Patents by Inventor Feng Xiang Li

Feng Xiang Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7575439
    Abstract: A speaker connector for connecting a speaker and a printed circuit board of an electronic device includes an insulating housing and a terminal. The insulating housing defines a holding groove extending therethrough. The terminal has a retaining portion retained in the holding groove of the insulating housing. A first resilient portion is connected to an upper end of the retaining portion and extends out of the holding groove. A first contact portion extends sideward from the first resilient portion for connecting the speaker. A second resilient portion with a zigzag configuration is connected to a lower end of the retaining portion and contained in the holding groove. A second contact portion is connected to a lower end of the second resilient portion and extends out of the holding groove for elastically touching the printed circuit board.
    Type: Grant
    Filed: December 3, 2007
    Date of Patent: August 18, 2009
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ming-chiang Chen, Ping-chih Chen, Feng-xiang Li
  • Publication number: 20090142961
    Abstract: A speaker connector for connecting a speaker and a printed circuit board of an electronic device includes an insulating housing and a terminal. The insulating housing defines a holding groove extending therethrough. The terminal has a retaining portion retained in the holding groove of the insulating housing. A first resilient portion is connected to an upper end of the retaining portion and extends out of the holding groove. A first contact portion extends sideward from the first resilient portion for connecting the speaker. A second resilient portion with a zigzag configuration is connected to a lower end of the retaining portion and contained in the holding groove. A second contact portion is connected to a lower end of the second resilient portion and extends out of the holding groove for elastically touching the printed circuit board.
    Type: Application
    Filed: December 3, 2007
    Publication date: June 4, 2009
    Inventors: Ming-Chiang Chen, Ping-Chih Chen, Feng-Xiang Li
  • Patent number: D568248
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: May 6, 2008
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ming Chiang Chen, Ping Chih Chen, Feng Xiang Li
  • Patent number: D576550
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: September 9, 2008
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Ming Chiang Chen, Ping Chih Chen, Feng Xiang Li