Patents by Inventor Feng Hua

Feng Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096731
    Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Chin-Hua WANG, Po-Yao LIN, Feng-Cheng HSU, Shin-Puu JENG, Wen-Yi LIN, Shu-Shen YEH
  • Publication number: 20240088124
    Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: HSIANG-TAI LU, SHUO-MAO CHEN, MILL-JER WANG, FENG-CHENG HSU, CHAO-HSIANG YANG, SHIN-PUU JENG, CHENG-YI HONG, CHIH-HSIEN LIN, DAI-JANG CHEN, CHEN-HUA LIN
  • Publication number: 20240073531
    Abstract: An automatic target image acquisition and calibration system for application in a defect inspection system is disclosed. During the defect inspection system working normally, the automatic target image acquisition and calibration system is configured to find a recognition structure from an article under inspection, and then determines a relative position and a relative 3D coordinate if the article. Therefore, a robotic arm is controlled to carry a camera to precisely face each of a plurality of inspected surfaces of the article, such that a plurality of article images are acquired by the camera. It is worth explaining that, during the defect inspection of the article, there is no need to modulate an image acquiring height and an image acquiring angle of the camera and an illumination of a light source.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 29, 2024
    Inventors: FENG-TSO SUN, YI-TING YEH, FENG-YU SUN, JYUN-TANG HUANG, RONG-HUA CHANG, YI-HSIANG TIEN, MENG-TSE SHEN
  • Patent number: 11915992
    Abstract: A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang
  • Patent number: 11871510
    Abstract: A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: January 9, 2024
    Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu, Feng-Hua Deng, Ming-Fang Chen
  • Publication number: 20230364112
    Abstract: A method of treating central nervous system (CNS) diseases in a subject is provided. The method comprises administering to the subject a therapeutically effective amount of Antcin H and/or its derivatives. The novel use of Antcin H and/or its derivatives are also provided.
    Type: Application
    Filed: September 29, 2021
    Publication date: November 16, 2023
    Applicant: ALPS BIOTECH CO., LTD.
    Inventors: Kuo-Feng Hua, Tz-Chuen Ju, Shui-Tein Chen
  • Publication number: 20230181662
    Abstract: Disclosed herein are a method of treating, reducing the risk of, preventing, or alleviating angiotensin converting enzyme 2 (ACE-2) associated state in a subject, comprising administering to the subject a therapeutically effective amount of Antrodia cinnamomea extract (Ant-Ex) or fraction 3 thereof (AE-F03). Also provided herein are uses of Ant-Ex or AE-F03 in reducing ACE-2 expression and manufacturing a drug or a food supplement for treating, reducing the risk of, preventing, or alleviating ACE-2 associated state.
    Type: Application
    Filed: April 27, 2021
    Publication date: June 15, 2023
    Applicant: ALPS BIOTECH CO., LTD.
    Inventors: Shui-Tein Chen, Kuo-Feng Hua
  • Publication number: 20220182546
    Abstract: The present disclosure discloses a camera control method, a device, a storage medium and an electronic equipment includes: detecting a change trend of a focus distance of a first camera operating in the foreground, determining a second camera corresponding to the change trend of the focus distance, activating the second camera in the background, and switching the second camera to operate in the foreground when the real-time focus distance of the first camera is within a focus distance interval of the second camera.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 9, 2022
    Inventor: Feng HUA
  • Patent number: 11173519
    Abstract: The present application discloses a method for making a rubber blade. The method includes applying a first coating composition and a second coating composition in separate steps on at least a part of a surface of a polyurethane elastic substrate; and solidifying the first coating composition and the second coating composition by ultraviolet light irradiating to form a hardened layer on the surface of the polyurethane elastic substrate. The first coating composition includes an isocyanate-group-terminated polyisocyanate and a first solvent. The second coating composition includes a first monomer, a photoinitiator, and a second solvent. The first monomer is at least one of an acrylate monomer and a methacrylate monomer each having an reactive hydroxyl group. The isocyanate group of the polyisocyanate is reacted with the reactive hydroxyl group of the first monomer to generate a urethane group to form a polyurethane acrylate. The present application also discloses a rubber blade.
