Abstract: A system can include a computer including a processor and a memory, the memory storing instructions executable by the processor to receive point cloud data. The instructions further include instructions to generate a plurality of feature maps based on the point cloud data, each feature map of the plurality of feature maps corresponding to a parameter of the point cloud data. The instructions further include instructions to aggregate the plurality of feature maps into an aggregated feature map. The instructions further include instructions to generate, via a feedforward neural network, at least one of a segmentation output or a classification output based on the aggregated feature map.

Abstract: Provided herein are methods for treating liver disorders, including non-alcoholic steatohepatitis (NASH), and symptoms and manifestations thereof, in a patient comprising administration of the SSAO inhibitor: or a pharmaceutically acceptable salt thereof.

Abstract: A method, computer system, and a computer program product for assessing energy consumption is provided. The present invention may include determining a first set of critical energy consumption units (ECUs) involved in a target production process, the pool of the critical ECUs being obtained based on a plurality of reference production processes. The present invention may then include determining a second set of critical ECUs involved in the candidate production process. The present invention may also include determining a first set of non-critical ECUs involved in the target production process, the pool of the non-critical ECUs being obtained based on the plurality of reference production processes. The present invention may then include determining, a second set of non-critical ECUs involved in the candidate production process. The present invention may further include determining the process similarity.

Abstract: A system for providing a gaming platform for a shared ride hail trip includes a processor programmed to determine a user game objective for a user requesting the shared ride hail trip, determine a ride hail provider objective associated with the shared ride hail trip, generate a ride hail route option based on the user game objective and the ride hail provider objective, and award game points based on user actions such as selecting routes that use transportation modes that mitigate deviation from faster roads or longer routes, or reduce need for operation of a larger vehicle during peak demand times. The system also awards points for user route choices that supports other passengers’ needs and goals such as time constraints, physical limitations, or conservation of time or vehicle emissions. The system may encourage user behaviors that enrich user experience, and achieve user physical fitness and societal goals.

Abstract: A method of manufacturing an electrical connector is provided. The method includes: providing a terminal and a strip, where the strip is connected to the terminal, and the terminal is formed with an elastic arm, a floating contact portion and a conducting portion; then, insert-molding an insulating block, such that the insulating block connects the elastic arm and the floating contact portion; separating the elastic arm and the floating contact portion; further cutting the strip to separate the terminal from the strip; and providing an insulating body, where the insulating body is formed with at least one accommodating slot running vertically therethrough, and inserting the terminal into the accommodating slot. When the electrical connector is mated, the elastic arm provides an elastic force such that the floating contact portion moves downward, and the floating contact portion and the conducting portion are directly electrically connected.

Abstract: An electrical connector includes an insulating body with multiple accommodating slots, and multiple terminals accommodated in the accommodating slots. Each terminal has an elastic arm, a floating contact portion and a conducting portion. The elastic arm and the floating contact portion are provided at an interval. One end of the elastic arm is connected with the floating contact portion through an insulating block. When each terminal is mated with a first electronic component and a second electronic component, the conducting portion is electrically connected to the first electronic component, the floating contact portion is electrically connected to the second electronic component, the elastic arm provides an elastic force such that the floating contact portion moves downward, and the floating contact portion and the conducting portion are directly electrically connected.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: An electrical connector is used to be electrically connected to a mating component. The electrical connector includes one or more shielding members, forming multiple receiving holes; and multiple terminals, including at least one signal terminal and at least one ground terminal correspondingly accommodated in the receiving holes. The ground terminal has a mating portion upward abutting the mating component, an elastic portion pressed vertically to elastically deform, and a positioning portion having a cross-section in a circular shape. The positioning portion and the shielding members are conductively connected to each other by at least three conductive portions, and the three conductive portions are provided to form a triangle. An insulating block is between the signal terminal and a corresponding shielding member to be accommodated in a corresponding receiving hole. The positioning portion with a circular cross-section has a larger area when the volume of the receiving hole remains unchanged.

Abstract: The present disclosure relates to Alkynylphenylbenzamide compounds and the applications thereof. The said Alkynylphenylbenzamide compounds have the structure shown in Formula (I). The compounds can be used as protein kinase inhibitors, which can effectively inhibit the activity of TRK protein kinase and the proliferation, migration and invasion of various tumor cells. At the same time, it has the characteristics of good pharmacokinetics and low toxicity.

Abstract: A method of manufacturing an electrical connector includes: providing a metal plate, and cutting the metal plate to form multiple base portions and pre-soldering areas; providing multiple conductive members, and soldering the conductive members to the pre-soldering areas; cutting and forming multiple elastic arms correspondingly according to locations of the conductive members in the pre-soldering areas as references, where a conductive terminal includes a base portion, at least one elastic arm and at least one conductive member; forming an insulating body on the conductive terminals by insert-molding, where the elastic arms and the conductive members are exposed from the insulating body; and forming the conductive terminals by cutting, where at least some of the conductive terminals are separated from each other and are not in contact with each other. The first electronic component and the second electronic component abut the elastic arms and the conductive members to deform and move.

