Abstract: A thin film transistor includes an active layer located over a substrate, a first gate stack including a stack of a first gate dielectric and a first gate electrode and located on a first surface of the active layer, a pair of first contact electrodes contacting peripheral portions of the first surface of the active layer and laterally spaced from each other along a first horizontal direction by the first gate electrode, a second contact electrode contacting a second surface of the active layer that is vertically spaced from the first surface of the active layer, and a pair of second gate stacks including a respective stack of a second gate dielectric and a second gate electrode and located on a respective peripheral portion of a second surface of the active layer.

Abstract: A method of forming an integrated circuit, including forming a n-type doped well (N-well) and a p-type doped well (P-well) disposed side by side on a semiconductor substrate, forming a first fin active region extruded from the N-well and a second fin active region extruded from the P-well, forming a first isolation feature inserted between and vertically extending through the N-well and the P-well, and forming a second isolation feature over the N-well and the P-well and laterally contacting the first and the second fin active regions.

Abstract: The present disclosure describes a method for memory cell placement. The method can include placing a memory cell region in a layout area and placing a well pick-up region and a first power supply routing region along a first side of the memory cell region. The method also includes placing a second power supply routing region and a bitline jumper routing region along a second side of the memory cell region, where the second side is on an opposite side to that of the first side. The method further includes placing a device region along the second side of the memory cell region, where the bitline jumper routing region is between the second power supply routing region and the device region.

Abstract: A method of forming a semiconductor device includes providing a substrate including a circuit region and a well strap region, forming a mandrel extending from the circuit region to the well strap region, depositing mandrel spacers on sidewalls of the mandrel, removing the mandrel in the circuit region, while the mandrel in the well strap region remains intact, patterning the substrate with the mandrel spacers in the circuit region and the mandrel in the well strap region as an etch mask, thereby forming at least a first fin in the circuit region and a second fin in the well strap region, and epitaxially growing a first epitaxial feature over the first fin in the circuit region and a second epitaxial feature over the second fin in the well strap region. A width of the second fin is larger than a width of the first fin.

Abstract: A light sensor and a control method thereof are revealed. The light sensor comprises a first light-emitting element, a second light-emitting element and a light-sensing element. The first light-emitting element is used to generate a first emitting signal. The first emitting signal has an optical wavelength within a first wavelength range. The second light-emitting element is used to generate a second emitting signal. The wavelength of the second emitting signal has an optical wavelength within a second wavelength range. The first wavelength range is different from the second wavelength range. Thereby, a control circuit sequentially controls the first light-emitting element and the second light emitting-element to emit the first emitting signal and the second emitting signal.

Abstract: A light sensor and a control method thereof are disclosed. The light sensor comprises a light-emitting element, a first light-sensing unit and a second light-sensing unit. The light-emitting element generates an emission signal. The light-sensitive characteristic of the first light-sensing unit corresponds to a first wavelength range. The light-sensitive characteristic of the second light-sensing unit corresponds to a second wavelength range, which is different from the first wavelength range. In this way, when the emission signal is reflected by an object and received by the first light-sensing unit and the second light-sensing unit, the type of the object may be determined based on the difference between the signal sensed by the first light-sensing unit and the signal sensed by the second light-sensing unit.

Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.

Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.

Abstract: A module comprises a display element, a first polarizing element, a light sensor, a transparent layer, and a second polarizing element. The display element emits a display light source. The first polarizing element covers the display element, and blocks a first phase portion of the display light source and allows a second phase portion of the display light source to penetrate. The transparent layer covers the first polarizing element. The light sensor is disposed on one side of the display element or the first polarizing element. The second polarizing element is disposed between the light sensor and the transparent layer and blocks a second phase portion of the display light source.

Abstract: An optical sensing module for an electronic device is provided. The electronic device includes an opaque layer and an aperture formed on the opaque layer, wherein the optical sensing module includes an optical sensor; a light guide element, disposed between the opaque layer and the optical sensor and configured to guide light to the optical sensor through the aperture; and a diffusing layer, disposed between the opaque layer and the light guide element, configured to diffuse the light to the light guide element.

