Patents by Inventor FENG PING

FENG PING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11745732
    Abstract: A method for certified control of a self-driving ego vehicle is described. The method includes analyzing a safety situation of the self-driving ego vehicle to determine a proposed vehicle control action using a main controller of the self-driving ego vehicle. The method also includes presenting, by the main controller, the proposed vehicle control action to an interlock controller, including a certificate of the proposed vehicle control action. The method further includes checking a safety certification evidence from the certificate by the interlock controller using a predefined safety argument to verify the safety certification evidence of the certificate. The method also includes directing, by a low-level controller, the self-driving ego vehicle to perform a certified vehicle control action.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: September 5, 2023
    Assignees: TOYOTA RESEARCH INSTITUTE, INC., MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Daniel Jackson, Jonathan Decastro, Soon Ho Kong, Nikos Arechiga Gonzalez, Dimitrios Koutentakis, Feng Ping Angela Leong, Mike Meichang Wang, Xin Zhang
  • Publication number: 20230155238
    Abstract: A battery accommodating member includes a housing, a battery placement portion, an electrical connecting portion, at least one first engaging structure and at least one second engaging structure. The housing has a first surface, a second surface and a plurality of side surfaces. The first surface is opposite to the second surface, and the side surfaces are connected between the first and second surfaces. The battery placement portion is formed in the housing and penetrates from the first surface to the second surface, and a battery is partially accommodated therein. The electrical connecting portion is formed in the first surface, and a conductive sheet is disposed at the electrical connection portion to electrically connect the battery. The first engaging structure is disposed on one side surface, and the second engaging structure is disposed on another side surface. A battery module and a battery fixing structure are also provided.
    Type: Application
    Filed: January 11, 2022
    Publication date: May 18, 2023
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Ting Hsuan Lin, Jen Chieh Cheng, Feng-Ping Chang
  • Patent number: 11405710
    Abstract: An earphone case includes a body, a storage member, a cover, and a reset member. The body has a chamber and a fixing base. The base is securely disposed in the chamber. The storage member is disposed in the chamber, located above the fixing base, contacted with the body, and has multiple first magnetic parts. The cover is pivotally connected to the storage member and the fixing base, and the cover has multiple second magnetic parts. The reset member is disposed above the fixing base and connected to the body and the storage member respectively. In close mode, the cover completely covers the storage member. The multiple first magnetic parts and second magnetic parts are magnetically attracted to each other. In open mode, the cover is relatively separated from the storage member and rotated at an angle, such that the cover partially overlaps with the storage member.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 2, 2022
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jia-Xin Lin, Wei-Hao Tu, Feng-Ping Chang
  • Patent number: 11258220
    Abstract: A positioning structure includes a first positioning component and a second positioning component. The first positioning component includes a first arched positioning portion having a first arched positioning surface. The second positioning component is disposed at one side of the first positioning component, wherein the second positioning component includes a second arched positioning portion having a second arched positioning surface. The second positioning component is configured to rotate relative to the first positioning component, such that the second arched positioning portion is moved to one side of the first arched positioning portion. The second arched positioning surface abuts against the first arched positioning surface, such that a degree of freedom of movement of the second positioning component in a direction is restricted by the first positioning component. An energy storage device is also provided.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: February 22, 2022
    Assignee: Merry Electronics (Shenzhen) Co., Ltd.
    Inventors: Wen-Chung Lee, Hsiang-Sen Chang, Feng-Ping Chang
  • Publication number: 20210029433
    Abstract: An earphone case includes a body, a storage member, a cover, and a reset member. The body has a chamber and a fixing base. The base is securely disposed in the chamber. The storage member is disposed in the chamber, located above the fixing base, contacted with the body, and has multiple first magnetic parts. The cover is pivotally connected to the storage member and the fixing base, and the cover has multiple second magnetic parts. The reset member is disposed above the fixing base and connected to the body and the storage member respectively. In close mode, the cover completely covers the storage member. The multiple first magnetic parts and second magnetic parts are magnetically attracted to each other. In open mode, the cover is relatively separated from the storage member and rotated at an angle, such that the cover partially overlaps with the storage member.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 28, 2021
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Jia-Xin Lin, Wei-Hao Tu, Feng-Ping Chang
  • Publication number: 20210009114
    Abstract: A method for certified control of a self-driving ego vehicle is described. The method includes analyzing a safety situation of the self-driving ego vehicle to determine a proposed vehicle control action using a main controller of the self-driving ego vehicle. The method also includes presenting, by the main controller, the proposed vehicle control action to an interlock controller, including a certificate of the proposed vehicle control action. The method further includes checking a safety certification evidence from the certificate by the interlock controller using a predefined safety argument to verify the safety certification evidence of the certificate. The method also includes directing, by a low-level controller, the self-driving ego vehicle to perform a certified vehicle control action.
