Patents by Inventor Feng Wen

Feng Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12288522
    Abstract: An electronic device includes a display and a sensor underneath the display. The display has a full pixel density region and a reduced pixel density region. Compared to pixels in the full pixel density region, pixels in the reduced pixel density region can be controlled using overdriven power supply voltages, overdriven scan control signals, different initialization and reset voltages, and can include capacitors and transistors with different physical and electrical characteristics. Gate drivers provide scan signals to pixels in the full pixel density region, whereas overdrive buffers provide overdrive scan signals to pixels in the reduced pixel density region. The pixels in the full pixel density region and the pixels in the reduced pixel density region can be controlled using different black level or gamma settings for each color channel and can be adjusted physically to match luminance, color, as well as to mitigate differences in temperature and aging impact.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: April 29, 2025
    Assignee: Apple Inc.
    Inventors: Shyuan Yang, Salman Kabir, Ricardo A Peterson, Warren S Rieutort-Louis, Ting-Kuo Chang, Qing Li, Yuchi Che, Tsung-Ting Tsai, Feng Wen, Abbas Jamshidi Roudbari, Kyounghwan Kim, Graeme M Williams, Kingsuk Brahma, Yue Jack Chu, Junbo Wu, Chieh-Wei Chen, Bo-Ren Wang, Injae Hwang, Wenbing Hu
  • Publication number: 20250112171
    Abstract: A semiconductor device is provided, which includes a substrate, a first dielectric layer, a conductive layer, and an insulating capping layer. The first dielectric layer is disposed on the substrate. The conductive layer is disposed on the first dielectric layer. The conductive layer includes a plurality of conductive wires. The insulating capping layer is disposed on the conductive layer, and configured to enclose a plurality of first gaps between the conductive wires to form a plurality of air spacers.
    Type: Application
    Filed: November 21, 2023
    Publication date: April 3, 2025
    Inventor: FENG-WEN HSU
  • Publication number: 20250112169
    Abstract: A semiconductor device is provided, which includes a substrate, a first dielectric layer, a conductive layer, and an insulating capping layer. The first dielectric layer is disposed on the substrate. The conductive layer is disposed on the first dielectric layer. The conductive layer comprises a plurality of conductive wires. The insulating capping layer is disposed on the conductive layer, and configured to enclose a plurality of first gaps between the conductive wires to form a plurality of air spacers.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 3, 2025
    Inventor: FENG-WEN HSU
  • Publication number: 20250056162
    Abstract: The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a third insulation layer. The second insulation layer extends to wiring gaps of the first wiring layer. The third insulation layer extends to wiring gaps of the at least one second wiring layer. Each of the first wiring layer and the at least one second wiring layer has a winding structure. The first wiring layer is electrically connected in series or in parallel with the at least one second wiring layer and forming two output terminals.
    Type: Application
    Filed: December 20, 2023
    Publication date: February 13, 2025
    Inventors: TSENG-FENG WEN, Chien-Kai Wen, Chun-Han Huang, Chung-Hsien Tseng
  • Publication number: 20250034142
    Abstract: The invention relates to solid crystalline forms of Compound (I), such as e.g., Form VII, including pharmaceutical compositions thereof and processes for preparing crystalline Compound (I), Form VII. Compound (I) modulates or inhibits the activity of BET bromodomain-containing proteins, and is useful in the treatment of diseases such as cancer, inflammatory and cardiovascular diseases.
    Type: Application
    Filed: October 9, 2024
    Publication date: January 30, 2025
    Inventors: FENG WEN, JIAHUI CHEN, XIANGHUI WEN, MARK T. EDGAR, HENRIK C. HANSEN
  • Patent number: 12171331
    Abstract: Provided are a shelf assembly and a storage cabinet, which relate to the technical field of storage apparatuses. The shelf assembly includes: a plurality of shelves, mounting rods, the outer peripheral walls of which are provided with external threads in the axial direction, moving members corresponding to the shelves, and driving members corresponding to the moving members. The moving members are connected to the corresponding shelves; internal thread holes in threaded fit with the mounting rods are formed on the moving members; and the driving members are connected to the corresponding moving members and are used for driving the moving members to rotate. The storage cabinet includes a cabinet body and the shelf assembly arranged in the cabinet body.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: December 24, 2024
    Assignees: HEFEI HUALING CO., LTD., HEFEI MIDEA REFRIGERATOR CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Nanfei Yao, Feng Wen, Yunho Yang
  • Patent number: 12154480
    Abstract: A light emitter that operates through a display may cause display artifacts, even when the light emitter operates using non-visible wavelengths. Display artifacts caused by a light emitter that operates through a display may be referred to as emitter artifacts. To mitigate emitter artifacts, operating conditions for a display frame may be used to determine an optimal firing time for the light emitter during that display frame. The operating conditions used to determine the optimal firing time may include emitter operating conditions, display content statistics, display brightness, temperature, and refresh rate. Operating conditions from one or more previous frames may be stored in a frame buffer and may be used to help determine the optimal firing time for the light emitter during a display frame. Pixel values for the display may be modified to mitigate emitter artifacts.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: November 26, 2024
    Assignee: Apple Inc.
