Abstract: An electrically interconnected mass includes elongated structures. The elongated structures are electrochemically active and at least some of the elongated structures cross over each other to provide intersections and a porous structure. The elongated structures include doped silicon.

Abstract: A method of fabricating fibres of silicon or silicon-based material comprises the steps of etching pillars on a substrate and detaching them. A battery anode can then be created by using the fibres as the active material in a composite anode electrode.

Abstract: A process for etching silicon to form silicon pillars on the etched surfaces, includes treating silicon with an etching solution that includes 5 to 10M HF 0.01 to 0.1M Ag+ ions and 0.02 to 0.2M NO3? ions. Further, NO3? ions in the form of alkali metal, nitric acid or ammonium nitrate salt is added to maintain the concentration of nitrate ions within the above range. The etched silicon is separated from the solution. The process provides pillars, especially for use as the active anode material in lithium ion batteries. The process is advantageous because it uses an etching bath containing only a small number of ingredients whose concentration needs to be controlled and it can be less expensive to operate than previous processes.

Abstract: A process of etching silicon includes treating silicon, e.g. granules or bulk material, with an etching solution, including HF, Ag+ ions and nitrate ions thereby etching the silicon to form silicon having etched pillars on its surface, which silicon includes a surface deposit of silver. The etched silicon is then separated from the spent etching solution. The silver from the etched silicon is dissolved using nitric acid to form a solution containing Ag+ ions and nitrate ions. The solution containing Ag+ ions and nitrate ions is mixed with further HF to form a further etching solution. The further etching solution is used to treat further silicon. The pillars may be used as an anode material in a Li-ion battery.

Abstract: A method is described of selectively etching a silicon substrate in small local areas in order to form columns or pillars in the etched surface. The silicon substrate is held in an etching solution of hydrogen fluoride, a silver salt and an alcohol. The inclusion of the alcohol provides a greater packing density of the silicon columns.

Abstract: A method of fabricating fibres of silicon or silicon-based material comprises the steps of etching pillars on a substrate and detaching them. A battery anode can then be created by using the fibres as the active material in a composite anode electrode.

Abstract: A phase discriminator for being used in a phase-locked loop to determine if a phase difference between a reference signal and a target signal has reached a programmable gap value is disclose which comprises a programmable phase gap selector receiving the reference signal, a first phase digital converter converting an output signal from the programmable phase gap selector to a first digital code, a second phase digital converter converting a phase difference between the target signal and the reference signal to a second digital code, and a code comparator comparing the first and second digital code and generating a first instructional signal based on a change of order of the values of the first and second digital code.

Abstract: A phase discriminator for being used in a phase-locked loop to determine if a phase difference between a reference signal and a target signal has reached a programmable gap value is disclose which comprises a programmable phase gap selector receiving the reference signal, a first phase digital converter converting an output signal from the programmable phase gap selector to a first digital code, a second phase digital converter converting a phase difference between the target signal and the reference signal to a second digital code, and a code comparator comparing the first and second digital code and generating a first instructional signal based on a change of order of the values of the first and second digital code.

Abstract: A structure of a CMOS image sensory device is described. A photodiode sensory region and a transistor device region are isolated from each other by an isolation layer formed in the substrate. A gate structure is located on the transistor device region, and a source/drain region is in the transistor device region beside the side of the gate structure. A doped region is in the photodiode sensory region. A self-aligned block is located on the photodiode sensory region and a protective layer is formed on the entire substrate.

Abstract: A multi-selection prescaler for dividing an input signal according to a ratio to obtain a desired frequency. The circuit has of a plurality of logic gates and D-flip-flops: a first frequency divider for receiving an input signal and generating a divided frequency; a second frequency divider connected to the first frequency divider for performing a further frequency division based on a selection switch having a plurality of selection signals and a plurality of AND gates; a module control for performing a logic operation on the selection signals and an external control signal (MC) by OR gates and being connected to the first frequency divider to control the divided frequency of the first frequency divider; and an output selection circuit connected to the second frequency divider for selecting output signal according to the selection signals.

Abstract: A fabrication method for a CMOS image sensory device is described. An isolation layer is formed in the substrate to isolate a photodiode sensory region and a transistor device region. A gate structure is further formed on the transistor device region, followed by forming concurrently a source/drain region in the transistor device region beside the side of the gate structure and a doped region in the photodiode sensory region. Thereafter, a self-aligned block is formed on the photodiode sensory region, followed by forming a protective layer on the substrate.

