Abstract: A low-inductance current-sharing power module, including a bottom plate, a first chipset, a second chipset, a positive electrode, a negative electrode and an output electrode is provided. A first substrate, a second substrate and a negative-electrode substrate are installed on the upper surface of the bottom plate. The first chipset and the positive electrode are installed on the upper surface of the first substrate, and the first chipset is in connection with the second substrate through a first link device. The second chipset and the output electrode are installed on the upper surface of the second substrate, and the second chipset is in connection with the negative-electrode substrate through the second link device. The negative electrode is installed on the upper surface of the negative-electrode substrate, and the first link device and the second link device are arranged in a laminated manner.

Abstract: A low-inductance power module comprises a housing, upper-bridge MOSs, lower-bridge SBDs, lower-bridge MOSs, upper-bridge SBDs, output electrodes, a positive electrode and a negative electrode. A bottom plate is mounted inside the housing. An insulating substrate is mounted at the top of the bottom plate. A positive-electrode copper layer, a negative-electrode copper layer and an output-electrode copper layer are arranged on the upper surface of the insulating substrate. The output-electrode copper layer is divided into an upper-side output-electrode copper layer and a lower-side output-electrode copper layer.

Abstract: A low-inductance power module comprises a housing, upper-bridge MOSs, lower-bridge SBDs, lower-bridge MOSs, upper-bridge SBDs, output electrodes, a positive electrode and a negative electrode. A bottom plate is mounted inside the housing. An insulating substrate is mounted at the top of the bottom plate. A positive-electrode copper layer, a negative-electrode copper layer and an output-electrode copper layer are arranged on the upper surface of the insulating substrate. The output-electrode copper layer is divided into an upper-side output-electrode copper layer and a lower-side output-electrode copper layer.