Hao Ku

Feng-Hao Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163075
    Abstract: The present disclosure provides a privacy computing method based on homomorphic encryption, which includes steps as follows. The ciphertext data is received, where the ciphertext data has a floating-point homomorphic encryption data structure, and the floating-point homomorphic encryption data structure of the ciphertext data includes the ciphertext mantissa, exponent parameter and gain parameter. The gain parameter sets the precision of the floating point corresponding to the ciphertext mantissa. The exponent parameter is adapted to multiplication or division. The artificial intelligence model performs operations on the ciphertext data to return the ciphertext result.
    Type: Application
    Filed: February 17, 2023
    Publication date: May 16, 2024
    Inventors: Yu Te KU, Chih-Fan HSU, Wei-Chao CHEN, Feng-Hao LIU, Ming-Ching CHANG
  • Patent number: 8105093
    Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: January 31, 2012
    Assignees: Innocom Technology (Shenzhen) Co., Ltd., Chimei Innolux Corporation
    Inventors: Xue-Feng Zhang, Feng-Hao Ku, Yu-Feng Xia
  • Publication number: 20110124208
    Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion.
    Type: Application
    Filed: November 19, 2010
    Publication date: May 26, 2011
    Applicants: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD., CHIMEI INNOLUX CORPORATION
    Inventors: XUE-FENG ZHANG, FENG-HAO KU, YU-FENG XIA