Abstract: An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic element, a photonic element, a first circuit structure, a second circuit structure and a heat-conducting layer. The electronic element has an active surface and a non-active surface opposite to the active surface. The first circuit structure is disposed between the electronic element and the photonic element and is electrically connected to the electronic element and the photonic element. The second circuit structure is electrically connected to the first circuit structure. The heat-conducting layer is formed between the non-active surface of the electronic element and the second circuit structure, and the second circuit structure is thermally coupled to the electronic element via the heat-conducting layer, thereby to improve heat dissipation efficiency of the electronic element during operation.

Abstract: A co-optical package and a manufacturing method thereof are provided. An electronic module includes a circuit structure, an electronic element and a photonic element. The circuit structure has a first side and a second side opposite to the first side. The electronic element is embedded in the circuit structure or disposed on the first side of the circuit structure. The photonic element having an optical active surface is embedded in the circuit structure and electrically connected to the electronic element. A portion of the circuit structure is removed from the first side to form an opening to expose the optical active surface of the photonic element. An optical element is disposed at the opening of the circuit structure and combined with the optical active surface of the photonic element. An encapsulation layer is formed on the first side of the circuit structure and covers the optical element.

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Abstract: An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic module including a carrier structure, at least one first electronic element disposed on a first side of the carrier structure, at least one second electronic element disposed on a second side of the carrier structure, and a plurality of conductive elements is stacked on a substrate via the plurality of conductive elements and a substrate frame, so as to increase an accommodation space between the electronic module and the substrate, thereby preventing the at least one second electronic element of the electronic module from colliding with the substrate.

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

Abstract: An electronic package is provided, in which a stacking component and a plurality of conductive pillars are embedded in a packaging layer, and a routing structure is formed on the packaging layer, where the stacking component is formed by stacking a first electronic module and a second electronic module on each other, and a plurality of first conductive vias and a plurality of second conductive vias are served as the electrical connection paths between the first electronic module and the second electronic module, such that the transmission distance of electrical signals between a first electronic element in the first electronic module and a second electronic element in the second electronic module can be reduced.

Abstract: An electronic package is provided, in which an electronic element that is electrically connected to a plurality of conductive vias and a functional part that has a hollow area are disposed on a photonic die that has the plurality of conductive vias and at least one external connection portion, where a cladding layer covers the electronic element and the functional part, such that the external connection portion is exposed from the hollow area and the cladding layer for an optical fiber to insert into the hollow area and connect to the external connection portion, so as to achieve the purpose of optoelectronic integration.

Abstract: An electronic package and manufacturing method thereof are provided, in which an electronic module served as a bridge element and a plurality of conductive pillars are embedded in a packaging layer, a routing structure is formed on the packaging layer, and a plurality of electronic elements are disposed on the routing structure, such that the electronic elements electrically bridge the electronic module via the routing structure.

Abstract: An electronic package is provided, in which a circuit structure is disposed on the uppermost side of a plurality of stacked organic material substrates for connecting an electronic element, so that a line width/line spacing of a redistribution layer of the circuit structure conforms with a line width/line spacing of the electronic element. Therefore, when the size specification of the electronic element is designed to be miniaturized, the redistribution layer configured in the circuit structure can effectively match the line spacing/line width of the electronic element, so as to meet the requirements of miniaturized packaging.

Abstract: A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.

Abstract: An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.

Abstract: An electronic package is provided, in which an electronic structure used as an integrated voltage regulator and a plurality of conductive pillars are embedded in an encapsulating layer to facilitate electrical transmission with electronic components at a close range.

Abstract: An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.