Patents by Inventor Feng-Wei Dai
Feng-Wei Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9162893Abstract: A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.Type: GrantFiled: August 5, 2013Date of Patent: October 20, 2015Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang
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Patent number: 8900541Abstract: An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.Type: GrantFiled: October 9, 2012Date of Patent: December 2, 2014Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yuan Yao, Feng-Wei Dai, Kai-Li Jiang, Chang-Hong Liu, Liang Liu
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Publication number: 20140102687Abstract: A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.Type: ApplicationFiled: December 17, 2013Publication date: April 17, 2014Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Tsinghua UniversityInventors: FENG-WEI DAI, YUAN YAO, YOU-SEN WANG, JI-CUN WANG, HUI-LING ZHANG
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Patent number: 8642121Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.Type: GrantFiled: October 8, 2009Date of Patent: February 4, 2014Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20130316093Abstract: A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.Type: ApplicationFiled: August 5, 2013Publication date: November 28, 2013Applicants: HON HAI PRECISION INDUSTRY CO., LTD., TSINGHUA UNIVERSITYInventors: HAI-ZHOU GUO, FENG-WEI DAI, YUAN YAO, CHANG-SHEN CHANG, CHANG-HONG LIU, KAI-LI JIANG
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Patent number: 8530052Abstract: A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.Type: GrantFiled: December 14, 2007Date of Patent: September 10, 2013Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang
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Patent number: 8437136Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: GrantFiled: October 14, 2009Date of Patent: May 7, 2013Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20130026339Abstract: An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.Type: ApplicationFiled: October 9, 2012Publication date: January 31, 2013Inventors: YUAN YAO, FENG-WEI DAI, KAI-LI JIANG, CHANG-HONG LIU, LIANG LIU
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Patent number: 8309051Abstract: The present disclosure provides an apparatus for manufacturing a carbon nanotube heat sink. The apparatus includes a board, and a plurality of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes. A method for manufacturing multiple carbon nanotube heat sinks is also provided.Type: GrantFiled: October 30, 2009Date of Patent: November 13, 2012Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yuan Yao, Feng-Wei Dai, Kai-Li Jiang, Chang-Hong Liu, Liang Liu
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Patent number: 8221667Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.Type: GrantFiled: October 13, 2009Date of Patent: July 17, 2012Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang, You-Sen Wang, Chang-Hong Liu
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Patent number: 8081469Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: GrantFiled: October 14, 2009Date of Patent: December 20, 2011Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20110052477Abstract: The present disclosure provides an apparatus for manufacturing a carbon nanotube heat sink. The apparatus includes a board, and a plurality of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes. A method for manufacturing multiple carbon nanotube heat sinks is also provided.Type: ApplicationFiled: October 30, 2009Publication date: March 3, 2011Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YUAN YAO, FENG-WEI DAI, KAI-LI JIANG, CHANG-HONG LIU, LIANG LIU
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Publication number: 20100301260Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.Type: ApplicationFiled: October 8, 2009Publication date: December 2, 2010Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20100302739Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: ApplicationFiled: October 14, 2009Publication date: December 2, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Publication number: 20100273946Abstract: A carbon nanotube microcapsule includes at least one carbon nanotube and a shell encapsulating the at least one carbon nanotube. The shell includes a plurality of first functional groups. A composite using the carbon nanotube microcapsule, and a method for making the carbon nanotube microcapsule is also disclosed.Type: ApplicationFiled: September 22, 2009Publication date: October 28, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: HUI-LING ZHANG, YUAN YAO, JI-CUN WANG, YOU-SEN WANG, FENG-WEI DAI
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Publication number: 20100219550Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.Type: ApplicationFiled: October 13, 2009Publication date: September 2, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG, YOU-SEN WANG, CHANG-HONG LIU
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Publication number: 20100157538Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: ApplicationFiled: October 14, 2009Publication date: June 24, 2010Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YOU-SEN WANG, YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG
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Publication number: 20090263310Abstract: A method for making carbon nanotubes that includes the following steps. A metal substrate is provided. The surface of the metal substrate is polished. The polished metal substrate is put into a reaction device. A protecting gas is introduced to the reaction device while the environment inside of the reaction device is heated to about 400 to 800 degrees. A mixture of carbon source gas and protecting gas is introduced to the reaction device, whereby the carbon nanotubes are grown on the metal substrate on the polished metal substrate.Type: ApplicationFiled: April 9, 2009Publication date: October 22, 2009Applicants: Tsinghua University, HON HAI Precision Industry CO., LTD.Inventors: Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei, Kai-Li Jiang, Shou-Shan Fan
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Publication number: 20090061208Abstract: A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.Type: ApplicationFiled: December 14, 2007Publication date: March 5, 2009Applicants: Tsinghua University, HON HAI Precision Industry Co., LTD.Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang