Patents by Inventor Fengchun Xie

Fengchun Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210147149
    Abstract: An article support device has a pair of support platforms arranged symmetrically and opposite to each other. Each of the support platforms includes a support frame, a support plate disposed on a top of the support frame and having a horizontal support top surface, and at least one positioning block installed on the horizontal support top surface. The horizontal support top surfaces of the support plates are located at a same height position. The article is supported on the horizontal support top surfaces and positioned between the positioning blocks on the support plates. An accommodation space is defined between the support plates and the support frames, and an automated guided vehicle moves into the accommodation space. An article carried on the article support device is loadable onto the automatic guided vehicle or the article carried on the automatic guided vehicle is unloadable onto the article support device.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 20, 2021
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Kunshan Sanxin Plastic Industry Co. Ltd
    Inventors: Yingcong Deng, Ming Ni, Lei Yang, Dong Xu, Dandan Zhang, Fengchun Xie, Huabin Du, Roberto Francisco-Yi Lu, Yangming Wen, Ge Chen
  • Publication number: 20210147161
    Abstract: A vacuum adsorption module includes a supporting block, a carrier installed and positioned on the supporting block, and a plurality of valves installed on the supporting block. The supporting block has a plurality of air connection holes, each row of air connection holes is connected to a total air path formed in the supporting block via a branch air path formed in the supporting block. The carrier has a plurality of air suction holes corresponding to the air connection holes. The valves control closing and opening of the branch air paths between the plurality of rows of air connection holes and the total air path. An adsorption length of the carrier in a column direction of the array is adjustable to match a length of an article to be adsorbed by the carrier by changing a number of the valves to be closed or opened.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Kunshan League Automechanism Co., Ltd.
    Inventors: Yingcong Deng, Dandan Zhang, Fengchun Xie, Lvhai Hu, Bo Pang, Haidong Wu, Jianyong Fan, Rong Zhang, Roberto Francisco-Yi Lu
  • Patent number: 11000912
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 11, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10993360
    Abstract: An assembly system comprises a fixing device configured to fix a housing and a pressing mechanism adapted to assemble a contact into the housing. The pressing mechanism includes a fixing block having a contact guiding slot adapted to receive the contact therein and a movable block movably mounted on the fixing block and adapted to press the contact downward. The movable block is moved downward to press the contact received in the contact guiding slot into a contact installation slot of the housing in a condition in which the contact guiding slot of the fixing block is aligned with the contact installation slot of the housing.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 27, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Kunshan League Automechanism Co., Ltd., Tyco Electronics Polska Sp. z.o.o.
    Inventors: Yingcong Deng, Jaroslaw Kowalski, Andrzej Przybylski, Jaroslaw Grzebski, Dandan Zhang, Lvhai Hu, Fengchun Xie, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
  • Patent number: 10957471
    Abstract: A calibration system adapted to calibrate a resistance of an electrical device having a lead wire comprises a resistance detector adapted to detect the resistance of the electrical device, a first container containing an etching solution adapted to etch the lead wire, and a heater configured to heat the electrical device. If a first resistance of the electrical device detected by the resistance detector at a first temperature is within a first predetermined range, the electrical device is heated with the heater to a second temperature higher than the first temperature. A second resistance of the electrical device is detected by the resistance detector at the second temperature. If the second resistance is beyond a second predetermined range, the lead wire is etched by the etching solution to adjust the resistance of the electrical device until the second resistance at the second temperature is within the second predetermined range.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 23, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Kunshan League Automechanism Co., Ltd.
    Inventors: Fengchun Xie, Yingcong Deng, Dandan Zhang, Lvhai Hu, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
  • Patent number: 10822173
    Abstract: A linking system adapted to link a plurality of products comprises a supply device having a tray with a slide slot adapted to load a first row of products therein, a gripping device having a gripper adapted to grip the first row of products and a moving mechanism adapted to move the gripper, and a holder adapted to hold the first row of products. The gripping device is adapted to move the first row of products from the supply device to a holding position on the holder and the holder is adapted to hold the first row of products at the holding position. The gripping device is further adapted to grip a second row of products from the supply device and link the second row of products to the first row of products held by the holder.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: November 3, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation
    Inventors: Jian Cao, Lvhai Hu, Fengchun Xie, Yun Liu, Xiaochen Yu, Roberto Francisco-Yi Lu
  • Patent number: 10816731
    Abstract: An automatic fiber stripping system comprises a first stripping module, a second stripping module, and a heating device. The first stripping module and the second stripping module each have a stripping belt, a driven belt wheel, a driving belt wheel, and a stripping tool including a pressing portion. The stripping belts are tightened on the pressing portions and the stripping tools press the stripping belts on each of two opposite sides of an optical cable. A blade portion of one of the stripping tools cuts a notch in at least one of two side edges of an outer coating layer of the optical cable. The heating device heats and softens the outer coating layer of the optical cable. The stripping belts are driven to move relative to the optical cable by the driving belt wheels so as to strip off a segment of the outer coating layer from the notch.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: October 27, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Qinglong Zeng, Yu Zhang, Dandan Zhang, Lvhai Hu, Roberto Francisco-Yi Lu
  • Patent number: 10814356
    Abstract: A cleaning system comprises a first cleaning tank, a carrying and moving unit, a first cleaning spray head, and a rolling brush unit. The carrying and moving unit is configured to move a polishing film to be cleaned into the first cleaning tank and hold the polishing film in the first cleaning tank. The first cleaning spray head is configured to spray a cleaning liquid on the polishing film held in the first cleaning tank. The rolling brush unit is configured to brush the polishing film while the first cleaning spray head sprays the cleaning liquid on the polishing film.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 27, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Innogetic Technology Co. Ltd.