    Inventors: Jenny Hu, Chaohao Wang, Christopher E Glazowski, Clint M Perlaki, David R Manly, Feng Wen, Graeme M Williams, Hei Kam, Hyun H Boo, Kevin J Choboter, Kyounghwan Kim, Lu Yan, Mahesh B Chappalli, Mark T Winkler, Na Zhu, Peter F Holland, Tong Chen, Warren S Rieutort-Louis, Wenrui Cai, Ximeng Guan, Yingying Tang, Yuchi Che
  • Patent number: 12145932
    Abstract: The invention relates to solid crystalline forms of Compound (I), such as e.g., Form VII, including pharmaceutical compositions thereof and processes for preparing crystalline Compound (I), Form VII. Compound (I) modulates or inhibits the activity of BET bromodomain-containing proteins, and is useful in the treatment of diseases such as cancer, inflammatory and cardiovascular diseases.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 19, 2024
    Assignee: ZENITH EPIGENETICS LTD.
    Inventors: Feng Wen, Jiahui Chen, Xianghui Wen, Mark T. Edgar, Henrik C. Hansen
  • Patent number: 12143794
    Abstract: A loudspeaker using a semiconductor voice coil includes a vibrating assembly and a magnetic force assembly. The magnetic force assembly and the vibrating assembly are arranged at an interval. The vibrating component includes a diaphragm and the semiconductor voice coil. The semiconductor voice coil is arranged on a side of the diaphragm. The magnetic force assembly and the semiconductor voice coil are arranged on the same side of the diaphragm. A magnetic gap is defined in the magnetic force assembly. The semiconductor voice coil is arranged in the magnetic gap. The magnetic field lines in the magnetic gap are perpendicular to the direction of current in the semiconductor voice coil. An electronic device including the loudspeaker is also disclosed.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: November 12, 2024
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Tseng-Feng Wen, Hui Xue
  • Publication number: 20240347669
    Abstract: A semiconductor stack includes a first semiconductor structure, a second semiconductor structure and an active structure. The active structure includes a first well set, a second well set and a plurality of barriers. The first well set is disposed on the first semiconductor structure and includes one or multiple first wells. The second well set is disposed between the first well set and the second semiconductor structure and includes one or multiple second wells. The plurality of barriers is arranged alternately with the one or multiple first wells and the one or multiple second wells. The first well has a first thickness. The second well has a second thickness different from the first thickness. The one or multiple first wells and the one or multiple second wells include AlxInyGa1?x?yN respectively, wherein 0?x?1, 0?y?1, 0?1?x?y<1.
    Type: Application
    Filed: April 12, 2024
    Publication date: October 17, 2024
    Inventors: Feng-Wen HUANG, Yueh-Chern LIN
  • Publication number: 20240339399
    Abstract: The present application provides a semiconductor structure having dielectric liner and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate; a first bit line structure, disposed over the substrate, comprising a first conductive layer, a second conductive layer disposed over the first conductive layer, and a first dielectric layer disposed over the second conductive layer; a second bit line structure, disposed over the substrate, comprising a second dielectric layer, a third conductive layer disposed over the second dielectric layer, and a third dielectric layer disposed over the third conductive layer; a polysilicon layer, disposed over the substrate and surrounded by the first bit line structure and the second bit line structure; a dielectric liner, surrounding at least a portion of the polysilicon layer; and a landing pad, disposed over the polysilicon layer, the dielectric liner and the second bit line structure.
    Type: Application
    Filed: August 11, 2023
    Publication date: October 10, 2024
    Inventor: FENG-WEN HSU
  • Publication number: 20240339398
    Abstract: The present application provides a semiconductor structure having dielectric liner and a manufacturing method of the semiconductor structure. The semiconductor structure includes a substrate; a first bit line structure, disposed over the substrate, comprising a first conductive layer, a second conductive layer disposed over the first conductive layer, and a first dielectric layer disposed over the second conductive layer; a second bit line structure, disposed over the substrate, comprising a second dielectric layer, a third conductive layer disposed over the second dielectric layer, and a third dielectric layer disposed over the third conductive layer; a polysilicon layer, disposed over the substrate and surrounded by the first bit line structure and the second bit line structure; a dielectric liner, surrounding at least a portion of the polysilicon layer; and a landing pad, disposed over the polysilicon layer, the dielectric liner and the second bit line structure.
    Type: Application
    Filed: April 6, 2023
    Publication date: October 10, 2024
    Inventor: FENG-WEN HSU
  • Publication number: 20240294179
    Abstract: Examples of data processing methods and apparatus are described. One example method includes determining first pose information of a vehicle at a second moment based on pose information of the vehicle at a first moment and a first model, where the first model is a pose estimation model from the first moment to the second moment. Data collected by one or more sensors is obtained. Second pose information of the vehicle at the second moment is determined based on the first pose information and the data.
