Patents by Inventor Feng-Lun CHEN

Feng-Lun CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240080180
    Abstract: The federated learning system includes a moderator and client devices. Each client device performs a method for verifying model update as follows: receiving a hash function and a general model; training a client model according to the general model and raw data; calculating a difference as an update parameter between the general model and the client model, sending the update parameter to the moderator; inputting the update parameter to the hash function to generate a hash value; sending the hash value to other client devices, and receiving other hash values; summing all the hash values to generate a trust value; receiving an aggregation parameter calculated according to the update parameters; inputting the aggregation parameter to the hash function to generate a to-be-verified value; and updating the client model according to the aggregation parameter when the to-be-verified value equals the trust value.
    Type: Application
    Filed: December 20, 2022
    Publication date: March 7, 2024
    Inventors: Chih-Fan HSU, Wei-Chao CHEN, Jing-Lun Huang, Ming-Ching Chang, Feng-Hao Liu
  • Publication number: 20230410851
    Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.
    Type: Application
    Filed: July 31, 2023
    Publication date: December 21, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki MORI, Chien-Chi TIEN, Chia-En HUANG, Hidehiro FUJIWARA, Yen-Huei CHEN, Feng-Lun CHEN
  • Patent number: 11715501
    Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: August 1, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Chien-Chi Tien, Chia-En Huang, Hidehiro Fujiwara, Yen-Huei Chen, Feng-Lun Chen
  • Publication number: 20220328077
    Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki MORI, Chien-Chi TIEN, Chia-En HUANG, Hidehiro FUJIWARA, Yen-Huei CHEN, Feng-Lun CHEN
  • Patent number: 11398257
    Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: July 26, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Haruki Mori, Chien-Chi Tien, Chia-En Huang, Hidehiro Fujiwara, Yen-Huei Chen, Feng-Lun Chen
  • Publication number: 20210201961
    Abstract: Header circuitry for a memory device includes multiple backside power rails that form distinct voltage sources for a plurality of switching devices in the header circuitry. The header circuitry includes at least one region of a first conductivity type. A first section in the first region includes one backside power rail (BPR) that forms a first voltage source that provides a first voltage. A second section in the same first region includes another BPR that forms a second voltage source that provides a second voltage that is different from the first voltage.
    Type: Application
    Filed: October 30, 2020
    Publication date: July 1, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki MORI, Chien-Chi TIEN, Chia-En HUANG, Hidehiro FUJIWARA, Yen-Huei CHEN, Feng-Lun CHEN