Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a redistribution layer (RDL) module, a first semiconductor module, an interconnection module, a second semiconductor module and a molding material. The first semiconductor module is disposed on the RDL module. The interconnection module is disposed on the RDL module. The second semiconductor module is disposed on the interconnection module. The molding material covers the RDL module and surrounds the first semiconductor module and the second semiconductor module. A top surface of the first semiconductor module and a top surface of the second semiconductor module are exposed by the molding material.

Abstract: The present invention provides a method of alerting to stationary objects for vehicle. When a vehicle moves at a first speed, an optical scanning device, an infrared image extraction device, and an image extraction device extract a first optical scanning image, a first infrared image, and a first ambient image of the ambiance on one side of the vehicle. According to the fusion algorithm and the optical flow method, the first obstacle information of the first obstacle in the first image will be given. According to the location information of the first obstacle, the vehicle computer judges and generates an alert message when the relative distance is smaller than a distance threshold value and the obstacle volume is greater than a volume threshold value.

Abstract: The present application discloses an ultra-micro defect detection apparatus and a detection method thereof. The apparatus includes an imaging module, a light source module, a filtering module, and a mounting platform; the imaging module further includes a camera, an imaging lens, and an objective lens; the camera, the imaging lens, and the objective lens are sequentially and vertically arranged from top to bottom; the light source module further includes a collimator, a light source generator, and a beam splitting mirror; the light source generator is connected to the beam splitting mirror, and the collimator is mounted between the light source generator and the beam splitting mirror; the filtering module further includes a spatial filter, and the spatial filter is mounted between the imaging lens and the objective lens.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A lithium battery power display method and corresponding system, the method includes: during charging process of lithium battery, periodically calculating SOC value charged in this charging through a current integration method (S10); obtaining a sum of the SOC value displayed before charging and the SOC value charged, determining whether it is in a predetermined charging platform area (S11); when determination result is in the predetermined charging platform area and it is determined the correction trigger condition is met, a correction coefficient is calculated according to pre-calibrated formula, the SOC value to be displayed is obtained by correcting the SOC value charged with the correction coefficient, the correction coefficient is positive number less than 1 (S12); displaying the SOC value to be displayed (S13). Solve virtual electricity caused by large SOC error in non-full charge and discharge state of lithium batteries, improve experience of lithium battery electric vehicles.

Abstract: Provided is a method for treating a disease in which Hic-5 participates. A composition comprising a Hic-5 inhibitor, said composition being for treating a disease selected from among cardiomegaly, interstitial pneumonia, osteoarthritis, fatty liver and tumor, or for inhibiting vascular invasion of cancer cells.

Abstract: A method for detecting optical film defects based on differential interference, comprising: an incident light is adjusted into a planar light wave, and the surface of an optical film to be detected is adjusted to be perpendicular to the planar light wave; the planar light wave sequentially passes through a diaphragm, the optical film, a first collimating lens and a lenticular lens, and then form two parallel outgoing beams by differential interference; the two parallel outgoing beams pass through a second collimating lens to form a differential interference image on a photodetector; and the differential interference image is analyzed to detect both superficial and internal defects of the optical film.

Abstract: A method for detecting optical film defects based on differential interference, comprising: an incident light is adjusted into a planar light wave, and the surface of an optical film to be detected is adjusted to be perpendicular to the planar light wave; the planar light wave sequentially passes through a diaphragm, the optical film, a first collimating lens and a lenticular lens, and then form two parallel outgoing beams by differential interference; the two parallel outgoing beams pass through a second collimating lens to form a differential interference image on a photodetector; and the differential interference image is analyzed to detect both superficial and internal defects of the optical film.

Abstract: An asymmetric optical interferometry method, comprises the following steps: an incident light is split into two beams, and the two beams are respectively projected onto a surface of an object to be tested and a reference mirror; and then respectively pass through a first imaging lens having a larger area on the side of the object, and a second imaging lens having a smaller area on the side of the reference mirror, and overlap on a photoelectric sensor after passing through a third imaging lens to form at least one interference image (S1); the corresponding interference image is input into a computer to obtain a signal of the corresponding interference image (S2); parse the signal of the corresponding interference image to obtain a three-dimensional shape (S3) of the surface of the object. Also provide an asymmetric optical interferometry device.

