Abstract: A foldable electronic device includes a first housing, a second housing, a pivot structure, a heat conducting member, a first heat pipe and a second heat pipe. The pivot structure pivotally connects the first housing to the second housing. The heat conducting member is disposed in the pivot structure. An end of the first heat pipe is pivotally connected to the heat conducting member and another end of the first heat pipe is fixed on the first housing. An end of the second heat pipe is pivotally connected to the heat conducting member and another end of the second heat pipe is fixed on the second housing.

Abstract: A heat sink includes multiple heat dissipating fins securely connected to each other and each heat dissipating fin having a board, a through hole defined through the board, a receiving space formed on an attachment on a side face of the board to communicate with the through hole, an adhesive heat conductive agent received in the receiving space and a heat conductive tube extending through aligned through holes of the heat dissipating fins, the adhesive heat conductive agent is so arranged in the receiving space that the adhesive heat conductive agent covers an outer periphery of the heat conductive tube and fills a gap between the heat conductive tube and the heat dissipating fins, thus engagement between the heat conductive tube and the heat dissipating fins is secured after the adhesive heat conductive agent has cooled and hardened.