Patents by Inventor Fengsheng XI
Fengsheng XI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11906879Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: GrantFiled: March 2, 2020Date of Patent: February 20, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Zhongyu Luan, Zongchun Yang, Fengsheng Xi, Chenxiang Xu
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Patent number: 11822099Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.Type: GrantFiled: December 7, 2020Date of Patent: November 21, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
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Patent number: 11729483Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.Type: GrantFiled: June 1, 2022Date of Patent: August 15, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi, Takehiko Tanaka, Bojie Zhao, Heng Jiang, Ye Wu, Zilong Deng
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Patent number: 11627239Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.Type: GrantFiled: December 2, 2021Date of Patent: April 11, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang, Nan Guo, Fengsheng Xi, Heng Jiang, Zilong Deng
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Publication number: 20220367556Abstract: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area.Type: ApplicationFiled: October 21, 2020Publication date: November 17, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Yinbo ZHANG, Fengsheng XI, Hongfeng GAN
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Publication number: 20220303437Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.Type: ApplicationFiled: June 1, 2022Publication date: September 22, 2022Inventors: Mingzhu WANG, Zhenyu CHEN, Zhongyu LUAN, Zhen HUANG, Nan GUO, Fengsheng XI, Takehiko TANAKA, Bojie ZHAO, Heng JIANG, Ye WU, Zilong DENG
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Patent number: 11451693Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.Type: GrantFiled: May 7, 2021Date of Patent: September 20, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Zhenyu Chen, Nan Guo
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Publication number: 20220268968Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
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Patent number: 11388320Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.Type: GrantFiled: June 2, 2017Date of Patent: July 12, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi, Takehiko Tanaka, Bojie Zhao, Heng Jiang, Ye Wu, Zilong Deng
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Publication number: 20220179288Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: ApplicationFiled: March 2, 2020Publication date: June 9, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Zongchun YANG, Fengsheng XI, Chenxiang XU
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Publication number: 20220094822Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.Type: ApplicationFiled: December 2, 2021Publication date: March 24, 2022Applicant: Ningbo Sunny Opotech Co., Ltd.Inventors: Mingzhu WANG, Zhenyu CHEN, Takehiko TANAKA, Zhongyu LUAN, Bojie ZHAO, Zhen HUANG, Nan GUO, Fengsheng XI, Heng JIANG, Zilong DENG
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Patent number: 11223751Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.Type: GrantFiled: January 20, 2020Date of Patent: January 11, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang, Nan Guo, Fengsheng Xi, Heng Jiang, Zilong Deng
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Publication number: 20210306530Abstract: A photosensitive component, and a camera module and a manufacturing method therefor. The photosensitive component comprises at least a photosensitive element, at least a window-form circuit board and at least a packaging body, wherein the photosensitive element and the window-form circuit board are integrally packaged through the packaging body. The window-form circuit board comprises a circuit board main body which comprises at least one window arranged thereon, wherein the photosensitive element is arranged within the window.Type: ApplicationFiled: June 2, 2017Publication date: September 30, 2021Inventors: Mingzhu WANG, Zhenyu CHEN, Zhongyu LUAN, Zhen HUANG, Nan GUO, Fengsheng XI, Takehiko TANAKA, Bojie ZHAO, Heng JIANG, Ye WU, Zilong DENG
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Publication number: 20210266436Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.Type: ApplicationFiled: May 7, 2021Publication date: August 26, 2021Applicant: Ningbo Sunny Opotech Co., Ltd.Inventors: Mingzhu WANG, Duanliang CHENG, Fengsheng XI, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Zhenyu CHEN, Nan GUO
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Patent number: 11039052Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.Type: GrantFiled: February 5, 2018Date of Patent: June 15, 2021Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Zhenyu Chen, Nan Guo
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Publication number: 20210127040Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.Type: ApplicationFiled: January 20, 2020Publication date: April 29, 2021Inventors: Mingzhu WANG, Zhenyu CHEN, Takehiko Tanaka, Zhongyu LUAN, Bojie ZHAO, Zhen HUANG, Nan GUO, Fengsheng XI, Heng JIANG, Zilong DENG
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Publication number: 20210088696Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.Type: ApplicationFiled: December 7, 2020Publication date: March 25, 2021Inventors: Mingzhu WANG, Bojie Zhao, Takehiko Tanaka, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING
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Patent number: 10908324Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.Type: GrantFiled: October 28, 2016Date of Patent: February 2, 2021Assignee: Ningbo Sunny Opotech Co., Ltd.Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
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Publication number: 20200244852Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.Type: ApplicationFiled: February 5, 2018Publication date: July 30, 2020Applicant: Ningbo Sunny Opotech Co., Ltd.Inventors: Mingzhu WANG, Duanliang CHENG, Fengsheng XI, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Zhenyu CHEN, Nan GUO
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Publication number: 20200218034Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.Type: ApplicationFiled: January 8, 2020Publication date: July 9, 2020Inventors: Mingzhu WANG, Bojie ZHAO, Takehiko TANAKA, Nan GUO, Zhenyu CHEN, Heng JIANG, Zhongyu LUAN, Fengsheng XI, Feifan CHEN, Liang DING