    Type: Application
    Filed: April 26, 2024
    Publication date: September 5, 2024
    Inventors: Leijie WANG, Zhenbo LIU, Feng WEN, Hongbo ZHANG
  • Patent number: 12073630
    Abstract: This disclosure provides a moving object tracking method and apparatus. The method includes: obtaining a current frame captured by a camera; predicting a current state vector of the camera based on an inertial measurement unit IMU and the current frame, to obtain a predicted value of the current state vector of the camera; predicting a current state vector of a target object that is moving in the current frame, to obtain a predicted value of the current state vector of the target object; and updating a Kalman state vector based on a measurement result of an image feature in the current frame. According to technical solutions provided in this disclosure, a target object that is moving in a surrounding environment can be tracked and a pose of the target object can be estimated while a pose of a system can be estimated.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: August 27, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Wanlong Li, Xueshi Li, Yajun Gao, Feng Wen
  • Patent number: 12062313
    Abstract: This disclosure is directed towards systems and methods of power saving in electronic displays based on changing clock signal frequencies supplied to the gate-in-panel (GIP) circuitry during extended blanking modes of the electronic display. The display driver circuitry of the display may reduce and/or halt clock signal frequencies sent to GIP circuitry in the display, to reduce power output during extended blanking modes of the electronic display.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: August 13, 2024
    Assignee: Apple Inc.
    Inventors: Jie Won Ryu, Kingsuk Brahma, Qing Li, Shawn P Hurley, Ce Zhang, Warren S Rieutort-Louis, Feng Wen, Marc J DeVincentis, Zhe Hua, Hyunwoo Nho
  • Publication number: 20240258392
    Abstract: A semiconductor device includes a patterned substrate, a first barrier layer, a second barrier layer and a conductive layer. The patterned substrate has a trench and a sidewall surrounding the trench. The first barrier layer disposed on a first portion of the sidewall. The second barrier layer with a permittivity from 0.5 to 3.8 is disposed on the first barrier layer and a second portion of the sidewall, in which the second portion of the sidewall is higher than the first portion of the sidewall and neighboring to a top surface of the patterned substrate. A conductive layer fills the trench. A method of manufacturing a semiconductor device is further provided.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 1, 2024
    Inventor: Feng Wen HSU
  • Patent number: 12046255
    Abstract: A sound source tracking method adapted to an ongoing video conference comprising: obtaining a streaming signal of the video conference from an internet; performing a video conference procedure to obtain an audio signal from the streaming signal and send the audio signal to a speaker; performing an audio tracking procedure to obtain the audio signal outputted from the video conference procedure to the communication device and send the audio signal to a sound source tracking camera; playing the audio signal to generate a far-end sound; recording a field sound comprising at least one of the far-end sound and a local-end sound; and performing a comparing procedure to determine a shooting direction of the sound source tracking camera, wherein the shooting direction is adjusted so as not to shoot the speaker when a similarity of the far-end sound and the audio signal is greater than a threshold.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: July 23, 2024
    Assignee: AVER INFORMATION INC.
    Inventors: Fu-En Tsai, Feng Wen Hung, Chao-I Li
  • Publication number: 20240242512
    Abstract: A road information identification method and apparatus are provided The method includes: receiving road environment data of a plurality of modalities, where a road environment includes an environment of a lane area and an environment of a lane-free area; performing topology parsing based on the road environment data of the plurality of modalities, to obtain a lane-level topology connection relationship of a road, where the lane-level topology connection relationship of the road indicates a mutual location relationship between lanes on the road and a connection status of the lanes; and determining road information of the road based on the lane-level topology connection relationship of the road. An electronic device, a computer-readable storage medium, and a vehicle are further provided.
    Type: Application
    Filed: March 27, 2024
    Publication date: July 18, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Zhe Chen, Feng Wen, Zhenbo Liu
  • Publication number: 20240205609
    Abstract: The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.
    Type: Application
    Filed: November 28, 2023
    Publication date: June 20, 2024
    Inventors: TSENG-FENG WEN, CHUN-HAN HUANG, CHUNG-HSIEN TSENG
  • Publication number: 20240191199
    Abstract: The present invention relates to hydrogel scaffold and the uses thereof. In a specific embodiment, the hydrogel scaffold comprises gelatin methacryloyl (GelMA), alginate and pectin, and one or more cell types. In another embodiment, the one or more cell types comprise stem cells and/or progenitor cells. The stem cells are adipose-derived stem cells (ADSCs) or mesenchymal stem cells. The present invention further relates to the method of fabricating the hydrogel scaffold as well as a method of myogenic differentiation with the hydrogel scaffold.
    Type: Application
    Filed: April 20, 2022
    Publication date: June 13, 2024
    Inventors: Lay Poh TAN, Feng WEN, Si Han Jasmine SEAH