Patents by Inventor Feng Yu Lee
Feng Yu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250070806Abstract: This disclosure provides methods, components, devices and systems for signal generation. Some aspects more specifically relate to frequency-selective digital predistortion signal generation. In some examples, the method alters an input signal to produce a frequency-selected linear output signal of a power amplifier. For frequency-selective pre-distortion signal generation, a digital pre-distortion circuit suppresses the non-linear distortion at a specific band using Volterra kernels of a Volterra series model and a shiftable finite impulse response (FIR). The shiftable FIR can filter a particular portion of the signal's frequency, and the Volterra kernels can capture the non-linear memory effects of the input signals and output signals of the power amplifier. Upon refinement of the Volterra kernel coefficients, the Volterra series model can produce a compensation signal.Type: ApplicationFiled: August 23, 2023Publication date: February 27, 2025Inventors: Yimu Tu, Feng-Yu Lee, Hao-Jen Cheng
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Patent number: 12237231Abstract: A semiconductor device includes a substrate and two fins protruding from the substrate. Each fin includes two source/drain (S/D) regions and a channel region. Each fin includes a top surface that remains flat across the S/D regions and the channel region. The semiconductor device also includes a gate stack engaging each fin at the respective channel region, a first dielectric layer on sidewalls of the gate stack, a first epitaxial layer over top and sidewall surfaces of the S/D regions of the two fins, and a second epitaxial layer over top and sidewall surfaces of the first epitaxial layer.Type: GrantFiled: July 12, 2021Date of Patent: February 25, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY CO., LTD.Inventors: Cheng-Yu Yang, Chia-Ta Yu, Kai-Hsuan Lee, Sai-Hooi Yeong, Feng-Cheng Yang
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Patent number: 12218138Abstract: A semiconductor device includes source/drain regions, a gate structure, a first gate spacer, and a dielectric material. The source/drain regions are over a substrate. The gate structure is laterally between the source/drain regions. The first gate spacer is on a first sidewall of the gate structure, and spaced apart from a first one of the source/drain regions at least in part by a void region. The dielectric material is between the first one of the source/drain regions and the void region. The dielectric material has a gradient ratio of a first chemical element to a second chemical element.Type: GrantFiled: November 15, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Bo-Yu Lai, Kai-Hsuan Lee, Wei-Yang Lee, Feng-Cheng Yang, Yen-Ming Chen
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Patent number: 12216754Abstract: The present disclosure generally relates to methods and user interfaces for authentication, including providing authentication at a computer system in accordance with some embodiments.Type: GrantFiled: April 28, 2022Date of Patent: February 4, 2025Assignee: Apple Inc.Inventors: Sung Chang Lee, Bowen Cheng, Yue Hang, Weiqi Pan, Yue Shen, Xiaoguang Yang, Xiaofeng Yu, Feng Zhang, Liang Zhao, Qiuji Zhao, Wendong Zhong
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Publication number: 20250022508Abstract: A memory device includes several computing memory cells each storing a weight value and comprising a first and a second switch elements and a first and a second resistors. The first switch element receives a sensing current and a first input signal related to the input value. The first resistor selectively receives the sensing current through the first switch element in response to the first input signal. The second switch element receives the sensing current and a second input signal related to the input value. The second resistor selectively receives the sensing current through the second switch element in response to the second input signal. When the sensing current flows through the first resistor or the second resistor, the computing memory cell generates a first voltage difference or a second voltage difference corresponding to an output value equal to product of an input value and a weight value.Type: ApplicationFiled: October 1, 2024Publication date: January 16, 2025Inventors: Yu-Yu LIN, Feng-Min LEE, Ming-Hsiu LEE
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Publication number: 20230149784Abstract: A lightweight paddle capable of improving surface flatness includes a paddle body and a handle connected to the paddle body. The paddle body includes a substrate layer and two face plates. The substrate layer is formed with a groove. An elastic member is embedded in the groove. When the two face plates are glued to the substrate layer, the groove of the substrate layer provides a deformation space for the elastic member, which can make the outer surface of the elastic member flush with the surface of the substrate layer. The overall weight of the product can be reduced effectively, so the paddle is more lightweight.Type: ApplicationFiled: January 17, 2023Publication date: May 18, 2023Inventor: Feng-Yu Lee
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Publication number: 20230047371Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face-plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball.Type: ApplicationFiled: October 28, 2022Publication date: February 16, 2023Inventor: Feng-Yu Lee
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Publication number: 20210252357Abstract: A pickleball paddle includes a paddle body and a handle. The paddle body includes a substrate and two face plates on front and rear sides thereof. An elastic member is provided between the substrate and each of the two face plates. The elastic member between the substrate and the face plate is configured to reduce the reaction force generated by the ball hitting the face plate and prolong the time that the ball stays on the face plate. The user can control the trajectory of the ball better. It enhances entertainment fun.Type: ApplicationFiled: May 4, 2021Publication date: August 19, 2021Inventor: Feng-Yu Lee
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Publication number: 20200398130Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.Type: ApplicationFiled: August 31, 2020Publication date: December 24, 2020Inventor: Feng-Yu Lee
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Publication number: 20200360780Abstract: A shock-absorbing handle structure for a sports racquet includes a main core body. An outer surface of the main core body is partially or completely covered with a shock absorbing structure. The shock absorbing structure is made of an ETPU (expanded thermoplastic polyurethane) material. The ETPU material is used as the shock absorbing structure. The shock absorbing structure is attached to the outer surface of the main core body, which has a simple structure. The ETPU material has a better elastic and rebound effect and improves the shock absorbing effect of the whole handle effectively. It is light in weight, and can improve the hand feeling and enhance the anti-slip effect and prevent sports injuries.Type: ApplicationFiled: May 17, 2019Publication date: November 19, 2020Inventor: Feng-Yu Lee
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Publication number: 20200360778Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. At least one hollow member is disposed in the paddle body. Rolling members that can roll in the hollow member are disposed in the hollow member. By providing the at least one hollow member in the paddle body and the rolling members that can roll in the hollow member, the pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.Type: ApplicationFiled: May 15, 2019Publication date: November 19, 2020Inventor: Feng-Yu Lee
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Patent number: 8780958Abstract: A hybrid bit detection circuit for receiving bits from different global positioning systems, e.g. GPS and GLONASS, can include a frequency lock loop (FLL) for receiving the global positioning bits and removing Doppler frequency error and an integrate and dump (I&D) block coupled to an output of the FLL. A coherent detection circuit can be coupled to an output of the FLL and an output of the integrated and dump block. A differential detection circuit can be coupled to an output of the I&D block. Two parity check blocks can be coupled to outputs of the coherent and differential detection circuits.Type: GrantFiled: August 27, 2010Date of Patent: July 15, 2014Assignee: QUALCOMM IncorporatedInventors: Haojen Cheng, Feng-Yu Lee, Qinfang Sun
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Patent number: 8679974Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.Type: GrantFiled: March 9, 2012Date of Patent: March 25, 2014Assignee: National Tsing Hua UniversityInventors: Wei-leun Fang, Chia Han Lin, Feng Yu Lee
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Publication number: 20130157459Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.Type: ApplicationFiled: March 9, 2012Publication date: June 20, 2013Inventors: Wei-leun FANG, Chia Han Lin, Feng Yu Lee