    Type: Grant
    Filed: August 24, 2019
    Date of Patent: November 16, 2021
    Assignee: SHENZHEN FANCY CREATION INDUSTRIAL LIMITED
    Inventors: Hua Zhu, Hua Yang, Feng Hua, Hongnan Li, Naoyuki Ohmori
  • Publication number: 20200164404
    Abstract: The present application discloses a method for making a rubber blade. The method includes applying a first coating composition and a second coating composition in separate steps on at least a part of a surface of a polyurethane elastic substrate; and solidifying the first coating composition and the second coating composition by ultraviolet light irradiating to form a hardened layer on the surface of the polyurethane elastic substrate. The first coating composition includes an isocyanate-group-terminated polyisocyanate and a first solvent. The second coating composition includes a first monomer, a photoinitiator, and a second solvent. The first monomer is at least one of an acrylate monomer and a methacrylate monomer each having an reactive hydroxyl group. The isocyanate group of the polyisocyanate is reacted with the reactive hydroxyl group of the first monomer to generate a urethane group to form a polyurethane acrylate. The present application also discloses a rubber blade.
    Type: Application
    Filed: August 24, 2019
    Publication date: May 28, 2020
    Applicant: SHENZHEN FANCY CREATION INDUSTRIAL LIMITED
    Inventors: Hua ZHU, Hua YANG, Feng HUA, Hongnan LI, NAOYUKI OHMORI
  • Patent number: 10500188
    Abstract: The present invention discloses use of a polyenylpyrrole derivative in preparation of an anti-oral cancer drugs. The polyenylpyrrole derivative synthesized by polyvinylpyrrole, auxarconjugatin A and 12E-isorumbrin inhibits the cell proliferation, migration, tumor sphere formation abilities and xenograft tumorigenicity of oral cancer cells.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: December 10, 2019
    Assignee: Tzu Chi University
    Inventors: Jeng-Woei Lee, Chia-Chen Lau, Kuo-Feng Hua, Yulin Lam
  • Patent number: 10220481
    Abstract: A machine control system includes an input module, a worktable, a first sliding module, a second sliding module, a lathe feeding module, a lathe tool connected to the lathe feeding module, a milling feeding module, a milling cutter connected to the milling feeding module, and a control module. The control module is electrically connected to the input module, the worktable, the first sliding module, the second sliding module, the lathe feeding module, and the milling feeding module, wherein the input module inputs control parameters into the control module to control the first sliding module and the second sliding module. The lathe feeding module controls the lathe tool to slide along a third direction perpendicular to the first direction and the second direction reciprocally, and the milling feeding module controls the milling cutter to slide along the third direction and rotate along a first axis.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: March 5, 2019
    Assignee: FUXIANG PRECISION INDUSTRIAL (KUNSHAN) CO., LTD.
    Inventors: Ming-Lu Yang, Tian-En Zhang, Wei-Chuan Zhang, Jian-Shi Jia, Yang-Mao Peng, Jian Qu, Feng-Hua Chen, Zhen-Guang Xu, Jing-Shuang Sui, Da-Qing Zhuang, Jie Li, Yi Liu, Jian-Min Yu
  • Patent number: 10130647
    Abstract: The present invention discloses a new use of ginsenoside M1 for treating or preventing silicosis.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: November 20, 2018
    Assignee: SHEAU-LONG LEE
    Inventors: Sheau-Long Lee, Yu-Chieh Lee, Kuo-Feng Hua
  • Patent number: 10124017
    Abstract: The present invention discloses a new use of ginsenoside M1 for treating or preventing gout.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: November 13, 2018
    Inventors: Sheau-Long Lee, Yu-Chieh Lee, Kuo-Feng Hua
  • Publication number: 20180064740
    Abstract: The present invention discloses a new use of ginsenoside M1 for treating or preventing gout.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 8, 2018
    Applicant: WELLHEAD BIOLOGICAL TECHNOLOGY CORP.
