Patents by Inventor Ferdinand F. Fernandez

Ferdinand F. Fernandez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
    Patent number: 10529645
    Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: January 7, 2020
    Assignee: XILINX, INC.
    Inventors: Jaspreet Singh Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez, Ivor G. Barber, Suresh Ramalingam
  • METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LINE THICKNESS (BLT) REDUCTION AND TIM ADHESION ENHANCEMENT FOR EFFICIENT THERMAL MANAGEMENT
    Publication number: 20180358280
    Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 13, 2018
    Applicant: Xilinx, Inc.
    Inventors: Jaspreet Singh Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez, Ivor G. Barber, Suresh Ramalingam
  • Stacked silicon package assembly having an enhanced lid
    Patent number: 10043730
    Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 7, 2018
    Assignee: XILINX, INC.
    Inventors: Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh, Nael Zohni
  • STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID
    Publication number: 20170092619
    Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.
    Type: Application
    Filed: September 28, 2015
    Publication date: March 30, 2017
    Applicant: Xilinx, Inc.
    Inventors: Gamal Refai-Ahmed, Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh, Nael Zohni