Patents by Inventor Feng Yu Lee

Feng Yu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250070806
    Abstract: This disclosure provides methods, components, devices and systems for signal generation. Some aspects more specifically relate to frequency-selective digital predistortion signal generation. In some examples, the method alters an input signal to produce a frequency-selected linear output signal of a power amplifier. For frequency-selective pre-distortion signal generation, a digital pre-distortion circuit suppresses the non-linear distortion at a specific band using Volterra kernels of a Volterra series model and a shiftable finite impulse response (FIR). The shiftable FIR can filter a particular portion of the signal's frequency, and the Volterra kernels can capture the non-linear memory effects of the input signals and output signals of the power amplifier. Upon refinement of the Volterra kernel coefficients, the Volterra series model can produce a compensation signal.
    Type: Application
    Filed: August 23, 2023
    Publication date: February 27, 2025
    Inventors: Yimu Tu, Feng-Yu Lee, Hao-Jen Cheng
  • Patent number: 12237231
    Abstract: A semiconductor device includes a substrate and two fins protruding from the substrate. Each fin includes two source/drain (S/D) regions and a channel region. Each fin includes a top surface that remains flat across the S/D regions and the channel region. The semiconductor device also includes a gate stack engaging each fin at the respective channel region, a first dielectric layer on sidewalls of the gate stack, a first epitaxial layer over top and sidewall surfaces of the S/D regions of the two fins, and a second epitaxial layer over top and sidewall surfaces of the first epitaxial layer.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY CO., LTD.
    Inventors: Cheng-Yu Yang, Chia-Ta Yu, Kai-Hsuan Lee, Sai-Hooi Yeong, Feng-Cheng Yang
  • Patent number: 12218138
    Abstract: A semiconductor device includes source/drain regions, a gate structure, a first gate spacer, and a dielectric material. The source/drain regions are over a substrate. The gate structure is laterally between the source/drain regions. The first gate spacer is on a first sidewall of the gate structure, and spaced apart from a first one of the source/drain regions at least in part by a void region. The dielectric material is between the first one of the source/drain regions and the void region. The dielectric material has a gradient ratio of a first chemical element to a second chemical element.
    Type: Grant
    Filed: November 15, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Bo-Yu Lai, Kai-Hsuan Lee, Wei-Yang Lee, Feng-Cheng Yang, Yen-Ming Chen
  • Patent number: 12216754
    Abstract: The present disclosure generally relates to methods and user interfaces for authentication, including providing authentication at a computer system in accordance with some embodiments.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: February 4, 2025
    Assignee: Apple Inc.
    Inventors: Sung Chang Lee, Bowen Cheng, Yue Hang, Weiqi Pan, Yue Shen, Xiaoguang Yang, Xiaofeng Yu, Feng Zhang, Liang Zhao, Qiuji Zhao, Wendong Zhong
  • Publication number: 20250022508
    Abstract: A memory device includes several computing memory cells each storing a weight value and comprising a first and a second switch elements and a first and a second resistors. The first switch element receives a sensing current and a first input signal related to the input value. The first resistor selectively receives the sensing current through the first switch element in response to the first input signal. The second switch element receives the sensing current and a second input signal related to the input value. The second resistor selectively receives the sensing current through the second switch element in response to the second input signal. When the sensing current flows through the first resistor or the second resistor, the computing memory cell generates a first voltage difference or a second voltage difference corresponding to an output value equal to product of an input value and a weight value.
    Type: Application
    Filed: October 1, 2024
    Publication date: January 16, 2025
    Inventors: Yu-Yu LIN, Feng-Min LEE, Ming-Hsiu LEE
  • Publication number: 20230149784
    Abstract: A lightweight paddle capable of improving surface flatness includes a paddle body and a handle connected to the paddle body. The paddle body includes a substrate layer and two face plates. The substrate layer is formed with a groove. An elastic member is embedded in the groove. When the two face plates are glued to the substrate layer, the groove of the substrate layer provides a deformation space for the elastic member, which can make the outer surface of the elastic member flush with the surface of the substrate layer. The overall weight of the product can be reduced effectively, so the paddle is more lightweight.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 18, 2023
    Inventor: Feng-Yu Lee
  • Publication number: 20230047371
    Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face-plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Inventor: Feng-Yu Lee
  • Publication number: 20210252357
    Abstract: A pickleball paddle includes a paddle body and a handle. The paddle body includes a substrate and two face plates on front and rear sides thereof. An elastic member is provided between the substrate and each of the two face plates. The elastic member between the substrate and the face plate is configured to reduce the reaction force generated by the ball hitting the face plate and prolong the time that the ball stays on the face plate. The user can control the trajectory of the ball better. It enhances entertainment fun.
