Patents by Inventor FENG-CHUAN TSAI

FENG-CHUAN TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and wearable device
    Patent number: 11532878
    Abstract: The present disclosure provides an electronic device. The electronic device includes a display module having a grounding element disposed under the display module and an antenna pattern. The grounding element is configured to function as a reference ground of the antenna pattern. A wearable device is also provided.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: December 20, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yuanhao Yu, Wei Fan Wu, Feng Chuan Tsai, Mingjhih Tsai, Shih Yuan Ho
  • ELECTRONIC DEVICE AND WEARABLE DEVICE
    Publication number: 20220344802
    Abstract: The present disclosure provides an electronic device. The electronic device includes a display module having a grounding element disposed under the display module and an antenna pattern. The grounding element is configured to function as a reference ground of the antenna pattern. A wearable device is also provided.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 27, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Wei Fan WU, Feng Chuan TSAI, Mingjhih TSAI, Shih Yuan HO
  • Package structure of light-emitting diode module and method for manufacturing the same
    Patent number: 9257620
    Abstract: The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: February 9, 2016
    Assignee: Prolight Opto Technology Corporation
    Inventors: Chen-Lun Hsing Chen, Feng-Chuan Tsai, Jung-Hao Hung
  • PACKAGE STRUCTURE OF LIGHT-EMITTING DIODE MODULE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160035947
    Abstract: The present invention provides a package structure of LED module and the method for manufacturing the same. The method comprises steps of providing a light-emitting module; disposing a light-pervious member on the light-emitting path of the light-emitting module; and dripping a colloid member on the light-pervious member. The light-pervious member is a transparent structure; and the colloid member forms a transparent structure with a thick center and a thin periphery using the surface tension of colloid material. In the above structure, the light-pervious member and colloid member are used for reducing the total reflection effect in the package.
    Type: Application
    Filed: August 4, 2014
    Publication date: February 4, 2016
    Inventors: CHEN-LUN HSING CHEN, FENG-CHUAN TSAI, JUNG-HAO HUNG