Patents by Inventor Fengyun LIAO

Fengyun LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11622211
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 4, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • Patent number: 11622212
    Abstract: A bone conduction speaker includes a housing, a vibration board and a transducer. The transducer is located in the housing, and the vibration board is configured to contact with skin and pass vibration. At least one sound guiding hole is set on at least one portion of the housing to guide sound wave inside the housing to the outside of the housing. The guided sound wave interfaces with the leaked sound wave, and the interfacing reduces a sound pressure level of at least a portion of the leaked sound wave. A frequency of the at least a portion of the leaked sound wave is lower than 4000 Hz.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 4, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao
  • Patent number: 11622209
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 4, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 11622186
    Abstract: The present disclosure provides an acoustic output apparatus. The acoustic output apparatus may include an acoustic output component and a supporting structure forming an acoustically open structure that allows the acoustic output component to acoustically communicate with the surroundings. The acoustic output component may include a plurality of acoustic drivers, each of which may be configured to output a sound with a frequency range. At least one of the acoustic drivers may include a magnetic system for generating a first magnetic field. The magnetic system may include a first magnetic component for generating a second magnetic field and at least one second magnetic component. A magnetic gap may be formed between the first magnetic component and the at least one second magnetic component. A magnetic field intensity of the first magnetic field in the magnetic gap may be greater than that of the second magnetic field in the magnetic gap.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: April 4, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Publication number: 20230096660
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Application
    Filed: December 1, 2022
    Publication date: March 30, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin QI, Fengyun LIAO, Yueqiang WANG, Haofeng ZHANG
  • Patent number: 11617045
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: March 28, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Lei Zhang, Junjiang Fu, Bingyan Yan
  • Patent number: 11611833
    Abstract: The present invention relates to a bone conduction speaker and its compound vibration device. The compound vibration device comprises a vibration conductive plate and a vibration board, the vibration conductive plate is set to be the first torus, where at least two first rods inside it converge to its center; the vibration board is set as the second torus, where at least two second rods inside it converge to its center. The vibration conductive plate is fixed with the vibration board; the first torus is fixed on a magnetic system, and the second torus comprises a fixed voice coil, which is driven by the magnetic system. The bone conduction speaker in the present invention and its compound vibration device adopt the fixed vibration conductive plate and vibration board, making the technique simpler with a lower cost; because the two adjustable parts in the compound vibration device can adjust both low frequency and high frequency area, the frequency response obtained is flatter and the sound is broader.
    Type: Grant
    Filed: February 7, 2021
    Date of Patent: March 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Jinbo Zheng, Qian Chen, Hao Chen
  • Patent number: 11611834
    Abstract: The present disclosure relates to a bone conduction speaker and its compound vibration device. The compound vibration device comprises a vibration conductive plate and a vibration board, the vibration conductive plate is set to be the first torus, where at least two first rods inside it converge to its center; the vibration board is set as the second torus, where at least two second rods inside it converge to its center. The vibration conductive plate is fixed with the vibration board; the first torus is fixed on a magnetic system, and the second torus comprises a fixed voice coil, which is driven by the magnetic system. The bone conduction speaker in the present disclosure and its compound vibration device adopt the fixed vibration conductive plate and vibration board, making the technique simpler with a lower cost; because the two adjustable parts in the compound vibration device can adjust both low frequency and high frequency area, the frequency response obtained is flatter and the sound is broader.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: March 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Jinbo Zheng, Qian Chen, Hao Chen, Yueqiang Wang, Haofeng Zhang
  • Patent number: 11611837
    Abstract: Methods and apparatus are described herein related to improving the sound quality of a bone conduction speaker. The sound quality of the bone conduction speaker is adjusted in the sound generation, sound transferring, and sound receiving of the bone conduction speaker by designing vibration generation manners and vibration transfer structures.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: March 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Fengyun Liao, Jinbo Zheng, Qian Chen, Hao Chen, Xin Qi
  • Publication number: 20230070507
    Abstract: The present disclosure provides a system and method for acoustic device. The acoustic output device may include an earphone core including at least one acoustic driver for outputting sound though one or more sound guiding holes set on the acoustic output apparatus; the acoustic output device may include one or more sensors configured to detect status information of a user of the acoustic output apparatus; the acoustic output device may include a controller configured to cause the at least one acoustic driver to output sound based on the detected status information of the user; the acoustic output device may further include a power source assembly configured to provide electrical power to the earphone core, the one or more sensors, and the controller; and the acoustic output device may further include a flexible circuit board configured to connect at least the earphone core and the power source assembly.
