Abstract: The present application provides an electrode assembly and a processing method and apparatus therefor, a battery cell, a battery, and a power consuming device. The electrode assembly includes: a cathode plate, an anode plate, and a separator, where the separator is configured to separate the cathode plate from the anode plate, a closed-pore portion is provided in part of the region of the separator, and the closed-pore portion is configured to block at least some ions de-intercalated from the cathode plate located on one side of the closed-pore portion from being intercalated into the anode plate located on the other side of the closed-pore portion. Heating the separator to form the closed-pore portion can reduce the occurrence of lithium precipitation.

Abstract: A display panel is provided. The display panel includes: a substrate, and a light-emitting device, an encapsulation layer and an auxiliary barrier which are disposed on the substrate. The light-emitting device is disposed in a display area, and the auxiliary barrier is disposed in a non-display area. A height of the auxiliary barrier is greater than a distance between a side of the encapsulation layer away from the substrate and the substrate.

Abstract: Disclosed is a centralized MPPT exiting method for a photovoltaic inverter comprising multiple DC chopper circuits and one inverter circuit. The method comprises: when the photovoltaic inverter is in a centralized MPPT mode, MPPT control is implemented independently for each photovoltaic cell in a photovoltaic component and the maximum power point for each photovoltaic cell is obtained; a reference value of the maximum power point for each photovoltaic cell is determined according to the type of the multiple DC chopper circuits; whether the voltage difference between the other maximum power points and the reference value goes beyond an allowable voltage difference is judged and the operation of the DC chopper circuits connecting to the photovoltaic cells with a voltage difference beyond the allowable voltage difference is recovered.

Abstract: Embodiments of the invention provide a process chamber and a semiconductor processing apparatus. According to at least one embodiment, the process chamber includes a reaction compartment, a gas introducing system and a wafer transfer device. The reaction compartment is provided in the process chamber and used for performing a process on a wafer, the gas introducing system is used for providing processing gas to the reaction compartment, and the wafer transfer device is used for transferring the wafer into the reaction compartment. A lining ring assembly is provided in the reaction compartment, and is configured such that a flow uniformizing cavity is formed between the lining ring assembly itself and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas, from the gas introducing system, into the reaction compartment through the flow uniformizing cavity.

Abstract: A solar cell silicon wafer carrying device and a transmission system are provided, wherein the solar cell silicon wafer carrying device comprises a tray and an auxiliary mask member, and a side surface of the tray is provided with a spacing slot and a receiving slot. The spacing slot and the receiving slot are arranged in a stepped manner with the spacing slot located below the receiving slot. The auxiliary mask member covers over the receiving slot and is provided with a mask hole in communication with the receiving slot. The mask hole is provided along a perimeter thereof with a shielding portion for shielding an edge of the receiving slot.

Abstract: Disclosed is a centralized MPPT exiting method for a photovoltaic inverter comprising multiple DC chopper circuits and one inverter circuit. The method comprises: when the photovoltaic inverter is in a centralized MPPT mode, MPPT control is implemented independently for each photovoltaic cell in a photovoltaic component and the maximum power point for each photovoltaic cell is obtained; a reference value of the maximum power point for each photovoltaic cell is determined according to the type of the multiple DC chopper circuits; whether the voltage difference between the other maximum power points and the reference value goes beyond an allowable voltage difference is judged and the operation of the DC chopper circuits connecting to the photovoltaic cells with a voltage difference beyond the allowable voltage difference is recovered.

Abstract: A plasma processing apparatus (5) comprises an outer shell (51) which is provided with a reaction chamber (52) in the interior, a bottom electrode which is arranged in the reaction chamber (52) and a cantilever support device (53) which goes through the outer shell (51) and supports the bottom electrode. The cantilever support device (53) is pivotally mounted on the side wall of the outer shell (51) and can rotate in the outer shell (51). The plasma processing apparatus (5) further comprises a locating device so as to selectively fix the relative position of the cantilever support device (53) and the outer shell (51).

Abstract: The present invention provides a cassette positioning device and a semiconductor processing apparatus. The cassette positioning device includes: a positioning baseplate arranged horizontally and connected with the lifting device; a rotatable positioning, plate, which is located on the positioning baseplate, has one end rotatably connected with one end of the positioning baseplate, and is provided thereon with a positioning assembly; and a support column arranged under the rotatable positioning plate. The support column and the positioning baseplate can move relatively in the vertical direction, such that the rotatable positioning plate is pushed up by the support column and rotates to be inclined relatively to the positioning baseplate when the support column rises to a preset highest position relatively to the positioning baseplate, and the rotatable positioning plate and the positioning baseplate are stacked on the support column in parallel when the support column is located at a preset lowest position.

Abstract: Embodiments of the invention provide a process chamber and a semiconductor processing apparatus. According to at least one embodiment, the process chamber includes a reaction compartment, a gas introducing system and a wafer transfer device. The reaction compartment is provided in the process chamber and used for performing a process on a wafer, the gas introducing system is used for providing processing gas to the reaction compartment, and the wafer transfer device is used for transferring the wafer into the reaction compartment. A lining ring assembly is provided in the reaction compartment, and is configured such that a flow uniformizing cavity is formed between the lining ring assembly itself and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas, from the gas introducing system, into the reaction compartment through the flow uniformizing cavity.

Abstract: A plasma processing apparatus (5) comprises an outer shell (51) which is provided with a reaction chamber (52) in the interior, a bottom electrode which is arranged in the reaction chamber (52) and a cantilever support device (53) which goes through the outer shell (51) and supports the bottom electrode. The cantilever support device (53) is pivotally mounted on the side wall of the outer shell (51) and can rotate in the outer shell (51). The plasma processing apparatus (5) further comprises a locating device so as to selectively fix the relative position of the cantilever support device (53) and the outer shell (51).