Abstract: An optical sensor including a pixel matrix and an opaque layer is provided. The pixel matrix includes a plurality of unblocked pixels, a first pixel and a second pixel, which is arranged at a side of the first pixel in a row direction of the pixel matrix. The opaque layer covers upon a first region, which is a part of the first pixel, and upon a second region, which is a part of the second pixel, but does not cover upon the unblocked pixels, wherein the first region and the second region are symmetrically arranged in the row direction, and uncovered regions of the first pixel and the second pixel are arranged to be larger at a pixel edge than at a pixel center in a column direction of the pixel matrix.

Abstract: There is provided a portable electronic device including a backlight module, an ambient light sensor, a proximity sensor and a processing unit. The backlight module illuminates with backlight brightness. The ambient light sensor is configured to detect ambient light intensity. The proximity sensor is configured to detect an object. The processing unit is configured to activate the proximity sensor when the ambient light intensity detected by the ambient light sensor is lower than a predetermined value or decreases more than a predetermined range, and to maintain or reduce the backlight brightness according to a detection result of the proximity sensor. There is further provided an automatic detection method.

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes at least two sub-parts, and the at least two sub-parts respectively include a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole passes through the first substrate and exposes a portion of the second upper surface. Furthermore, the conductive material is partially disposed in the through hole and in contact with at least one first upper surface and the second upper surface.

Abstract: An electronic device comprising: a clock pin; at least one data pin; a storage device, configured to store at least one program; a processing circuit, coupled to the data pin. A device ID setting method is performed when the processing circuit executes the program stored in the storage device. The device ID setting method comprises; (a) recording connections between pins of a first electronic device and pins of the electronic device by the electronic device, wherein the first electronic device comprises at least one data pin; and (b) applying the connections between the pins of the first electronic device and the pins of the electronic device as a device ID of the first electronic device by the electronic device.

Abstract: An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole and a conductive material. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface and a first side surface. The second substrate is disposed opposite to the first substrate. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates through the first substrate. In addition, in a top-view diagram, the through hole includes an extension area. The conductive material is partially disposed in the extension area and in contact with the first upper surface and the second upper surface.

Abstract: A sole data collection device and a sole data collection method are disclosed. The sole data collection device includes an image capture module, a temperature detection module and a monofilament testing module. The sole data collection device is used for collecting the sole data of a user, and the sole data is transmitted to a cloud server. The sole data collection device and the sole data collection method are not only convenient for a user to collect sole data at home at any time, but also allow the user's caregiver and/or relevant medical care personnel to extract the sole data from the cloud server to screen the user's plantar condition, so as to solve the problem that it is time-consuming and costly to go to a medical institution for relevant examinations.

Abstract: A method for image analysis of predicted cell metastasis is provided. A host performs principle component analysis (PCA) for analysis and conversion of reference images into hyperspectral image information. Then an image capture unit sends input images to the host. The host converts the input images into hyperspectral images according to the hyperspectral image information and gets spectral information of the hyperspectral images. Next the host selects a plurality of wave bands corresponding to esophageal cancer cells and performs feature computation of the spectral information to generate corresponding features images. Then the host performs convolution of the feature images with kernels to get a convolution result. Later the host matches the convolution result with sample spectra of sample images to get a comparison result. Lastly the host determines whether metastasis of esophageal cancer cells occurs according to the comparison result.

Abstract: The present disclosure relates to systems, methods, and computer-readable media for managing tracked memory usage data and performing various actions based on memory usage data tracked by a memory controller on a memory device. For example, systems described herein involve collecting and compiling data across one or more memory controllers to evaluate characteristics of the memory usage data to determine hotness metric(s) for segments of a memory resource. The systems described herein may perform a variety of segment actions based on the hotness metric(s). In addition, the systems described herein can compile the memory usage data according to one or more access granularities. This compiled data may further be shared with multiple accessing agents in accordance with access resolutions of the respective accessing agents.

Abstract: Aspects of the disclosure provide a method and an apparatus for executing a program, e.g., a neural network (NN) inference. For example, the apparatus can include an executor and a dynamic loading agent. The executor can be coupled to a second memory, and be configured to execute a portion of the NN inference loaded on the second memory from a first memory that stores the NN inference, and to generate a signal based on a progress of the execution of the NN inference. The dynamic loading agent can be coupled to the executor, the first memory and the second memory, and be configured to load a next portion of the NN inference stored in the first memory to the second memory and to manage power supplied to the first memory based on the signal from the executor and an inference executing scheme stored in the second memory.

Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor further records defect pixels of a pixel array such that in integrating pixel data to integrators, the pixel data associated with the defect pixels is not integrated into corresponding integrators.