Abstract: A plurality of active pixel sensors are formed on the surface of a semiconductor wafer. The semiconductor wafer comprises a P-type substrate, an active pixel sensor region and a periphery circuit region. A first active pixel sensor block mask (APSB mask) is formed to cover the active pixel sensor region, then at least one N-well on the surface of the semiconductor wafer not covered by the first APSB mask is formed. A second APSB mask and at least one N-well mask are formed to cover the active pixel sensor region and the region outside the P-well region. At least one P-well on the surface of the semiconductor wafer not covered by the second APSB mask and the N-well mask is formed. Finally, at least one photodiode and at least one complementary metal-oxide semiconductor (CMOS) transistor are formed on the surface of the active pixel sensor region.

Abstract: A plurality of active pixel sensors are formed on the surface of a semiconductor wafer. The semiconductor wafer comprises a P-type substrate, an active pixel sensor region and a periphery circuit region. A first active pixel sensor block mask (APSB mask) is formed to cover the active pixel sensor region, then at least one N-well on the surface of the semiconductor wafer not covered by the first APSB mask is formed. A second APSB mask and at least one N-well mask are formed to cover the active pixel sensor region and the region outside the P-well region. At least one P-well on the surface of the semiconductor wafer not covered by the second APSB mask and the N-well mask is formed. Finally, at least one photodiode and at least one complementary metal-oxide semiconductor (CMOS) transistor are formed on the surface of the active pixel sensor region.

Abstract: A structure of a CMOS image sensory device is described. A photodiode sensory region and a transistor device region are isolated from each other by an isolation layer formed in the substrate. A gate structure is located on the transistor device region, and a source/drain region is in the transistor device region beside the side of the gate structure. A doped region is in the photodiode sensory region. A self-aligned block is located on the photodiode sensory region and a protective layer is formed on the entire substrate.

Abstract: A fabrication method for a CMOS image sensory device is described. An isolation layer is formed in the substrate to isolate a photodiode sensory region and a transistor device region. A gate structure is further formed on the transistor device region, followed by forming concurrently a source/drain region in the transistor device region beside the side of the gate structure and a doped region in the photodiode sensory region. Thereafter, a self-aligned block is formed on the photodiode sensory region, followed by forming a protective layer on the substrate.

Abstract: The present invention is a method for integrating an anti-reflection layer and a salicide block. The method comprises the following steps: A substrate is provided that is divided into at least a sensor area and a transistor area, wherein the sensor area comprises a doped region and the transistor area comprises a transistor that includes a gate, a source and a drain; forming a composite layer on the substrate, wherein the composite layer at least also covers both the sensor area and the transistor area, and the composite layer increases the refractive index of light that propagates from the doped region into the composite layer; performing an etching process and a photolithography process to remove part of the composite layer and to let top of the gate, the source and the drain are not covered by the composite layer; and performing a salicide process to let top of the gate, the source and the drain are covered by a silicate.

Abstract: The present invention is a method for integrating an anti-reflection layer and a salicide block. The method comprises following steps: provide a substrate that is divided into at least a sensor area and a transistor area, wherein the sensor area comprises a doped region and the transistor area comprises a transistor that includes a gate, a source and a drain; forms a composite layer on the substrate, herein the composite layer at least also covers both sensor area and transistor area, and the composite layer increases refractive index of light that propagate from the doped region into the composite layer; performs an etching process and a photolithography process to remove part of the composite layer and to let top of the gate, the source and the drain are not covered by the composite layer; and performs a salicide process to let top of the gate, the source and the drain are covered by a silicate.

Abstract: The present invention is a method for integrating an anti-reflection layer and a salicide block. The method comprises following steps: provide a substrate that is divided into at least a sensor area and a transistor area, wherein the sensor area comprises a doped region and the transistor area comprises a transistor that includes a gate, a source and a drain; forms a composite layer on the substrate, herein the composite layer at least also covers both sensor area and transistor area, and the composite layer increases refractive index of light that propagate from the doped region into the composite layer; performs an etching process and a photolithography process to remove part of the composite layer and to let top of the gate, the source and the drain are not covered by the composite layer; and performs a salicide process to let top of the gate, the source and the drain are covered by a silicate.

Abstract: A process for fabricating a mixed signal integrated circuit on a substrate, wherein the substrate is partially covered with a field oxide layer. An oxide layer is formed over a portion of the substrate, wherein the portion of the substrate is not covered with the field oxide layer. First impurities are implanted into the substrate, wherein the first impurities damage the oxide layer. A buffer layer is formed over the oxide layer. A polysilicon layer is formed over the buffer layer. Second impurities are implanted into the polysilicon layer, wherein the buffer layer prevents the oxide layer form being damaged by the second impurities. The polysilicon layer is etched to remove the polysilicon layer, wherein the buffer layer prevents the oxide layer and the substrate from being etched. The portion of buffer layer and the damaged oxide layer over the substrate are removed. The gate oxide layer is formed over the substrate.