Abstract: A method of processing a workpiece may include forming a first layer on a first side of a base layer. The base layer may be part of a substrate including a plurality of layers. The method may also include forming a second layer on the first layer. A material of the second layer may include metal. The method may also include forming an opening in the second layer, forming an opening in the first layer by etching, and removing the second layer. The method may include dry etching of the first layer.

Abstract: A method for detecting an abnormal target includes: determining a first detection result based on an infrared signal detected in a detection area, where the first detection result is used to indicate whether an abnormal target exists in the detection area; acquiring N frames of images of the detection area and performing abnormal target detection on the N frames of images to obtain a second detection result, where the second detection result is used to indicate whether the abnormal target exists in the detection area and N is a positive integer; and determining that the abnormal target exists in the detection area, in a case that both the first detection result and the second detection result indicate that the abnormal target exists in the detection area.

Abstract: A method of processing a workpiece may include forming a first layer on a first side of a base layer. The base layer may be part of a substrate including a plurality of layers. The method may also include forming a second layer on the first layer. A material of the second layer may include metal. The method may also include forming an opening in the second layer, forming an opening in the first layer by etching, and removing the second layer. The method may include dry etching of the first layer.