Abstract: The disclosure relates to methods, apparatuses, and systems of providing livestream services involving multiple camera angles. A video streaming system may provide a client with a data stream that allows for viewing the video streaming from any of the multiple cameras at the client's choosing. The video streaming system may first access image data from the multiple cameras. Image data from the multiple cameras taken at a single instance in time may be “stitched” together into a single array of image data to form an “image wall.” The image wall may be compressed to be substantially smaller than the sum of their individual compressed images. A stream of image walls may be generated and transmitted to a client device. Metadata including mapping information enables the client to locate a chosen camera angle to view and switch to any camera angle viewing of the same video stream at the client's choosing.

Abstract: There is provided an optical sensor that acquires a first image frame corresponding to a first flicker period and acquires a second image frame corresponding to a second flicker period. The optical sensor respectively adds pixel data of every two pixels in neighboring rows of the first image frame and the second image frame to generate a low-resolution image frame for the motion detection.

Abstract: A method for fabricating a semiconductor device includes the steps of first defining a scribe line on a front side of a wafer, in which the wafer includes an inter-metal dielectric (IMD) layer disposed on a substrate and an alternating stack disposed on the IMD layer. Next, part of the alternating stack is removed to form a trench on the front side of the wafer, a dielectric layer is formed in the trench, and then a dicing process is performed along the scribe line from a back side of the wafer to divide the wafer into chips.

Abstract: The present invention provides a 3D integrated circuit structure formed by stacking semiconductor structures. The semiconductor structures form a multi-die heterogeneous 3D packaging by direct bonding the bonding pads of re-distribution layers. The same or different dies are used to produce the semiconductor structures through the back-end packaging process, and then hybrid bonding technology is used to stack and interconnect the semiconductor structures. The position of the bonding pad can be redefined by re-distribution layer, thereby overcoming the limitations of chip bonding pad position, chip size and quantity.

Abstract: The present disclosure relates to systems, methods, and computer-readable media for tracking memory usage data on a memory controller system and providing a mechanism whereby one or multiple accessing agents (e.g., computing nodes, applications, virtual machines) can access memory usage data for a memory resource managed by a memory controller. Indeed, the systems described herein facilitate generation of and access to heatmaps having memory usage data thereon. The systems described herein describe features and functionality related to generating and maintaining the heatmaps as well as providing access to the heatmaps to a variety of accessing agents. This memory tracking and accessing is performed using low processing overhead while providing useful information to accessing agents in connection with memory resources managed by a memory controller.

Abstract: A semiconductor structure and a method for fabricating the same are provided. The semiconductor structure includes a first chip, a second chip and a conductive structure. The first chip has an active side and an opposite side disposed opposite to each other. The second chip includes a chip bonding portion and an outer pad, and the outer pad is located outside the chip bonding portion. The first chip is disposed on the chip bonding portion of the second chip with the active side. The conductive structure is disposed on the outer pad, and the conductive structure includes a stack of a plurality of metal balls. The stack extends from the outer pad beyond the opposite side of the first chip.

Abstract: A semiconductor device includes a substrate having a bonding area and a pad area, a first inter-metal dielectric (IMD) layer on the substrate, a metal interconnection in the first IMD layer, a first pad on the bonding area and connected to the metal interconnection, and a second pad on the pad area and connected to the metal interconnection. Preferably, the first pad includes a first portion connecting the metal interconnection and a second portion on the first portion, and the second pad includes a third portion connecting the metal interconnection and a fourth portion on the third portion, in which top surfaces of the second portion and the fourth portion are coplanar.

Abstract: An electronic device for face recognition is provided. The electronic device is used to exclude an ineligible object to be identified according to the relative relationship between object distances and image sizes, the image variation with time and/or the feature difference between images captured by different cameras to prevent the possibility of cracking the face recognition by using a photo or a video.

Abstract: An optical sensor, comprising: a sensor array, comprising a bright region with at least one bright pixel and comprising a dark region with at least one dark pixel, wherein the dark pixel generates a sensing signal that is non-relevant to light emitted to the sensor array; a power noise detection circuit, configured to compute a power noise level of the sensing signal from the dark pixel; and a power noise compensation circuit, configured to control the optical sensor to perform a power noise compensation operation according to the power noise level. A related power noise reduction method is also disclosed. Based on the present invention, the power noise of the optical sensor can be reduced without increasing the power consumption, and the power noise for a low switch frequency can also be improved.

Abstract: The present disclosure relates to systems, methods, and computer-readable media for tracking memory usage data on a memory controller system and providing a mechanism whereby one or multiple accessing agents (e.g., computing nodes, applications, virtual machines) can access memory usage data for a memory resource managed by a memory controller. Indeed, the systems described herein facilitate generation of and access to heatmaps having memory usage data thereon. The systems described herein describe features and functionality related to generating and maintaining the heatmaps as well as providing access to the heatmaps to a variety of accessing agents. This memory tracking and accessing is performed using low processing overhead while providing useful information to accessing agents in connection with memory resources managed by a memory controller.