Abstract: In an apparatus for forming, shaping and cutting of contact leads of electronic components which has means for grasping and holding a component in a predetermined position while the working tools are moved to the component to perform their duties, all tools are slidably supported at opposite sides of said predetermined position and between axially spaced cam wheels which have cam surfaces with which the tools are in engagement and which move the tools into working positions upon rotation, thereby permitting the component to remain in a predetermined position such that large movement of large parts is not necessary and the working steps can overlap and therefore be performed rapidly.