Abstract: A touch sensing module includes a touch sensing circuit substrate, a glass substrate, a shielding layer, and an adhering member. The shielding layer is made of a photoresist material, and is provided on the glass substrate to shield a periphery thereof. The adhering member has a first adhering layer and a second adhering layer which are adhered to each other, wherein the first adhering layer is adhered on the glass substrate and the shielding layer, while the second adhering layer is adhered on the touch sensing circuit substrate. An area of the first adhering layer facing the glass substrate is smaller than that of the second adhering layer facing the touch sensing circuit substrate. Or, a hardness of the first adhering layer is less than that of the second adhering layer.

Abstract: A heat transfer device comprises a heat conductive base, first and second cylindrical chambers defined in the heat conductive base and parallel to each other, a first heat conduction pipe fixed within the first cylindrical chamber, a second heat conduction pipe pivotally received in the second cylindrical chamber, and a sealing mechanism. One end of the first heat conduction pipe is secured within the first cylindrical chamber, while the other end thereof is attached to a heat-generating electrical element for absorbing heat produced by the electrical element and then transmitting the absorbed heat to the heat conductive base. One end of the second heat conduction pipe is pivotally mounted within the second cylindrical chamber, while the other end thereof is connected to a monitor panel of the Notebook computer for dissipating the heat transmitted by the heat conductive base to the exterior of the Notebook computer via the monitor panel.