Abstract: A device for optical signal processing includes a first layer, a second layer and a waveguiding layer. A lens is disposed within the first layer and adjacent to a surface of the first layer. The second layer is underneath the first layer and adjacent to another surface of the first layer. The waveguiding layer is located underneath the second layer and configured to waveguide a light beam transmitted in the waveguiding layer. A grating coupler is disposed over the waveguiding layer. The lens is configured to receive, from one of the grating coupler or a light-guiding element, the light beam, and focus the light beam towards another one of the light-guiding element or the grating coupler.

Abstract: A device includes a dielectric layer, a plurality of grating structures, and a dielectric material between the plurality of grating structures and on top of the plurality of grating structures. The grating structures are arranged on the dielectric layer and separated from each other, the plurality of grating structures each having a bottom portion and top portion, the top portion having a first width and the bottom portion having a second width, the second width being larger than the first width.

Abstract: An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.

Abstract: Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency.

Abstract: A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure includes an oxide layer and a second grating coupler embedded in the oxide layer. The photonic dies are optically coupled through the first grating couplers of the photonic dies and the second grating coupler of the interposer structure.

Abstract: In an embodiment, a phase shifter includes: a light input end; a light output end; a p-type semiconductor material, and an n-type semiconductor material contacting the p-type semiconductor material along a boundary area, wherein the boundary area is greater than a length from the light input end to the light output end multiplied by a core width of the phase shifter.

Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Abstract: A server includes a first server unit, a second server unit, a hinge and a connecting element. The second server unit is disposed on the first server unit and is electrically connected to the first server unit. The second server unit is pivoted to the first server unit through the hinge. The connecting element is disposed between the first server unit and the second server unit. The connecting element has a first connection end and a second connection end, wherein the first connection end is connected to the first server unit, and the second connection end is connected to the second server unit. A server system including a rack and at least one server is also provided.

Abstract: An electronic product with a light emitting function is provided. The electronic product includes a supporting structure, a light emitting structure and a cavity. The light emitting structure is bonded on the supporting structure. The light emitting structure includes a film, a conductive circuit and a light emitting device. The conductive circuit is formed on the film. The conductive circuit is enclosed between the supporting structure and the film. The light emitting device is disposed on the conductive circuit. The cavity is formed between the supporting structure and the light emitting structure, and the light emitting device is received in the cavity.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.

Abstract: A method and system for group-oriented encryption and decryption that supports the implementation of the designation and revocation functions of decryption users in a large-scale group.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A dialyzer and a fabricating method thereof are provided. The dialyzer includes a housing, a hydrophilic layer, a fixing layer, a plurality of hollow fiber membranes, and two end caps. The housing has a first opening and a second opening, and is provided with a dialysate inlet and a dialysate outlet, wherein an entire peripheral surface of the housing located between the first opening and the dialysate inlet is a first portion, and an entire peripheral surface of the housing located between the second opening and the dialysate outlet is a second portion. The hydrophilic layer is disposed on the inner wall of the first portion and the second portion, wherein the hydrophilic layer and the housing are different materials. The fixing layer is disposed on the hydrophilic layer and fixes the hollow fiber membranes to the inner wall of the housing.

Abstract: An end cap of a dialyzer and a fabricating method thereof, and a dialyzer are provided. The end cap includes a main body and a sealing element. The main body has a blood port. The sealing element is integrally connected on an inner wall of the main body.

Abstract: An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.

Abstract: A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a first surface of a supporting body. Then, an electronic element is disposed on the conductive circuit, and the electronic element is electrically connected to the conductive circuit. Then, a film layer is disposed on the conductive circuit having the electronic element, and the electronic element and the conductive circuit are wrapped between the supporting body and the film layer.