    Inventors: Liming Xin, Yun Liu, Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lei Zhou, Kok Wai Wong
  • Publication number: 20200290843
    Abstract: A system for a mobile robot to autonomously take an elevator includes an elevator button pressing module mounted on an elevator floor control panel of the elevator. The elevator button pressing module communicates with the mobile robot wirelessly and is adapted to press a pair of elevator buttons on the elevator floor control panel according to an instruction issued by the mobile robot to call an elevator car.
    Type: Application
    Filed: March 13, 2020
    Publication date: September 17, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Kunshan Sanxin Plastic Industry Co. Ltd
    Inventors: Yingcong Deng, Dandan Zhang, Roberto Francisco-Yi Lu, Fengchun Xie, Mingyang Weng
  • Patent number: 10745218
    Abstract: A feeding system comprises a hopper adapted to accommodate a plurality of different types of products, a conveyor belt positioned above the hopper and configured to convey the products, and a lifting mechanism adapted to lift the products in the hopper onto the conveyor belt. The lifting mechanism includes a transferring belt circulating around an annular path and a plurality of step plates evenly spaced along the annular path. The step plates are adapted to carry one or more of the products and the transferring belt is configured to drive the step plates to circulate around the annular path so as to lift the products from the hopper onto the conveyor belt.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 18, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Kunshan League Automechanism Co., Ltd., Tyco Electronics Polska Sp. z.o.o., TE Connectivity Corporation
    Inventors: Yingcong Deng, Jaroslaw Kowalski, Andrzej Przybylski, Jaroslaw Grzebski, Dandan Zhang, Lvhai Hu, Fengchun Xie, Yun Liu, Roberto Francisco-Yi Lu, Haidong Wu, Hui Xiao
  • Publication number: 20200247620
    Abstract: A device for transferring components includes a transfer assembly and a drive assembly. The transfer assembly has a transfer track transferring a plurality of components therein. The transfer track has an operation position for operating the components. The drive assembly has a first drive mechanism transferring a first set of components of the components at the operation position in the transfer track and a second drive mechanism transferring a second set of components of the components at the operation position in the transfer track. The first drive mechanism and the second drive mechanism in turn drive the first set of components and the second set of components, continuously transferring the components.
    Type: Application
    Filed: January 28, 2020
    Publication date: August 6, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH
    Inventors: Jian Cao, Lvhai Hu, Fengchun Xie, Yun Liu, An Yang, Yingcong Deng, Roberto Francisco-Yi Lu
  • Publication number: 20200172424
    Abstract: A lead insertion system adapted to insert a lead into a glass tube includes a first robot on which a first gripper is mounted and a second robot on which a second gripper is mounted. The first gripper grips the glass tube and the second gripper grips the lead. The lead insertion system includes a flame heater heating the glass tube gripped by the first robot and the lead gripped by the second robot with a flame. The second robot inserts the lead into the glass tube held by the first robot with the lead heated by the flame and the glass tube heated and softened by the flame.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 4, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Kunshan League Automechanism Co., Ltd.
    Inventors: Yingcong Deng, Dandan Zhang, Roberto Francisco-Yi Lu, Fengchun Xie, Haidong Wu
  • Patent number: 10654076
    Abstract: An automatic fiber cleaning system comprises a first cleaning module, a second cleaning module, and a sprayer. Each of the first cleaning module and the second cleaning module has a cleaning belt, a driven belt wheel on which an unused portion of the cleaning belt is wound, a driving belt wheel on which a used portion of the cleaning belt is wound, and a pressing tool on which the cleaning belt is tightened. The sprayer sprays a cleaning agent onto the cleaning belts. The pressing tools press the cleaning belts on both sides of an optical fiber and clamp the optical fiber. The cleaning belts move relative to the optical fiber by the driving belt wheels to wipe the optical fiber.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: May 19, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Qinlong Zeng, Yu Zhang, Dandan Zhang, Lvhai Hu, Roberto Francisco-Yi Lu
  • Publication number: 20200094339
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 26, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10596697
    Abstract: A robot assembling system comprises a first assembling workstation, a second assembling workstation, and a robot. The first assembling workstation is configured to assemble a contact of a connector assembly and a light guide pipe of the connector assembly to form a contact subassembly. The second assembling workstation is configured to assemble the contact subassembly and a cage to form the connector assembly. The robot is configured to transmit the cage, the light guide pipe, the contact, or the contact subassembly between the first assembling workstation and the second assembling workstation and configured to assist an assembling operation at the first assembling workstation and the second assembling workstation.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 24, 2020
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yingcong Deng, Lei Zhou, Yun Liu, Fengchun Xie
  • Publication number: 20200091692
    Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200052451
    Abstract: A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation
    Inventors: Changjun Wang, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Yun Liu, Fengchun Xie
  • Publication number: 20200009783
    Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd., Measurement Specialities (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying
  • Publication number: 20200015359
    Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20190358722
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu