Abstract: A wireless expanding system includes an electronic device and a wireless expanding interface, and the wireless expanding interface is connected to the electronic device. The electronic device is configured to execute an operational procedure, and to generate an operational signal according to the operational procedure. The wireless expanding interface is configured to transmit the operational signal to a function expanding device. The function expanding device includes a displayer. When the displayer receives the operational signal via the wireless expanding interface, the displayer is configured to display an operational interface of the operational procedure.

Abstract: Electronic apparatus includes a display component, a base, a moveable case, and a transmission component. The display component includes a rotational shaft. The base is pivotally connected to the rotational shaft. The base has an opening. The moveable case is pivotally connected to the base. The moveable case can selectively cover or uncover the opening. The transmission component is disposed on the base. The transmission component is operatively connected between the rotational shaft and the moveable case. When the display component is rotated away from the base, the rotational shaft actuates the moveable case to rotate to uncover the opening through the transmission component. When the display component is rotated toward the base, the rotational shaft actuates the moveable case to rotate to cover the opening through the transmission component.

Abstract: Electronic apparatus includes a display component, a base, a moveable case, and a transmission component. The display component includes a rotational shaft. The base is pivotally connected to the rotational shaft. The base has an opening. The moveable case is pivotally connected to the base. The moveable case can selectively cover or uncover the opening. The transmission component is disposed on the base. The transmission component is operatively connected between the rotational shaft and the moveable case. When the display component is rotated away from the base, the rotational shaft actuates the moveable case to rotate to uncover the opening through the transmission component. When the display component is rotated toward the base, the rotational shaft actuates the moveable case to rotate to cover the opening through the transmission component.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A selective assembling type computing device includes a host computer and at least one peripheral device. The host computer has a first host external connection surface and a second host external connection surface, and the peripheral device has a first peripheral device external connected surface and a second peripheral device external connected surface. The peripheral device is provided for selectively assembling to the first host external connection surface or the second host external connection surface through assembling the second peripheral device external connected surface to the first host external connection surface or through assembling the first peripheral device external connected surface to the second host external connection surface. When the peripheral device is assembled to the host computer, the host computer detects the peripheral device to obtain at least one electrical operating parameter of the peripheral device to accordingly transmit a working power to the peripheral device.

Abstract: An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.

Abstract: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Abstract: An inputting mode switching method and system are provided. The inputting mode switching method is used to an inputting device. The inputting mode switching method comprising receiving a first inputting signal, wherein the first inputting signal is produced by the inputting device sensing a first touch; determining, according the first inputting signal, the first touch is sensed by a first touching unit and a second touching unit; switching a mirror mode for inputting where the first touch is sensed by the first touching unit and the second touching unit; and switching a normal mode or a gesture mode for inputting where the first touch is not sensed by the first touching unit and the second touching unit.

Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion. Each of the extending portions has a first surface facing the direction same as that of the pressing side and an oppositely disposed second surface. Each of the second ends has a fixing portion. At least one slot is formed between each of the extending portions and the pressing portion. The slot penetrates the first surface and the second surface. The shortest straight distance between each of the fixing portions and the pressing portion is smaller than or equal to the length extended from the first end to the second end of the extending portion.

Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

Abstract: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Abstract: A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

Abstract: An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.

Abstract: A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.

Abstract: A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source.