    Inventors: Sheau-Long LEE, Yu-Chieh LEE, Kuo-Feng HUA
  • Publication number: 20180064741
    Abstract: The present invention discloses a new use of ginsenoside M1 for treating or preventing silicosis.
    Type: Application
    Filed: March 17, 2016
    Publication date: March 8, 2018
    Applicant: WELLHEAD BIOLOGICAL TECHNOLOGY CORP.
    Inventors: Sheau-Long LEE, Yu-Chieh LEE, Kuo-Feng HUA
  • Patent number: 9887796
    Abstract: The present disclosure discloses a method for configuring a node, device and system. The method includes that: a sending node encapsulates configuration information in a wavelength label information frame, wherein the configuration information is configured to configure a downstream node; and the sending node loads the wavelength label information frame to an optical signal, and sends the wavelength label information frame and the optical signal.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: February 6, 2018
    Assignee: ZTE Corporation
    Inventors: Feng Hua, Huitao Wang, Bailin Shen
  • Patent number: 9831945
    Abstract: Provided are methods, apparatuses and a system for monitoring a Reconfigurable Optical Add Drop Multiplexer (ROADM) optical network. The method includes: loading, in an optical signal at a sending end, a wavelength label frequency and attribute information of a channel used for transmitting the optical signal; sending the wavelength label frequency and/or the attribute information; receiving, at a monitoring end, the optical signal and acquiring, from the optical signal, the wavelength label frequency and/or the attribute information of the channel used for transmitting the optical signal; and monitoring the ROADM optical network according to the wavelength label frequency and/or the attribute information. The technical solution solves the technical problem in related art that the ROADM optical network cannot be effectively monitored, and achieves the effective monitoring of the ROADM optical network.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: November 28, 2017
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventors: Yingchun Shang, Feng Hua, Bailin Shen
  • Patent number: 9757824
    Abstract: A method for machining a metallic member to provide a finished appearance uses a lathe and a scraping process. A metallic member comprising a top portion and a peripheral sidewall is provided, the metallic member is positioned on the worktable. The worktable is rotated with the metallic member, the lathe tool moved backwards and forwards to machine the top portion of the rotary metallic member circumferentially. The lathe tool is moved by the moving device along a predetermined path relative to the worktable to machine curved surfaces of the top portion of the metallic member. The scraping cutter is moved to contact the peripheral sidewall of the metallic member. The scraping cutter is moved along a predetermined path, and the scraping cutter is fed the metallic member to achieve the required shape and finish.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: September 12, 2017
    Assignees: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO.,LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ming-Lu Yang, Tian-En Zhang, Wei-Chuan Zhang, Jian-Shi Jia, Yang-Mao Peng, Jian Qu, Feng-Hua Chen, Zhen-Guang Xu, Jing-Shuang Sui, Da-Qing Zhuang, Jie Li, Yi Liu, Jian-Min Yu
  • Patent number: 9718153
    Abstract: A method for machining a metallic member to provide a finished appearance, the method uses a lathe and a scraping process. A metallic member includes a top portion and a peripheral sidewall, is positioned on the worktable. The worktable is rotated with the metallic member, the lathe tool reciprocates to machine the top portion of the rotary metallic member circumferentially. The lathe tool is moved along a predetermined path relative to the worktable by the moving device to machine curved surfaces of the top portion of the metallic member. The scraping cutter is moved to contact the peripheral sidewall of the metallic member. The scraping cutter is moved along a predetermined path, and the scraping cutter is fed the metallic member to achieve the required shape and finish.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: August 1, 2017
    Assignees: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ming-Lu Yang, Tian-En Zhang, Wei-Chuan Zhang, Jian-Shi Jia, Yang-Mao Peng, Jian Qu, Feng-Hua Chen, Zhen-Guang Xu, Jing-Shuang Sui, Da-Qing Zhuang, Jie Li, Yi Liu, Jian-Min Yu