    Type: Application
    Filed: November 6, 2022
    Publication date: March 9, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI
  • Patent number: 11601761
    Abstract: The present disclosure relates to a bone conduction speaker and its compound vibration device. The compound vibration device comprises a vibration conductive plate and a vibration board, the vibration conductive plate is set to be the first torus, where at least two first rods inside it converge to its center; the vibration board is set as the second torus, where at least two second rods inside it converge to its center. The vibration conductive plate is fixed with the vibration board; the first torus is fixed on a magnetic system, and the second torus comprises a fixed voice coil, which is driven by the magnetic system. The bone conduction speaker in the present disclosure and its compound vibration device adopt the fixed vibration conductive plate and vibration board, making the technique simpler with a lower cost; because the two adjustable parts in the compound vibration device can adjust both low frequency and high frequency area, the frequency response obtained is flatter and the sound is broader.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: March 7, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Jinbo Zheng, Qian Chen, Hao Chen, Lei Zhang, Junjiang Fu, Bingyan Yan
  • Publication number: 20230066263
    Abstract: The present disclosure relates to a pair of glasses. The pair of glasses may include a frame, one or more lenses, and one or more temples. The pair of glasses may further include at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a controller. The at least one low-frequency acoustic driver may be configured to output sounds from at least two first guiding holes. The at least one high-frequency acoustic driver may be configured to output sounds from at least two second guiding holes. The controller may be configured to direct the low-frequency acoustic driver to output the sounds in a first frequency range and direct the high-frequency acoustic driver to output the sounds in a second frequency range. The second frequency range may include one or more frequencies higher than one or more frequencies in the first frequency range.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 2, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei ZHANG, Junjiang FU, Bingyan YAN, Fengyun LIAO, Xin QI
  • Publication number: 20230063283
    Abstract: Embodiments of the present disclosure disclose an earphone including a fixing structure, a first microphone array, a processor, and a speaker. The fixing structure is configured to fix the earphone near a user's ear without blocking the user's ear canal and including a hook-shaped component and a body part. The first microphone array is located in the body part and is configured to pick up environmental noise. The processor is located in the hook-shaped component or the body part and is configured to estimate a sound field at a target spatial position using the first microphone array and generate a noise reduction signal based on the estimated sound field. The target spatial position is closer to the user's ear canal than any microphone in the first microphone array. The speaker is located in the body part and is configured to output a target signal according to the noise reduction signal.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 2, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Jinbo ZHENG, Chengqian ZHANG, Le XIAO, Fengyun LIAO, Xin QI
  • Patent number: 11595745
    Abstract: The present disclosure relates to an acoustic output device including an earphone core, a controller, a Bluetooth module, and a button module. The earphone core may include at least one low-frequency acoustic driver configured to output sounds from at least two first guiding holes and at least one high-frequency acoustic driver configured to output sounds from at least two second guiding holes. The controller may be configured to direct the at least one low-frequency acoustic driver to output the sounds in a first frequency range and direct the at least one high-frequency acoustic driver to output the sounds in a second frequency range. The Bluetooth module may be configured to connect the acoustic output device with at least one terminal device. The button module may be configured to implement an interaction between a user of the acoustic output device and the acoustic output device.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: February 28, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Patent number: 11595760
    Abstract: The present disclosure relates to a bone conduction speaker and its compound vibration device. The compound vibration device comprises a vibration conductive plate and a vibration board, the vibration conductive plate is set to be the first torus, where at least two first rods inside it converge to its center; the vibration board is set as the second torus, where at least two second rods inside it converge to its center. The vibration conductive plate is fixed with the vibration board; the first torus is fixed on a magnetic system, and the second torus comprises a fixed voice coil, which is driven by the magnetic system. The bone conduction speaker in the present disclosure and its compound vibration device adopt the fixed vibration conductive plate and vibration board, making the technique simpler with a lower cost; because the two adjustable parts in the compound vibration device can adjust both low frequency and high frequency area, the frequency response obtained is flatter and the sound is broader.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: February 28, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Jinbo Zheng, Qian Chen, Hao Chen, Lei Zhang, Junjiang Fu, Bingyan Yan
  • Publication number: 20230058586
    Abstract: The present disclosure is directed to a sound amplification device. The sound amplification device comprises a vibrating body, the vibrating body including at least one first vibration surface and at least one contact region for contacting with a vibration source. The vibration source detachably contacts with a contact region, an area of a first vibration surface is larger than an area of the contact region, the vibration source is configured to generate vibration, and the vibration is transmitted to the first vibration surface through the contact region, and further transmitted outwards through the first vibration surface.
    Type: Application
    Filed: October 18, 2022
    Publication date: February 23, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Liwei WANG, Fengyun LIAO
  • Patent number: 11589172
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: February 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Xin Qi, Fengyun Liao, Lei Zhang
  • Patent number: 11589171
    Abstract: A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: February 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Junjiang Fu, Bingyan Yan, Fengyun Liao, Xin Qi
  • Publication number: 20230049441
    Abstract: The embodiments of the present disclosure disclose a system and method. The system may include at least one storage device configured to storage computer instruction; and at least one processor, in communication with the storage device. When executing the computer instructions, the at least one processor is configured to direct the system to perform operations including: obtaining a sensing signal of at least one sensing device; identifying a signal feature of the sensing signal; and determining, based on the signal feature, an operation of a target object associated with the at least one sensing device.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Yongshuai YUAN, Wenjun DENG, Wenbing ZHOU, Yujia HUANG, Fengyun LIAO, Xin QI
  • Publication number: 20230049593
    Abstract: The present disclosure provides a microphone, comprising a shell structure, a vibration pickup assembly, a vibration pickup assembly, wherein the vibration pickup assembly is accommodated in the shell structure and generates vibration in response to an external sound signal transmitted to the shell structure, and at least two acoustoelectric conversion elements configured to respectively receive the vibration of the vibration pickup assembly to generate an electrical signal, wherein the at least two acoustoelectric conversion elements have different frequency responses to the vibration of the vibration pickup assembly.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 16, 2023
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Wenbing ZHOU, Yongshuai YUAN, Wenjun DENG, Yujia HUANG, Xin QI, Fengyun LIAO