Patents by Inventor Fenglong Lu
Fenglong Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12490413Abstract: A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.Type: GrantFiled: September 15, 2023Date of Patent: December 2, 2025Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.Inventors: Dong Chen, Fenglong Lu, Yunyu Tang, Lei Shi, Yunfeng Liu, Shuyi Lv, Pengcheng Zhang
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Publication number: 20250246992Abstract: A power conversion system includes a controller, M direct current conversion units, a bus capacitor, and an inverter unit. An input end of each of the M direct current conversion units is connected to one direct current power supply. Output ends of the M direct current conversion units are connected in parallel and then connected to an input end of the inverter unit. The bus capacitor is connected in parallel to the input end of the inverter unit. The controller is configured to control N direct current conversion units in the M direct current conversion units to adjust output currents/input currents in response to an amplitude of a ripple current of the bus capacitor being greater than a first threshold, to decrease the amplitude of the ripple current of the bus capacitor. M is greater than or equal to 2, and N is a positive integer less than M.Type: ApplicationFiled: April 18, 2025Publication date: July 31, 2025Inventors: Dong CHEN, Fenglong LU, Yunyu TANG, Lei SHI, Kai XIN
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Publication number: 20240396472Abstract: An inverter includes an inverter circuit, a collection circuit, a balanced circuit, and an inductor. The collection circuit is configured to detect a direct current bus voltage, to obtain end voltage values of a first capacitor and a second capacitor. The balanced circuit is configured to: when an end voltage value of a target capacitor is less than or equal to a first voltage threshold, control on or off of a plurality of switching transistors, to adjust a current for charging the target capacitor through the inductor and reduce a difference between the end voltage values of the target capacitor and a non-target capacitor in the two groups of capacitors. When the difference between the end voltage values of the two groups of capacitors in the inverter circuit is large, the balanced circuit may adjust an output current of the inductor to charge the target capacitor.Type: ApplicationFiled: August 8, 2024Publication date: November 28, 2024Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Shen GAO, Fenglong LU, Shuai LIU, Lei SHI
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Publication number: 20240333135Abstract: An inverter apparatus and a control method thereof. The inverter apparatus includes a direct current bus, a bus capacitor, an inverter bridge arm, a filter circuit, a switch unit, and a controller. The inverter bridge arm is connected to a positive direct current bus and a negative direct current bus, and the filter circuit is connected between the inverter bridge arm and a user load. In a working scenario in which the inverter apparatus switches between on-grid operation and off-grid operation, when the working scenario is on-grid operation and off-grid operation with a balanced load, an inverter uses a common-mode injection modulation mode; and when the working scenario is off-grid operation with an unbalanced, the inverter uses a common SPWM modulation mode. The embodiments are implemented to improve working efficiency of the inverter in more working scenarios, and the implementation is simple, stable, reliable, and load-friendly.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Fenglong LU, Shuai LIU, Dong CHEN, Lei SHI
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Patent number: 12078784Abstract: The present disclosure discloses an optical imaging lens assembly including, sequentially from an object side to an image side along an optical axis, a first lens having refractive power, a concave object-side surface and a concave image-side surface; a second lens having positive refractive power; a third lens having refractive power and a convex object-side surface; a fourth lens having positive refractive power; and a fifth lens having negative refractive power. An effective focal length f1 of the first lens and a radius of curvature R1 of the object-side surface of the first lens satisfy 0.7?f1/R1<1.5.Type: GrantFiled: May 4, 2021Date of Patent: September 3, 2024Assignee: Zhejiang Sunny Optics Co., LtdInventors: Jianke Wenren, Fenglong Lu, Fujian Dai, Liefeng Zhao
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Publication number: 20240145426Abstract: A bonding structure and a power device. The bonding structure includes a first power unit and at least two bonding wires. At least one end of the bonding wire is connected to the first power unit through bonding. Projections that are of lead paths of the at least two bonding wires and that are on a preset plane have at least one intersection point. Spatial cross wire bonding is performed on the bonding wires, so that lead paths of the bonding wires form an angle with each other, thereby weakening electromagnetic force between the bonding wires. Therefore, fatigue due to fluctuating stress of the bonding wires can be alleviated, service lives of the bonding wires can be prolonged, and bonding effect can be ensured to a maximum extent.Type: ApplicationFiled: October 18, 2023Publication date: May 2, 2024Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Fenglong LU, Dong CHEN, Lei SHI, Yunyu TANG, Yunfeng LIU
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Publication number: 20240096729Abstract: A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Inventors: Dong Chen, Fenglong Lu, Yunyu Tang, Lei Shi, Yunfeng Liu, Shuyi Lv, Pengcheng Zhang
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Patent number: 11579405Abstract: The present disclosure discloses an optical imaging lens group including, sequentially from an object side to an image side along an optical axis, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens having reactive power. The first lens has positive refractive power, a convex object-side surface, and a concave image-side surface. A total effective focal length f of the optical imaging lens group and half of a maximal field-of-view Semi-FOV of the optical imaging lens group satisfy: f*tan(Semi-FOV)>7.5 mm. A distance TTL along the optical axis from the object-side surface of the first lens to an imaging plane of the optical imaging lens group and half of a diagonal length ImgH of an effective pixel area on the imaging plane of the optical imaging lens group satisfy: TTL/ImgH<1.3.Type: GrantFiled: September 2, 2020Date of Patent: February 14, 2023Inventors: Fenglong Lu, Fujian Dai, Liefeng Zhao
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Publication number: 20210263287Abstract: The present disclosure discloses an optical imaging lens assembly including, sequentially from an object side to an image side along an optical axis, a first lens having refractive power, a concave object-side surface and a concave image-side surface; a second lens having positive refractive power; a third lens having refractive power and a convex object-side surface; a fourth lens having positive refractive power; and a fifth lens having negative refractive power. An effective focal length f1 of the first lens and a radius of curvature R1 of the object-side surface of the first lens satisfy 0.7?f1/R1<1.5.Type: ApplicationFiled: May 4, 2021Publication date: August 26, 2021Inventors: Jianke Wenren, Fenglong Lu, Fujian Dai, Liefeng Zhao
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Publication number: 20210096326Abstract: The present disclosure discloses an optical imaging lens group including, sequentially from an object side to an image side along an optical axis, a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens and a seventh lens having reactive power. The first lens has positive refractive power, a convex object-side surface, and a concave image-side surface. A total effective focal length f of the optical imaging lens group and half of a maximal field-of-view Semi-FOV of the optical imaging lens group satisfy: f*tan(Semi-FOV)>7.5 mm. A distance TTL along the optical axis from the object-side surface of the first lens to an imaging plane of the optical imaging lens group and half of a diagonal length ImgH of an effective pixel area on the imaging plane of the optical imaging lens group satisfy: TTL/ImgH<1.3.Type: ApplicationFiled: September 2, 2020Publication date: April 1, 2021Inventors: Fenglong Lu, Fujian Dai, Liefeng Zhao