Abstract: A pad according to embodiments of the present invention includes a cover layer, a second flexible layer next to the cover layer, the second flexible layer formed of warp knit textile, a third flexible layer formed of the warp knit textile, and nylon and/or polyester fibers connecting the second flexible layer with the third flexible layer. According to such embodiments, the plurality of fibers maintain a spaced-apart configuration of the second and third flexible layers. The cover layer, the second and third flexible layers, and the plurality of fibers between the second and third outer perimeters are fused together at an outer perimeter. The pad may be used under an electronic device to facilitate cooling of the electronic device, to increase a user's comfort when placed between the electronic device and the user's lap, or to protect, pad, and isolate the electronic device from spills on a table surface.