Abstract: Methods, apparatus, and processor-readable storage media for automatically determining work environment-related ergonomic data are provided herein. An example computer-implemented method includes obtaining ergonomic-related data pertaining to one or more of an individual within a work environment and the work environment; determining one or more ergonomic parameter values by processing at least a portion of the obtained ergonomic-related data using one or more models; generating and outputting, to the individual via one or more automated systems, at least one notification based at least in part on the one or more ergonomic parameter values; and performing one or more automated actions based at least in part on one or more of the one or more ergonomic values and the at least one notification.

Abstract: A semiconductor device includes source/drain regions, a gate structure, a first gate spacer, and a dielectric material. The source/drain regions are over a substrate. The gate structure is laterally between the source/drain regions. The first gate spacer is on a first sidewall of the gate structure, and spaced apart from a first one of the source/drain regions at least in part by a void region. The dielectric material is between the first one of the source/drain regions and the void region. The dielectric material has a gradient ratio of a first chemical element to a second chemical element.

Abstract: An in-memory-computing method for a memory device includes: storing weight values in cascaded computing cells each including first and second computing memory cells, wherein the first computing memory cells are cascaded in series into a first computing memory cell string and the second computing memory cells are cascaded in series into a second computing memory cell string: receiving input values by the first and the second computing memory cell strings; performing a first logic operation on the input values and the weight values by the first computing memory cell string to generate a first logic operation result, and performing a second logic operation on the input values and the weight values by the second computing memory cell string to generate a second logic operation result: and performing a third logic operation on the first and the second logic operation results to generate an output logic operation result.

Abstract: A lightweight paddle capable of improving surface flatness includes a paddle body and a handle connected to the paddle body. The paddle body includes a substrate layer and two face plates. The substrate layer is formed with a groove. An elastic member is embedded in the groove. When the two face plates are glued to the substrate layer, the groove of the substrate layer provides a deformation space for the elastic member, which can make the outer surface of the elastic member flush with the surface of the substrate layer. The overall weight of the product can be reduced effectively, so the paddle is more lightweight.

Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face-plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball.

Abstract: A pickleball paddle includes a paddle body and a handle. The paddle body includes a substrate and two face plates on front and rear sides thereof. An elastic member is provided between the substrate and each of the two face plates. The elastic member between the substrate and the face plate is configured to reduce the reaction force generated by the ball hitting the face plate and prolong the time that the ball stays on the face plate. The user can control the trajectory of the ball better. It enhances entertainment fun.

Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.

Abstract: A shock-absorbing handle structure for a sports racquet includes a main core body. An outer surface of the main core body is partially or completely covered with a shock absorbing structure. The shock absorbing structure is made of an ETPU (expanded thermoplastic polyurethane) material. The ETPU material is used as the shock absorbing structure. The shock absorbing structure is attached to the outer surface of the main core body, which has a simple structure. The ETPU material has a better elastic and rebound effect and improves the shock absorbing effect of the whole handle effectively. It is light in weight, and can improve the hand feeling and enhance the anti-slip effect and prevent sports injuries.

Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. At least one hollow member is disposed in the paddle body. Rolling members that can roll in the hollow member are disposed in the hollow member. By providing the at least one hollow member in the paddle body and the rolling members that can roll in the hollow member, the pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.

Abstract: A hybrid bit detection circuit for receiving bits from different global positioning systems, e.g. GPS and GLONASS, can include a frequency lock loop (FLL) for receiving the global positioning bits and removing Doppler frequency error and an integrate and dump (I&D) block coupled to an output of the FLL. A coherent detection circuit can be coupled to an output of the FLL and an output of the integrated and dump block. A differential detection circuit can be coupled to an output of the I&D block. Two parity check blocks can be coupled to outputs of the coherent and differential detection circuits.

Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.

Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.