Patents by Inventor Fengwu WU

Fengwu WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diversified assembly printed circuit board and method for making the same
    Patent number: 11324125
    Abstract: A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.
    Type: Grant
    Filed: November 29, 2020
    Date of Patent: May 3, 2022
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Ke Leng, Hailong Liu, Jinfeng Liu, Fengwu Wu, Li Chen, Lihua Zhang
  • DIVERSIFIED ASSEMBLY PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
    Publication number: 20210084773
    Abstract: A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.
    Type: Application
    Filed: November 29, 2020
    Publication date: March 18, 2021
    Inventors: Ke LENG, Hailong LIU, Jinfeng LIU, Fengwu WU, Li CHEN, Lihua ZHANG