Patents by Inventor Fengru Meng

Fengru Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Application of cuprous sulfide in recovery of Au (III) from aqueous solutions
    Patent number: 11970755
    Abstract: The present disclosure discloses an application of cuprous sulfide in a recovery of Au (III) from aqueous solutions, which relates to the fields of hydrometallurgy and precious metal recovery. The method of the present disclosure uses cuprous sulfide nanoparticles to recover Au (III) from aqueous solution, and undergoes gold adsorption under mechanical stirring. The method described in the present disclosure can efficiently recover Au (III) from aqueous solutions, has good recovery effects on Au (III) from acidic waste liquid, and has the advantages of energy conservation, environmental protection, and low cost.
    Type: Grant
    Filed: October 16, 2023
    Date of Patent: April 30, 2024
    Assignee: Kunming University of Science and Technology
    Inventors: Yunlong Chen, Jin Wu, Futing Zi, Xianzhi Hu, Fengru Meng, Yongmao Zeng, Zhongying Wang, Yihuai Yang
  • APPLICATION OF CUPROUS SULFIDE IN RECOVERY OF AU (III) FROM AQUEOUS SOLUTIONS
    Publication number: 20240132996
    Abstract: The present disclosure discloses an application of cuprous sulfide in a recovery of Au (III) from aqueous solutions, which relates to the fields of hydrometallurgy and precious metal recovery. The method of the present disclosure uses cuprous sulfide nanoparticles to recover Au (III) from aquesous solution, and undergoes gold adsorption under mechanical stirring. The method described in the present disclosure can efficiently recover Au (III) from aqueous solutions, has good recovery effects on Au (III) from acidic waste liquid, and has the advantages of energy conservation, environmental protection, and low cost.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Yunlong Chen, Jin Wu, Futing Zi, Xianzhi Hu, Fengru Meng, Yongmao Zeng, Zhongying Wang, Yihuai Yang