    Type: Application
    Filed: May 4, 2021
    Publication date: August 19, 2021
    Inventor: Feng-Yu Lee
  • Publication number: 20200398130
    Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. The paddle body has at least one hollow cylindrical space therein. An angle is formed between an axis of the hollow cylindrical space and front and back face plates of the paddle body. The hollow cylindrical space has an axial length and a radial length. The axial length is greater than the radial length. At least one rolling member that can roll back and forth along an axial direction of the hollow cylindrical space is disposed in the hollow cylindrical space. The pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 24, 2020
    Inventor: Feng-Yu Lee
  • Publication number: 20200360780
    Abstract: A shock-absorbing handle structure for a sports racquet includes a main core body. An outer surface of the main core body is partially or completely covered with a shock absorbing structure. The shock absorbing structure is made of an ETPU (expanded thermoplastic polyurethane) material. The ETPU material is used as the shock absorbing structure. The shock absorbing structure is attached to the outer surface of the main core body, which has a simple structure. The ETPU material has a better elastic and rebound effect and improves the shock absorbing effect of the whole handle effectively. It is light in weight, and can improve the hand feeling and enhance the anti-slip effect and prevent sports injuries.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 19, 2020
    Inventor: Feng-Yu Lee
  • Publication number: 20200360778
    Abstract: A pickleball paddle includes a paddle body and a handle connected to the paddle body. At least one hollow member is disposed in the paddle body. Rolling members that can roll in the hollow member are disposed in the hollow member. By providing the at least one hollow member in the paddle body and the rolling members that can roll in the hollow member, the pickleball paddle can enhance an explosive force for hitting a ball and absorb vibrations.
    Type: Application
    Filed: May 15, 2019
    Publication date: November 19, 2020
    Inventor: Feng-Yu Lee
  • Patent number: 8780958
    Abstract: A hybrid bit detection circuit for receiving bits from different global positioning systems, e.g. GPS and GLONASS, can include a frequency lock loop (FLL) for receiving the global positioning bits and removing Doppler frequency error and an integrate and dump (I&D) block coupled to an output of the FLL. A coherent detection circuit can be coupled to an output of the FLL and an output of the integrated and dump block. A differential detection circuit can be coupled to an output of the I&D block. Two parity check blocks can be coupled to outputs of the coherent and differential detection circuits.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: July 15, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Haojen Cheng, Feng-Yu Lee, Qinfang Sun
  • Patent number: 8679974
    Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: March 25, 2014
    Assignee: National Tsing Hua University
    Inventors: Wei-leun Fang, Chia Han Lin, Feng Yu Lee
  • Publication number: 20130157459
    Abstract: A method for fabricating interconnecting lines inside via holes of a semiconductor device comprises steps of providing a template having a receiving trench and a connection surface both on the same side of the template; filling an electric-conduction material into the receiving trench; connecting a substrate having at least one via hole with the connection surface to interconnect the via hole with the receiving trench; heating the electric-conduction material to a working temperature to liquefy a portion of the electric-conduction material and make it flows from the receiving trench into the via hole; and cooling the electric-conduction material to form an interconnecting line inside the via hole. The present invention fabricates interconnecting lines by a heat-forming method, which features simple steps and has advantages of shorter fabrication time, lower fabrication complexity, higher fabrication efficiency, higher yield and lower fabrication cost.
    Type: Application
    Filed: March 9, 2012
    Publication date: June 20, 2013
    Inventors: Wei-leun FANG, Chia Han Lin, Feng Yu Lee