Patents by Inventor Fengii Yeh

Fengii Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing pad having electrospun polishing layer
    Publication number: 20100015895
    Abstract: Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical polishing pads and for using them to polish semiconductor substrates.
    Type: Application
    Filed: July 15, 2008
    Publication date: January 21, 2010
    Inventors: Jeffrey J. Hendron, Mary Jo Kulp, Craig Sungail, Fengii Yeh