Patents by Inventor Ferdinand Borromeo Arabe

Ferdinand Borromeo Arabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patterned plasma treatment to improve distribution of underfill material
    Patent number: 7550314
    Abstract: A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is typically dispensed after the chip is electrically connected to the substrate. The chip may be electrically connected to the substrate by an array of solder bumps, as one example. The underfill material is draw into a gap between the chip and the substrate by a capillary action. The patterned plasma-treated area formed on the chip and/or on the substrate may cause greater capillary force on the underfill material, as compared to non-plasma-treated areas. Such patterned plasma-treatment area may be designed and laid out to provide for more or better control of the underfill distribution between the chip and substrate while forming a chip package.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: June 23, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Charles Anthony Odegard, Mohammad Yunus, Ferdinand Borromeo Arabe
  • Patterned plasma treatment to improve distribution of underfill material
    Patent number: 7045904
    Abstract: A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is typically dispensed after the chip is electrically connected to the substrate. The chip may be electrically connected to the substrate by an array of solder bumps, as one example. The underfill material is draw into a gap between the chip and the substrate by a capillary action. The patterned plasma-treated area formed on the chip and/or on the substrate may cause greater capillary force on the underfill material, as compared to non-plasma-treated areas. Such patterned plasma-treatment area may be designed and laid out to provide for more or better control of the underfill distribution between the chip and substrate while forming a chip package.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: May 16, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Charles Anthony Odegard, Mohammad Yunus, Ferdinand Borromeo Arabe