Abstract: A method for monitoring a process in a semiconductor processing facility and a monitor system are provided. A plurality of wafers are processed according to a process. Data on the processing is collected, and the collecting includes, for each wafer of the plurality of wafers, determining that a processing event has occurred, and recording a time associated with the processing event. An amount of time between the recorded times is calculated for consecutively processed wafers. A set of control limits for the process is determined based on the calculated amounts of time. The set of control limits define a range of acceptable values for the amount of time. Second wafers are processed according to the process. A problem in the processing of the second wafers is identified based on the set of control limits. The problem is identified as the second wafers are being processed.

Abstract: A method comprises transferring a wafer carrier to or from an overhead hoist transfer (OHT) system using a conveyor. The method also comprises transferring the wafer carrier between the conveyor and an overhead shuttle (OHS) system using a cross-system transport apparatus. The method further comprises generating control signals using a controller to control at least one of the cross-system transport apparatus, the conveyor, or the loading or unloading of the wafer carrier at the OHT or the OHS. The cross-system transport apparatus comprises a lifting device configured to raise or lower the wafer carrier. The transferring of the wafer carrier between the conveyor and the OHS system comprises one or more of lifting or lowering the wafer carrier.

Abstract: A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.

Abstract: A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality of storage spaces. The output-relay shelf has a plurality of first output-relay spaces. The output shelf has an output space. The controller is configured to drive the first crane to preferentially transfer a first wafer carrier stored in one of the storage spaces to an empty one of the first output-relay spaces according to a delivery command defining a high priority of the first wafer carrier, and configured to drive the second crane to preferentially transfer the first wafer carrier from the first output-relay space storing the first wafer carrier to the output space according to the delivery command if the output space is empty.

Abstract: A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality of storage spaces. The output-relay shelf has a plurality of first output-relay spaces. The output shelf has an output space. The controller is configured to drive the first crane to preferentially transfer a first wafer carrier stored in one of the storage spaces to an empty one of the first output-relay spaces according to a delivery command defining a high priority of the first wafer carrier, and configured to drive the second crane to preferentially transfer the first wafer carrier from the first output-relay space storing the first wafer carrier to the output space according to the delivery command if the output space is empty.

Abstract: A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.

Abstract: A method comprises transferring a wafer carrier to or from an overhead hoist transfer (OHT) system using a conveyor. The method also comprises transferring the wafer carrier between the conveyor and an overhead shuttle (OHS) system using a cross-system transport apparatus. The method further comprises generating control signals using a controller to control at least one of the cross-system transport apparatus, the conveyor, or the loading or unloading of the wafer carrier at the OHT or the OHS. The cross-system transport apparatus comprises a lifting device configured to raise or lower the wafer carrier. The transferring of the wafer carrier between the conveyor and the OHS system comprises one or more of lifting or lowering the wafer carrier.

Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.

Abstract: A method for monitoring a process in a semiconductor processing facility and a monitor system are provided. A plurality of wafers are processed according to a process. Data on the processing is collected, and the collecting includes, for each wafer of the plurality of wafers, determining that a processing event has occurred, and recording a time associated with the processing event. An amount of time between the recorded times is calculated for consecutively processed wafers. A set of control limits for the process is determined based on the calculated amounts of time. The set of control limits define a range of acceptable values for the amount of time. Second wafers are processed according to the process. A problem in the processing of the second wafers is identified based on the set of control limits. The problem is identified as the second wafers are being processed.

Abstract: A system for managing semiconductor production includes a conveyor to convey a wafer carrier to or from an overhead hoist transfer system. The system also includes a cross-system transport apparatus to transfer the wafer carrier between the conveyor and an overhead shuttle system.

Abstract: A system for managing semiconductor production includes a conveyor to convey a wafer carrier to or from an overhead hoist transfer system. The system also includes a cross-system transport apparatus to transfer the wafer carrier between the conveyor and an overhead shuttle system.

Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.

Abstract: A system comprising a conveyor. A semiconductor processing tool has a lifter port. The tool is positioned near the conveyor, such that the lifter port is configured to transport a Front Opening Unified Pod (FOUP) between the conveyor and the lifter port. An upstream stocker and a downstream stocker are both co-located with the conveyor and the tool. The upstream and downstream stockers each have a respective storage space for the FOUP and a respective robotic device configured to transport the FOUP between its respective storage space and the conveyor. The upstream stocker is configured to receive the FOUP from an overhead transport (OHT) and deliver the FOUP to the conveyor. The downstream stocker is configured to receive the FOUP from the conveyor and deliver the FOUP to the OHT.

Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.