Abstract: Provided is a method for fabricating a semiconductor device, which includes the following steps. First, a substrate having at least one transistor is provided. A first insulation layer is formed to cover the transistor. The first insulation layer is patterned to form at least one opening, wherein a part of the transistor is exposed by the opening. At last, an epitaxy is formed in the opening to cover the part of the transistor.

Abstract: A semiconductor device includes a transistor disposed on a substrate, a first insulation layer, a second insulation layer, an epitaxy and a conductive material. The first insulation layer is disposed on the substrate and protruding over the transistor. The first insulation layer has a recess to expose a top portion of the transistor. The second insulation layer is disposed on the first insulation layer and conforms to the recess and exposes the top portion of the transistor. The epitaxy is disposed in the recess of the first insulation layer and overlaps the top portion of the transistor. The epitaxy conforms to sidewalls of the recess of the first insulation layer. The conductive material is disposed in the recess of the first insulation layer.

Abstract: Provided is a method for fabricating a semiconductor device, which includes the following steps. First, a substrate having at least one transistor is provided. A first insulation layer is formed to cover the transistor. The first insulation layer is patterned to form at least one opening, wherein a part of the transistor is exposed by the opening. At last, an epitaxy is formed in the opening to cover the part of the transistor.

Abstract: A semiconductor structure includes a semiconductor substrate having thereon a plurality of deep trenches and a plurality of pillar structures between the deep trenches, wherein each of the plurality of pillar structures comprises an upper portion and a lower portion. A doping region is formed in the lower portion. A diffusion barrier layer is disposed on a sidewall of the lower portion.

Abstract: This invention takes advantages of color characteristics of medical devices for the cosmetic and indication purposes. For example, the appearances of the metallic brackets used in orthodontics are improved with colors other than the original metallic color by surface treatment using plasma techniques. For example, orthodontic brackets are made with piezochromic materials. When the archwire's torsion and bending forces are fading due to the movement of the teeth, the color of the pressure sensitive brackets will be changed, and the need of archwire's readjustment to have proper torsion and bending forces is signalized. For example, rehabilitation equipments are made with piezochromic materials. When the pressures exerting on the rehabilitation equipments are different, different colors of the equipments are displayed, and the therapists can then act accordingly.