    Type: Application
    Filed: November 26, 2019
    Publication date: January 14, 2021
    Applicants: TOYOTA RESEARCH INSTITUTE, INC., MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Daniel JACKSON, Jonathan DECASTRO, Soon Ho KONG, Nikos ARECHIGA GONZALEZ, Dimitrios KOUTENTAKIS, Feng Ping Angela LEONG, Mike Meichang WANG, Xin ZHANG
  • Patent number: 10643963
    Abstract: A semiconductor structure and its fabrication method are provided. The fabrication method includes: providing a base substrate including a wiring region and an isolation region. A patterned layer is formed on the isolation region of the base substrate and the patterned layer exposes the wiring region of the base substrate. After forming the patterned layer, a redistribution layer is formed on the wiring region of the based substrate exposed by the patterned layer. A protective layer is formed on the redistribution layer, and after forming the protective layer, the patterned layer is removed.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: May 5, 2020
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Feng Ping Cai
  • Publication number: 20190181601
    Abstract: A positioning structure includes a first positioning component and a second positioning component. The first positioning component includes a first arched positioning portion having a first arched positioning surface. The second positioning component is disposed at one side of the first positioning component, wherein the second positioning component includes a second arched positioning portion having a second arched positioning surface. The second positioning component is configured to rotate relative to the first positioning component, such that the second arched positioning portion is moved to one side of the first arched positioning portion. The second arched positioning surface abuts against the first arched positioning surface, such that a degree of freedom of movement of the second positioning component in a direction is restricted by the first positioning component. An energy storage device is also provided.
    Type: Application
    Filed: November 7, 2018
    Publication date: June 13, 2019
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Wen-Chung Lee, Hsiang-Sen Chang, Feng-Ping Chang
  • Publication number: 20180374806
    Abstract: A semiconductor structure and its fabrication method are provided. The fabrication method includes: providing a base substrate including a wiring region and an isolation region. A patterned layer is formed on the isolation region of the base substrate and the patterned layer exposes the wiring region of the base substrate. After forming the patterned layer, a redistribution layer is formed on the wiring region of the based substrate exposed by the patterned layer. A protective layer is formed on the redistribution layer, and after forming the protective layer, the patterned layer is removed.
    Type: Application
    Filed: June 20, 2018
    Publication date: December 27, 2018
    Inventor: Feng Ping CAI
  • Publication number: 20160255721
    Abstract: A printed circuit board precursor includes a substrate, a catalytic layer, a conductive layer, and a metal layer. The substrate has a top surface, a bottom surface, and a wall defining a channel, and the channel completely penetrates through the substrate from the top surface to the bottom surface. The catalytic layer is formed on the top surface, the bottom surface, and the wall of the substrate. The conductive layer is attached to and covers the catalytic layer. The metal layer is disposed on the conductive layers and filled in the channel.
    Type: Application
    Filed: May 9, 2016
    Publication date: September 1, 2016
    Inventors: CHIEN-HWA CHIU, CHIH-MIN CHAO, PEIR-RONG KUO, CHIA-HUA CHIANG, CHIH-CHENG HSIAO, FENG-PING KUAN, YING-WEI LEE, WEI-CHENG LEE
  • Patent number: 9386709
    Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: July 5, 2016
    Assignee: ICHIA TECHNOLOGIES, INC.
    Inventors: Chien-Hwa Chiu, Chih-Min Chao, Peir-Rong Kuo, Chia-Hua Chiang, Chih-Cheng Hsiao, Feng-Ping Kuan, Ying-Wei Lee, Wei-Cheng Lee
  • Patent number: 9326374
    Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: April 26, 2016
    Assignee: ICHIA TECHNOLOGIES, INC.