Abstract: A method of manufacturing a curved-surface metal line is provided. A three-dimensional structure is formed with a metal member and then fixed together with an insulator. Alternatively, the metal member and the insulator are embedded-formed to jointly form the three-dimensional structure, or the metal member and the insulator are fixed together and then jointly form the three-dimensional structure. Then, a photoresist protection layer is formed outside the metal member, and a selective exposure treatment is performed such that corresponding locations of the photoresist protection layer being exposed is subject to a photochemical reaction. The photoresist protection layer is developed, and after the photoresist protection layer is partially dissolved, portions of the metal member at the corresponding locations are simultaneously exposed. The exposed portions of the metal member are etched, and residual portions of the photoresist protection layer are removed to form the metal line provided on the insulator.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: An electrical connector includes multiple conductive terminals respectively retained in multiple accommodating slots of an insulating body. Each conductive terminal includes a base portion, a connecting portion extending from one side of the base portion, a first elastic arm and a second elastic arm extending from the connecting portion toward a direction away from the same one side of the base portion, and at least one fixing portion extending from another side of the base portion. A width of the connecting portion is less than a width of the base portion and less than a width of a location of the first elastic arm near the connecting portion as well as a width of a location of the second elastic arm near the connecting portion. The fixing portion and the first elastic arm are respectively located at different sides of the base portion, thus achieving good elasticity and thinness.

Abstract: A switching LDMOS device is formed first well in a semiconductor substrate that includes an LDD region and a first body doped region; a first heavily doped region serving as a source region is provided in the LDD region, and a second heavily doped region serving as a drain region is provided in the first body doped region; a channel of the switching LDMOS device is formed at a surface layer of the semiconductor substrate between the LDD region and the body doped region and below the gate structure; and one side of the LDD region and one side of the body doped region which are away from the gate structure both are provided with a field oxide or STI, and one side of the field oxide or STI is in contact with the first heavily doped region or the second heavily doped region.

Abstract: A distributed industrial energy operation optimization platform which is capable of automatically constructing intelligent models and algorithms, is divided into three parts: a modeling terminal, a background service and a human-computer interface. The models like data pre-processing, energy generation-consumption-storage trend forecasting and optimal scheduling decision models are encapsulated in the modeling terminal as different visualization modules facing with multiple categories production scenarios, by dragging which the complex functional models can be realized conveniently. The background service is capable of automatically constructing the training samples and the production plans/manufacturing signals series according to the device model requirements of each edge side, interacts with the trained intelligent models through corresponding interfaces, and the computing results are saved in the specified relational database.

Abstract: A distributed industrial energy operation optimization platform which is capable of automatically constructing intelligent models and algorithms, is divided into three parts: a modeling terminal, a background service and a human-computer interface. The models like data pre-processing, energy generation-consumption-storage trend forecasting and optimal scheduling decision models are encapsulated in the modeling terminal as different visualization modules facing with multiple categories production scenarios, by dragging which the complex functional models can be realized conveniently. The background service is capable of automatically constructing the training samples and the production plans/manufacturing signals series according to the device model requirements of each edge side, interacts with the trained intelligent models through corresponding interfaces, and the computing results are saved in the specified relational database.

Abstract: A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. The ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Abstract: An electrical terminal includes a base, a first elastic arm and a second elastic arm formed side by side by extending upwardly from an upper end of the base, and a protruding portion. The first elastic arm has a mating portion, and the second elastic arm has a contact portion. The protruding portion protrudes and extends from a first side of the first elastic arm, and the first side of the first elastic arm is adjacent to the second elastic arm. A lower surface of the protruding portion has a contact surface overlapping with the contact portion in a vertical direction, such that the contact portion upwardly abuts the contact surface. When the chip module presses downwardly on the electrical terminal, the contact portion can move on the contact surface, such that the chip module does not need to press downwardly on the contact portion with a relatively large pressure.

Abstract: The present disclosure discloses a method for predicting oxygen load in iron and steel enterprises based on production plan, which relates to influencing factor extraction, neural network modeling and similar sequence matching technologies. The method uses the actual industrial operation data to first extract the relevant data such as the production plan and production performance of converter steel-making, analyze the influencing factors, and extract the main influencing variables of oxygen consumption. Then, the neural network prediction model of oxygen consumption of a single converter is established, the mean square error is taken as the evaluation index, and the predicting result of time granularity of a converter in the blowing stage is given. Finally, in combination with the information of smelting time and smelting duration of each device in the converter production plan, the prediction value of oxygen load in a planned time period is given.

Abstract: A wafer scale ultrasonic sensor assembly includes a wafer substrate, an ultrasonic element, first and second protective layers, conductive wires, a transmitting material, an ASIC, a conductive bump, and a soldering portion. The wafer substrate includes a via. The ultrasonic element is exposed to the via. The conductive wires are on the first protective layer and connected to the ultrasonic element. The second protective layer covers the conductive wires, and the second protective layer has an opening corresponding to the ultrasonic element. The transmitting material contacts the ultrasonic element. The ASIC is connected to the wafer substrate, so that the via forms a space between the ASIC and the ultrasonic element. The conductive pillar is in a via defined through the ASIC, the wafer substrate, and the first protective layer, and the conducive pillar is respectively connected to the conductive wires and the soldering portion.