Abstract: A polyethylene composition comprising suitable for use in injection molding, the polyethylene composition comprising: from 2 wt. % to 25 wt. % of a high molecular weight component consisting of an ethylene/alpha-olefin copolymer, wherein the high molecular weight component has a density of from 0.910 g/cc to 0.971 g/cc, a melt index (12.16) of greater than 0.5 g/10 min to less than 1.5 g/10 min, a molecular weight distribution (Mw/Mn) of 6.0 to 20.0; from 75 wt. % to 98 wt. % a low molecular weight component consisting of an ethylene homopolymer or an ethylene/alpha-olefin copolymer, wherein the ethylene homopolymer or an and a molecular weight distribution (Mw/Mn) of less than 6.0; wherein the polyethylene composition has a shrinkage anisotropy that is less than the shrinkage anisotropy of the low molecular weight component.

Abstract: An apparatus comprising a first processor comprising first circuitry to track correctable errors detected by a first communication device of a second processor; and second circuitry to communicate with the second processor to initiate, based on the tracked correctable errors, a link recovery procedure for the first communication device.

Abstract: Disclosed herein are hybrid membranes comprising: a microporous polymer, the microporous polymer comprising a continuous polymer phase permeated by a continuous pore phase; and an atomic scale inorganic material dispersed throughout the microporous polymer within the continuous pore phase. Methods of making and use of the hybrid membranes are also disclosed.

Abstract: Contactor structures are provided that can allow for improved heat management while reducing or minimizing the potential for contamination of process gas streams with heat transfer fluids. The contactor structures can include one or more sets of flow channels for process gas flows, such as gas flows introduced to allow adsorption of components from a gas stream or gas flows introduced to facilitate desorption of previously adsorbed components into a purge gas stream. The process gas flow channels can correspond to flow channels defined by a structural material of unitary structure. The unitary structure can correspond to the entire contactor, or the unitary structure can correspond to a monolith that forms a portion of the contactor. The contactor structures can also include one or more sets of flow channels for heat transfer fluids. The heat transfer flow channels can also be defined by the structural material of a unitary structure.

Abstract: Ink compositions are provided for using solvent-based additive manufacturing (SBAM) techniques to form contactor structures and/or structures for use in an adsorption or absorption contactor. Methods forming a contactor using SBAM are also provided. The ink compositions can include a substantial content of adsorbent particles to provide enhanced adsorption by a contactor. Metal organic framework (MOF) structures and zeotype framework structures are examples of types of adsorbent particles that can be incorporated into an ink composition for forming a contactor structure by SBAM. The ink can further include a polymeric component that can serve as the structural component of a polymeric structural material produced by the additive manufacturing method. Such a structural material can correspond to a polymeric material with incorporated adsorbent particles. In some aspects, the polymeric structural material and/or the adsorbent particles can have selectivity for adsorption of CO2 from a process fluid flow.

Abstract: Fiber compositions are provided that incorporate metal organic framework (MOF) materials into the polymeric matrix of the fiber. The metal organic framework materials can be incorporated by including MOF particles into a “dope” or synthesis solution used to form the fiber. The dope solution can then be used to form fibers that include 5.0 wt % or more of MOF in the resulting polymeric structural material of the fiber, relative to a weight of the fibers. In some aspects, the metal organic framework material can correspond to a MOF with selectivity for adsorption of CO2.

Abstract: Disclosed herein are solution-based additive manufacturing inks comprising a polymer, a volatile solvent compound, and a nonsolvent compound. With current additive manufacturing techniques, a wide range of functionally innovative polymers are left without the ability to be used in additive manufacturing. Improved additive manufacturing techniques to process advanced functional polymers are desirable. The disclosed ink is operable to render any chosen polymer useable in additive manufacturing methods. The composition of the disclosed ink allows for a phase inversion to occur to transition the ink from a liquid ink to a solid manufactured structure. Also disclosed herein are devices for additive manufacturing of the ink and methods for making the same.

Abstract: Disclosed herein are solution-based additive manufacturing inks comprising a polymer, a volatile solvent compound, and a nonsolvent compound. With current additive manufacturing techniques, a wide range of functionally innovative polymers are left without the ability to be used in additive manufacturing. Improved additive manufacturing techniques to process advanced functional polymers are desirable. The disclosed ink is operable to render any chosen polymer useable in additive manufacturing methods. The composition of the disclosed ink allows for a phase inversion to occur to transition the ink from a liquid ink to a solid manufactured structure. Also disclosed herein are devices for additive manufacturing of the ink and methods for making the same.

Abstract: Disclosed herein are hybrid membranes comprising: a microporous polymer, the microporous polymer comprising a continuous polymer phase permeated by a continuous pore phase; and an atomic scale inorganic material dispersed throughout the microporous polymer within the continuous pore phase. Methods of making and use of the hybrid membranes are also disclosed.

Abstract: The present invention relates to semiconductor crystal growth equipments. A vapor controlled czochralski (VCZ) single crystal growth apparatus comprises a single crystal furnace, a heating unit, a mechanical transmission unit, and a gaseous adjustment unit. A hot-wall sealed container is mounted in the single crystal furnace, and a crucible is mounted within the hot-wall sealed container. The hot-wall sealed container includes an upper container part and a lower container part. A sealing connection device is provided between the upper and lower container parts. A crucible-transmitting shaft and a seed shaft are inserted into the hot-wall sealed container through respective sealing devices.

Abstract: The present invention relates to semiconductor crystal growth equipments. A vapor controlled czochralski (VCZ) single crystal growth apparatus comprises a single crystal furnace, a heating unit, a mechanical transmission unit, and a gaseous adjustment unit. A hot-wall sealed container is mounted in the single crystal furnace, and a crucible is mounted within the hot-wall sealed container. The hot-wall sealed container includes an upper container part and a lower container part. A sealing connection device is provided between the upper and lower container parts. A crucible-transmitting shaft and a seed shaft are inserted into the hot-wall sealed container through respective sealing devices.