Abstract: This application provides a structure of the optical sensor, in which a photosensitive element is arranged on a substrate, a colloid layer is arranged on the upper part of the substrate and covers the photosensitive element, and a thin film is further arranged. The device includes an adhesive layer and a light-transmitting layer, the adhesive layer is disposed above one of the colloid layers, the light-transmitting layer is disposed above one of the adhesive layers, and the structure can be used to provide the film member that can be changed according to requirements The optical design reduces the production cost of the optical sensor; this application further provides a shielding layer between the film member and the colloid layer to improve the photosensitive efficiency of the optical sensor.

Abstract: An optical sensing method and an optical sensor module thereof. The optical sensing method includes obtaining an optical signal by sensing with a first optical sensor and a second optical sensor, respectively. The first optical sensor and the second optical sensor have different optical sensing wavelength ranges. Furthermore, a color temperature determination unit receives the optical signals of the first and second optical sensors and calculates a color temperature value by substituting an equation. In this way, the optical sensing method and its optical sensor module can obtain color temperature calculations with high accuracy and can effectively reduce the system computational complexity.

Abstract: The present application provides a light sensor module, which comprise a display element, a first polarizing element, a light sensor, a transparent layer, and a second polarizing element. The display element emits a display light source. The first polarizing element covers the display element, and blocks a first phase portion of the display light source and allows a second phase portion of the display light source to penetrate. The transparent layer covers the first polarizing element. The light sensor is disposed on one side of the display element or the first polarizing element. The second polarizing element is disposed between the light sensor and the transparent layer and blocks a second phase portion of the display light source.

Abstract: An optical sensing module for an electronic device is provided. The electronic device includes an opaque layer and an aperture formed on the opaque layer, wherein the optical sensing module includes an optical sensor; a light guide element, disposed between the opaque layer and the optical sensor and configured to guide light to the optical sensor through the aperture; and a diffusing layer, disposed between the opaque layer and the light guide element, configured to diffuse the light to the light guide element.

Abstract: A sensing module includes a first sensor, for sensing a light signal to generate a first sensing signal including a first crosstalk component related to a crosstalk signal in the light signal; a second sensor, for sensing the light signal to generate a second sensing signal including a second crosstalk component related to the crosstalk signal; and an arithmetic unit, for combining the first sensing signal and the second sensing signal according to a ratio between the first crosstalk component and the second crosstalk component, to generate an output signal; wherein a distance between the first sensor and a light source generating the light signal is different from a distance between the second sensor and the light source.

Abstract: A sensing module includes a first sensor, for sensing a light signal to generate a first sensing signal including a first crosstalk component related to a crosstalk signal in the light signal; a second sensor, for sensing the light signal to generate a second sensing signal including a second crosstalk component related to the crosstalk signal; and an arithmetic unit, for combining the first sensing signal and the second sensing signal according to a ratio between the first crosstalk component and the second crosstalk component, to generate an output signal; wherein a distance between the first sensor and a light source generating the light signal is different from a distance between the second sensor and the light source.

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

Abstract: A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed on a substrate. The optical barrier is disposed between the emitter and the detector for shielding the excess optical signal. A package material is used to completely cover the optical barrier, the emitter and the detector so that the optical barrier is completely disposed within the package material.

Abstract: A sensor includes a first reception unit configured for sensing a first signal of a first frequency band and a second reception unit configured for sensing a second signal of a second frequency band. There is a height difference between the first reception unit and the second reception unit.

Abstract: A light sensing device includes a substrate, a plurality of light sensing elements and a cover. The plurality of light sensing elements are disposed on the substrate for sensing light. The cover is utilized for sheltering the plurality of light sensing elements, wherein the cover includes a hole for passing the light. A set of the plurality of light sensing elements is selected to be enabled according to a location of the hole relative to the plurality of light sensing elements.