Abstract: An asymmetric optical interferometry method, comprises the following steps: an incident light is split into two beams, and the two beams are respectively projected onto a surface of an object to be tested and a reference mirror; and then respectively pass through a first imaging lens having a larger area on the side of the object, and a second imaging lens having a smaller area on the side of the reference mirror, and overlap on a photoelectric sensor after passing through a third imaging lens to form at least one interference image (S1); the corresponding interference image is input into a computer to obtain a signal of the corresponding interference image (S2); parse the signal of the corresponding interference image to obtain a three-dimensional shape (S3) of the surface of the object. Also provide an asymmetric optical interferometry device.

Abstract: The invention discloses a steering device of scooter and a scooter.

Abstract: A light emitting diode includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode, a transparent conductive layer, a second electrode and a metal grating. The first semiconductor layer, the active layer, and the second semiconductor layer are orderly stacked on the substrate. The first electrode is electrically connected to the first semiconductor layer. The transparent conductive layer is located on a surface of the second semiconductor layer away from the substrate. The second electrode is electrically connected to the transparent conductive layer. The metal grating is located on a surface of the transparent conductive layer away from the substrate. The metal grating is a two-dimensional array of a plurality of metal micro-structures.

Abstract: A light emitting diode includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a first electrode, a transparent conductive layer, a second electrode and a metal grating. The first semiconductor layer, the active layer, and the second semiconductor layer are orderly stacked on the substrate. The first electrode is electrically connected to the first semiconductor layer. The transparent conductive layer is located on a surface of the second semiconductor layer away from the substrate. The second electrode is electrically connected to the transparent conductive layer. The metal grating is located on a surface of the transparent conductive layer away from the substrate. The metal grating is a two-dimensional array of a plurality of metal micro-structures.

Abstract: An electrical connector comprises an insulative housing and a plurality of terminals. The insulative housing defines a mating face, an end face parallel to the mating face, a mounting face perpendicular to the end face, a first receiving port and a second receiving port extending along a longitudinal direction perpendicular to a direction from the end face to the mating face with a plurality of receiving passageways therein. The plurality of terminals are assembled to the receiving passageways of the first receiving port and the second receiving port of the insulative housing respectively. Each terminal comprises a retaining portion securely retained with the insulative housing, a contacting portion extending forwardly from the retaining portion, a buffering portion extending backwardly from the retaining portion, a tail portion extending parallel to the mating face and a substantial upright portion interconnecting with the buffering portion and the tail portion.

Abstract: An electrical connector comprises an insulative housing and a plurality of terminals. The insulative housing defines a mating face, an end face parallel to the mating face, a mounting face perpendicular to the end face, a first receiving port and a second receiving port extending along a longitudinal direction perpendicular to a direction from the end face to the mating face with a plurality of receiving passageways therein. The plurality of terminals are assembled to the receiving passageways of the first receiving port and the second receiving port of the insulative housing respectively. Each terminal comprises a retaining portion securely retained with the insulative housing, a contacting portion extending forwardly from the retaining portion, a buffering portion extending backwardly from the retaining portion, a tail portion extending parallel to the mating face and a substantial upright portion interconnecting with the buffering portion and the tail portion.

Abstract: A communication method for a mobile terminal to perform seamless handover between a WWAN and a WLAN, comprising steps of: receiving a registration message sent by said mobile terminal when it enters said WLAN, wherein said registration message at least contains a WLAN address that said mobile terminal acquires when entering said WLAN; establishing the mapping relationship between said MAN address and said WLAN address of said mobile terminal according to said registration message; encapsulating said WLAN address into the data information to be sent to said mobile terminal according to said mapping relationship when receiving the data information to be sent to said mobile terminal from a source address; and sending the data information containing said WLAN address to said mobile terminal via said WLAN.