    Inventors: Chien-Hwa Chiu, Chih-Min Chao, Peir-Rong Kuo, Chia-Hua Chiang, Chih-Cheng Hsiao, Feng-Ping Kuan, Ying-Wei Lee, Yung-Chang Juang
  • Patent number: 9253232
    Abstract: A streaming media presentation transmission error recovery system and network. In one embodiment, in the event of a connection failure to a selected server, an alternative “mirrored” server is selected to resume the transmission of a selected streaming media presentation. One embodiment of the present invention provides for transparent switching from an interrupted media data stream to a stream from a newly-created network connection by providing an overlap between media that has been received and the data that is received via the new connection.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: February 2, 2016
    Assignee: Intel Corporation
    Inventors: Hai-Feng Ping, Haydon Boone
  • Publication number: 20150021069
    Abstract: A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.
    Type: Application
    Filed: October 21, 2013
    Publication date: January 22, 2015
    Applicant: ICHIA TECHNOLOGIES,INC.
    Inventors: CHIEN-HWA CHIU, Chih-Min Chao, Peir-Rong Kuo, Chia-Hua Chiang, Chih-Cheng Hsiao, Feng-Ping Kuan, Ying-Wei Lee, Wei-Cheng Lee
  • Publication number: 20140298017
    Abstract: A method and system for broadcasting pictures across multiple user terminals are provided. The method includes generating a user signature based on information associated with the picture, and receiving a request to broadcast the picture, the request including the user signature. The method further includes broadcasting the picture if the user signature is valid. The method and system may improve a user's online experience by eliminating unauthorized broadcasts from unauthorized users.
    Type: Application
    Filed: February 21, 2014
    Publication date: October 2, 2014
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: FENG PING, YUXUN ZHOU
  • Publication number: 20140224528
    Abstract: The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).
    Type: Application
    Filed: March 28, 2013
    Publication date: August 14, 2014
    Applicant: ICHIA TECHNOLOGIES,INC.
    Inventors: CHIEN-HWA CHIU, CHIH-MIN CHAO, PEIR-RONG KUO, CHIA-HUA CHIANG, CHIH-CHENG HSIAO, FENG-PING KUAN, YING-WEI LEE, YUNG-CHANG JUANG
  • Publication number: 20140224526
    Abstract: The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.
    Type: Application
    Filed: March 28, 2013
    Publication date: August 14, 2014
    Applicant: ICHIA TECHNOLOGIES, INC.
    Inventors: CHIEN-HWA CHIU, CHIH-MIN CHAO, PEIR-RONG KUO, CHIA-HUA CHIANG, CHIH-CHENG HSIAO, FENG-PING KUAN, YING-WEI LEE, YUNG-CHANG JUANG
  • Publication number: 20140224527
    Abstract: A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
    Type: Application
    Filed: August 15, 2013
    Publication date: August 14, 2014
    Applicant: ICHIA TECHNOLOGIES,INC.
    Inventors: CHIEN-HWA CHIU, CHIH-MIN CHAO, PEIR-RONG KUO, CHIA-HUA CHIANG, CHIH-CHENG HSIAO, FENG-PING KUAN, YING-WEI LEE, YUNG-CHANG JUANG
  • Publication number: 20140201233
    Abstract: Methods, devices, and systems for uploading data are provided. A request for uploading data sent from a user terminal can be received by a proxy server. The request for uploading data contains index information of data to be uploaded. The proxy server can determine whether the data to be uploaded are stored on a storage server, according to the index information of the data to be uploaded. When the proxy server determines that the data to be uploaded are stored on the storage server, a feedback message can be sent by the proxy server to the user terminal that the data to be uploaded are stored on the storage server.
    Type: Application
    Filed: January 12, 2014
    Publication date: July 17, 2014
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventor: FENG PING
  • Patent number: 8428257
    Abstract: An embodiment of a method for rendering an item of media content includes obtaining a media presentation having a media-content portion and a display-window-configuration component. The display-window-configuration component is recovered from the media presentation and causes a defined display window to be presented contemporaneously with rendering the media content of the media-content portion. And an embodiment of a method for rendering an item of media content having an action-indicator associated with an action includes analyzing the media content to detect the action-indicator and executing the associated action. For example, the action-indicator may be a watermark, which may be visible while an image portion of the media content is displayed.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: April 23, 2013
    Assignee: Intel Corporation
    Inventors: Adam Cappio, Ben Rothotlz, Hai Feng Ping