Patents by Inventor Fengmei Fan

Fengmei Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical module and transmitting data in optical module
    Patent number: 10140244
    Abstract: An optical module and a method of transmitting data in the optical module are provided in the present disclosure. According to an example, the optical module may comprise a micro controller unit (MCU) and N number of first driving chips having a same chip address. The MCU may be configured with a serial data (SDA) bus interface and N number of first serial clock (SCL) bus interfaces. Each of the N number of first driving chips may be configured with a SDA bus interface which is configured to be connected with the SDA bus interface on the MCU and a SCL bus interface which is configured to be connected with one of the N number of first SCL bus interfaces on the MCU.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: November 27, 2018
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Fengmei Fan, Fubin Li
  • OPTICAL MODULE AND TRANSMITTING DATA IN OPTICAL MODULE
    Publication number: 20170337153
    Abstract: An optical module and a method of transmitting data in the optical module are provided in the present disclosure. According to an example, the optical module may comprise a micro controller unit (MCU) and N number of first driving chips having a same chip address. The MCU may be configured with a serial data (SDA) bus interface and N number of first serial clock (SCL) bus interfaces. Each of the N number of first driving chips may be configured with a SDA bus interface which is configured to be connected with the SDA bus interface on the MCU and a SCL bus interface which is configured to be connected with one of the N number of first SCL bus interfaces on the MCU.
    Type: Application
    Filed: December 27, 2016
    Publication date: November 23, 2017
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies. Ltd.
    Inventors: Fengmei Fan, Fubin LI