Patents by Inventor Feng-Po Tseng
Feng-Po Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11247978Abstract: A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II) wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, q, z and E are as defined in specification.Type: GrantFiled: November 5, 2020Date of Patent: February 15, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Kuo-Chan Chiou, Feng-Po Tseng
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Publication number: 20210047282Abstract: A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II), wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII), wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, q, z and E are as defined in specification.Type: ApplicationFiled: November 5, 2020Publication date: February 18, 2021Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi CHUANG, Kuo-Chan CHIOU, Feng-Po TSENG
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Patent number: 10894853Abstract: The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I: When formula I represents a compound, x is an integer of 1˜5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, —O—, —N—, —Ar—NH—(CH2)b—, —Ar—O—(CH2)b—, —Ar—O—(CH2)a—NH—(CH2)b—, —(CH2)a—NH—(CH2)b—, —(CH2)a—O—(CH2)b— or —(CH2)a—CH(OH)—(CH2)b—NH—; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.Type: GrantFiled: November 2, 2018Date of Patent: January 19, 2021Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Kuo-Chan Chiou, Feng-Po Tseng
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Patent number: 10858471Abstract: A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer having a structure represented by Formula (I) and a bismaleimide compound having a structure represented by Formula (II), wherein the equivalent ratio of the furan group of the furan-group-containing oligomer having a structure represented by Formula (I) to the maleimide group of the bismaleimide compound having a structure represented by Formula (II) is from 0.5:1 to 1:0.5.Type: GrantFiled: November 2, 2018Date of Patent: December 8, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Kuo-Chan Chiou, Feng-Po Tseng
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Patent number: 10752744Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(?O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.Type: GrantFiled: December 28, 2017Date of Patent: August 25, 2020Assignees: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, ITEQ CORPORATIONInventors: Feng-Po Tseng, Wen-Pin Ting, Kuo-Chan Chiou
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Patent number: 10626219Abstract: A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Y1 and Y2 are independently —H, —CH3, or —CH2CH3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.Type: GrantFiled: July 19, 2017Date of Patent: April 21, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Feng-Po Tseng, Kuo-Chan Chiou
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Publication number: 20190194408Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(?O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.Type: ApplicationFiled: December 28, 2017Publication date: June 27, 2019Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, ITEQ CORPORATIONInventors: Feng-Po TSENG, Wen-Pin TING, Kuo-Chan CHIOU
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Publication number: 20190153139Abstract: A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer having a structure represented by Formula (I) and a bismaleimide compound having a structure represented by Formula (II), wherein the equivalent ratio of the furan group of the furan-group-containing oligomer having a structure represented by Formula (I) to the maleimide group of the bismaleimide compound having a structure represented by Formula (II) is from 0.5:1 to 1:0.5.Type: ApplicationFiled: November 2, 2018Publication date: May 23, 2019Applicant: Industrial Technology Research InstituteInventors: Kuei-Yi CHUANG, Kuo-Chan CHIOU, Feng-Po TSENG
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Publication number: 20190144410Abstract: The invention provides a furan-modified compound or oligomer. The compound has a structure represented by Formula I: When formula I represents a compound, x is an integer of 1˜5; A including a group formed of ketone, amido, imide, imido, phenyl ether or enol ether group; G is a direct bond, —O—, —N—, —Ar—NH—(CH2)b—, —Ar—O—(CH2)b—, —Ar—O—(CH2)a—NH—(CH2)b—, —(CH2)a—NH—(CH2)b—, —(CH2)a—O—(CH2)b— or —(CH2)a—CH(OH)—(CH2)b—NH—; Ar is substituted or unsubstituted arylene group; a is an integer of 1 to 5; and b is an integer of 0 to 5.Type: ApplicationFiled: November 2, 2018Publication date: May 16, 2019Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi CHUANG, Kuo-Chan CHIOU, Feng-Po TSENG
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Publication number: 20180134847Abstract: A polymer is provided. The polymer includes a first repeating unit represented by Formula (I) and a second repeating unit represented by Formula (II): wherein Y1 and Y2 are independently —H, —CH3, or —CH2CH3; n is an integer ranging from 1 to 25; and the molar ratio of the first repeating unit to the second repeating unit is from 5:95 to 15:45. A resin composition including the aforementioned polymer is also provided.Type: ApplicationFiled: July 19, 2017Publication date: May 17, 2018Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi CHUANG, Feng-Po TSENG, Kuo-Chan CHIOU
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Patent number: 9708437Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.Type: GrantFiled: July 21, 2015Date of Patent: July 18, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi Chuang, Feng-Po Tseng, Kuo-Chan Chiou, Lu-Shih Liao
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Publication number: 20160145373Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.Type: ApplicationFiled: July 21, 2015Publication date: May 26, 2016Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuei-Yi CHUANG, Feng-Po TSENG, Kuo-Chan CHIOU, Lu-Shih LIAO
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Patent number: 8039537Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.Type: GrantFiled: February 22, 2010Date of Patent: October 18, 2011Assignee: Industrial Technology Research InstituteInventors: Feng-Po Tseng, Lu-Shih Liao, Kuo-Chan Chiou
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Publication number: 20110147646Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.Type: ApplicationFiled: February 22, 2010Publication date: June 23, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Feng-Po Tseng, Lu-Shih Liao, Kuo-Chan Chiou
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Patent number: 7834070Abstract: The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.Type: GrantFiled: July 20, 2007Date of Patent: November 16, 2010Assignee: Industrial Technology Research InstituteInventors: Feng-Po Tseng, Jung-Mu Hsu, Jing-Pin Pan, Tzong-Ming Lee
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Publication number: 20090235754Abstract: An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.Type: ApplicationFiled: June 3, 2009Publication date: September 24, 2009Applicant: Industrial Technology Research InstituteInventors: Feng-Po Tseng, Kuo-Chan Chiou, Tzong-Ming Lee, Syh-Yuh Cheng, Chih-Wei Hsu
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Publication number: 20080146706Abstract: The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.Type: ApplicationFiled: July 20, 2007Publication date: June 19, 2008Inventors: Feng-Po Tseng, Jung-Mu Hsu, Jing-Pin Pan, Tzong-Ming Lee
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Publication number: 20070148469Abstract: An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.Type: ApplicationFiled: March 13, 2006Publication date: June 28, 2007Inventors: Feng-Po Tseng, Kuo-Chan Chiou, Tzong-Ming Lee, Syh-Yuh Cheng, Chih-Wei Hsu
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Patent number: 6809130Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.Type: GrantFiled: March 11, 2003Date of Patent: October 26, 2004Assignee: Industrial Technology Research InstituteInventors: Kuo-Chan Chiou, Tzong-Ming Lee, Feng-Po Tseng, Lu-Shih Liao, Jia-Chi Huang, Tzu-Ting Lin
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Publication number: 20040110874Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.Type: ApplicationFiled: March 11, 2003Publication date: June 10, 2004Applicant: Industrial Technology Research InstituteInventors: Kuo-Chan Chiou, Tzong-Ming Lee, Feng-Po Tseng, Lu-Shih Liao, Jia-Chi Huang, Tzu-Ting Lin