Patents by Inventor Feng-Sheng KUAN

Feng-Sheng KUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180138875
    Abstract: An electronic device includes a case, an electronic assembly, a rotary member and a positioning module. The case includes a bottom plate and a side plate. The electronic assembly includes a circuit board and an electronic component. The electronic component is fastened to the circuit board. The circuit board is disposed on the bottom plate. The rotary member is disposed through the side plate and an assembling hole of the electronic component in sequence. The positioning module is fastened to the bottom plate, and the positioning module is disposed through the circuit board of the electronic assembly. The positioning module has a blocking surface facing the bottom plate. A part of the circuit board is located between the blocking surface and the bottom plate, and a distance between the blocking surface and the bottom plate is larger than a thickness of the circuit board.
    Type: Application
    Filed: April 4, 2017
    Publication date: May 17, 2018
    Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kun-Hui LAI, Feng-Sheng KUAN, Ting-Chang KUO, Pei-Lien WANG