Patents by Inventor Fengze Hou

Fengze Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation solution for advanced chip packages
    Patent number: 9653378
    Abstract: A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: May 16, 2017
    Assignee: National Center for Advanced Packaging Co., Ltd.
    Inventors: Fengze Hou, Tingyu Lin
  • HEAT DISSIPATION SOLUTION FOR ADVANCED CHIP PACKAGES
    Publication number: 20160037680
    Abstract: A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger.
    Type: Application
    Filed: May 4, 2015
    Publication date: February 4, 2016
    Inventors: Fengze Hou, Tingyu Lin