Abstract: A silicone composition comprising (A) an electrically conductive filler, (B) a polydiorganosiloxane polymer, (C) a polyorganohydrogensiloxane, (D) a hydrosilylation reaction catalyst, (E) a polymer additive, and optionally (F) a hydrosilylation reaction inhibitor has a low complex viscosity upon admixing and upon cure provides a high electrical conductivity and good electrical conductivity retention after heat aging.

Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component.

Abstract: Provided is a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. The second layer contains a second ethylene-based polymer. Also provided is a laminate containing said sealant layer.

Abstract: The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer. The present disclosure also provides a laminate containing said sealant layer.

Abstract: The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a saturated primary fatty acid amide having a melting point greater than 100° C. The unsaturated primary fatty acid amide and the saturated primary fatty acid amide have a weight ratio of from 3:1 to 1:6. The second layer contains a second ethylene-based polymer. The present disclosure also provides a laminate containing said sealant layer.

Abstract: Provided is a polymer blend that can be used in films, packages, and fibers. In one aspect, a polymer blend comprises an ethylene-based polymer, and one or more compounds of formula (I), wherein n is 6 to 24.

Abstract: Provided is a coextruded multilayer film. The coextruded multilayer film has at least two layers, including a sealant layer and a second layer in contact with the sealant layer. The sealant layer contains (A) a first ethylene-based polymer having a density from 0.865 g/cc to 0.930 g/cc and a melt index from 0.5 g/10 min to 25 g/10 min; (B) an unsaturated primary fatty acid amide having a melting point of 100° C. or less; and (C) a diprotic fatty acid having a melting point greater than 100° C. and a decomposition temperature greater than 200° C. The second layer contains a second ethylene-based polymer. Also provided is a laminate containing said sealant layer.

Abstract: A method for forming thermally conductive composition on electronic components comprises three steps, (I) preparing a silicone composition comprising (A) a polyorganosiloxane, (B) a thermally conductive filler and (C) a catalyst, (II) applying the silicone composition on an electronic component of electronic devices, the electronic component generates heat when the electronic devices are working and (III) curing the silicone composition by heat generated by the electronic component

Abstract: Disclosed herein is a multilayered film comprising a first layer and a second layer; and a tie layer; where the tie layer comprises a crystalline block composite and where the tie layer is disposed between the first layer and the second layer; the first layer being disposed on a first surface of the tie layer; the second layer being disposed on a second surface of the tie layer; where the second surface is opposedly disposed to the first surface; where the multilayered film is biaxially oriented. Disclosed herein too is a method of manufacturing the aforementioned multilayer film.

Abstract: A method for forming chrome-free retanned leather including: (a) contacting wet white with from 1% to 8%, by solids weight, based on the wet weight of wet white, retanning agent selected from the group consisting of: i) an aqueous emulsion polymer including, as copolymerized units, from 2% to 35%, by weight, based on the weight of the emulsion polymer, ethylenically-unsaturated monomer bearing at least one epoxy group, the emulsion polymer having a weight average molecular weight of from 2,000 to 100,000; ii) a compound selected from the group comprising piperazine, piperazine hydrates, salts of piperazine, and combinations thereof; and iii) combinations of i) and ii); (b) heating the contacted wet white; and (c) drying the contacted, heated wet white is provided. The present application also relates to chrome-free retanned leather formed by the method of the invention.

Abstract: Disclosed herein is a multilayered film comprising a first layer and a second layer; and a tie layer; where the tie layer comprises a crystalline block composite and where the tie layer is disposed between the first layer and the second layer; the first layer being disposed on a first surface of the tie layer; the second layer being disposed on a second surface of the tie layer; where the second surface is opposedly disposed to the first surface; where the multilayered film is biaxially oriented. Disclosed herein too is a method of manufacturing the aforementioned multilayer film.

Abstract: A method for forming chrome-free retanned leather including: (a) contacting wet white with from 1% to 8%, by solids weight, based on the wet weight of wet white, retanning agent selected from the group consisting of: i) an aqueous emulsion polymer including, as copolymerized units, from 2% to 35%, by weight, based on the weight of the emulsion polymer, ethylenically-unsaturated monomer bearing at least one epoxy group, the emulsion polymer having a weight average molecular weight of from 2,000 to 100,000; ii) a compound selected from the group comprising piperazine, piperazine hydrates, salts of piperazine, and combinations thereof; and iii) combinations of i) and ii); (b) heating the contacted wet white; and (c) drying the contacted, heated wet white is provided. The present application also relates to chrome-free retanned leather formed by the method of the invention.