Patents by Inventor Feng-Kuan Chen

Feng-Kuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIGHT EMITTING DEVICE
    Publication number: 20140167598
    Abstract: Provided is a light emitting device including: a substrate; a light emitting diode chip; and a phosphor layer. The phosphor layer includes a first cover part and a second cover part; the first cover part is disposed on the top surface of the light emitting diode chip, and the second cover part covers the surface of the substrate at the peripheral area of the light emitting diode chip. Further, there is a height difference between the top surface of the second cover part and the top surface of the first cover part; the top surface of the second cover part is at a position lower than that of the top surface of the first cover part.
    Type: Application
    Filed: March 12, 2013
    Publication date: June 19, 2014
    Applicant: GENIUS ELECTRONIC OPTICAL CO., LTD.
    Inventors: Feng-Kuan CHEN, Yi- Jie HUANG, Lu- An CHEN
  • LED packaging method using a screen plate
    Patent number: 7892868
    Abstract: A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: February 22, 2011
    Assignee: Genius Electronic Optical Co., Ltd.
    Inventors: Ming-Yen Chen, Fan-Hsiu Wei, Feng-Kuan Chen, Sheau-Wen Wu, Yueh-Hsia Chiu
  • LED PACKAGING METHOD USING A SCREEN PLATE
    Publication number: 20100047935
    Abstract: A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed.
    Type: Application
    Filed: August 20, 2008
    Publication date: February 25, 2010
    Applicant: GENIUS ELECTRONIC OPTICAL CO.,LTD.
    Inventors: Ming-Yen CHEN, Fan-Hsiu Wei, Feng-Kuan Chen, Sheau-Wen Wu, Yueh-Hsia Chiu