Patents by Inventor Ferdinand Utner

Ferdinand Utner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5045965
    Abstract: A capacitor winding is integrated in a metallic housing that is closed in a moisture-tight and gas-tight manner by a cover. Spaced bushings are connected to and extend through the cover. The cover has the shape of a spherical cap with an outwardly directed arch.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: September 3, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Udo Hieber
  • Patent number: 5041696
    Abstract: A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).
    Type: Grant
    Filed: April 21, 1989
    Date of Patent: August 20, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ferdinand Utner
  • Patent number: 4974116
    Abstract: A wound electrical capacitor, particularly a power capacitor, that is integrated in a housing together with an over-pressure breakaway fuse that is composed of an electrical current conductor having a rated break point arranged at least partially in a hollow tube, and whereby the current conductor is releasably secured to an inwardly-arced floor upon interposition of an insulator.
    Type: Grant
    Filed: December 12, 1989
    Date of Patent: November 27, 1990
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Udo Hieber
  • Patent number: 4853825
    Abstract: An electrical capacitor (1) which has at least substantially rectangular cross-section and is mounted in a plastic cup (2) and is potted with casting resin. Pairs of impressions (12, 13) are formed into the edges of the plastic cup (2), and the capacitor (1) is simultaneously centered and fixed. It is thereby assured that the capacitor retains its prescribed position during potting and, moreover, a uniformly thick resin layer is present between the capacitor (1) and the plastic cup (2).
    Type: Grant
    Filed: January 25, 1988
    Date of Patent: August 1, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ferdinand Utner
  • Patent number: 4733327
    Abstract: An electrical capacitor and manufacturing method therefor includes protective cover layers each of which has an insulating strip on each of two projections. During manufacture, an apparatus which forms intermittent metal-free strips during the winding of the capacitor is switched to continuous operation for the windings of the cover layers so that continuous metal-free strips are formed.
    Type: Grant
    Filed: February 10, 1987
    Date of Patent: March 22, 1988
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Behn, Ferdinand Utner
  • Patent number: 4667382
    Abstract: An electrical capacitor and manufacturing method therefore includes protective cover layers each of which has an insulating strip on each of two projections. During manufacture, an apparatus which forms intermittent metal-free strips during the winding of the capacitor is switched to continuous operation for the windings of the cover layers so that continuous metal-free strips are formed.
    Type: Grant
    Filed: May 1, 1986
    Date of Patent: May 26, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Behn, Ferdinand Utner
  • Patent number: 4656557
    Abstract: An electrical layer capacitor is formed of a stack of individual capacitors, each of which is formed of a plastic carrier layer, of a metal coating as an electrode applied thereto, of a plastic film as a dielectric generated thereon by glow polymerization, and a further metal coating applied as a cooperating electrode. The metal coatings of a same polarization are conducted to same lateral faces of the stack, and the individual capacitors are limited along a longitudinal direction of the stack by a straight cut at one side and by a wavy cut at the other side.
    Type: Grant
    Filed: December 4, 1985
    Date of Patent: April 7, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Behn, Ferdinand Utner
  • Patent number: 4635164
    Abstract: An electrical capacitor formed of metallized dielectric layers connected alternatingly to two power lead projections by the presence or absence of metal-free insulating strips includes a wavy cut edge and a smooth cut edge on alternate dielectric layers to which metal coatings are applied for improved adhesion and electical contact.
    Type: Grant
    Filed: March 19, 1986
    Date of Patent: January 6, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Behn, Ferdinand Utner
  • Patent number: 4617609
    Abstract: An electric capacitor which can be soldered to a printed circuit board in the manner of a chip component, without damaging the capacitor, has capacitor plates with electrodes therebetween arranged in a stack, the electrodes alternatingly terminating at opposite end faces of the capacitor, at which a metal plating is applied, with a portion of respective bands of flexible metal being disposed adjacent each metal plating forming current leads, with the portion of the band adjacent the metal plating being encapsulated with the capacitor, and a remaining portion of each band projecting outside of the encapsulation and being bent at least partially around exterior sides of the encapsulation and forming soldering surfaces.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: October 14, 1986
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Herbert Bolz
  • Patent number: 4463338
    Abstract: An electrical network containing at least one electric resistor, includes a support foil and at least one resistance layer coating the support foil forming the at least one electric resistor. The support foil and resistance layer are folded along a zig-zag line forming two outer surfaces of the resistance layer. Contact layers are each disposed on a different one of the outer surfaces of the resistance layer, a plastic layer is applied on the contact layers, and outer contact layers each make contact with a different one of the contact layers. A method is also provided for producing the same.
    Type: Grant
    Filed: August 7, 1981
    Date of Patent: July 31, 1984
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Harald Vetter
  • Patent number: 4342020
    Abstract: A mechanically stable electrical network has a metal carrier and an insulating layer which supports the electrical network on the metal carrier.
    Type: Grant
    Filed: April 9, 1980
    Date of Patent: July 27, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Harald Vetter, Ludwig Nutz
  • Patent number: 4329878
    Abstract: A bridge circuit consisting of two or more resistance strain gauges is formed on a synthetic layer on which a resistance layer and a metal layer provided for the terminal elements are applied. The corresponding patterns are etched into the metal and into the resistance layer. Balance surfaces consisting of materials with a temperature coefficient different from that of the resistance layer are connected in series to the resistance strain gauges. By changing the resistance of the balance surfaces, the circuit is balanced in terms of symmetry, in terms of the temperature coefficient of the resistance layer, and in terms of the temperature coefficient of the modulus of elasticity of the test object.
    Type: Grant
    Filed: April 18, 1980
    Date of Patent: May 18, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Harald Vetter
  • Patent number: 4309687
    Abstract: A resistance strain gauge in which a resistance layer is applied to a carrier and provided with terminal elements is particularly characterized in that a patterned, thin, non-self-bearing resistance layer is materially bonded to a synthetic layer, and that the resistance layer is overlapped by a patterned, solderable contact layer and is materially bonded to the contact layer.
    Type: Grant
    Filed: April 18, 1980
    Date of Patent: January 5, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Harald Vetter
  • Patent number: 4288468
    Abstract: A process for encapsulating electrical components with a continuous layer of synthetic resin material contemplates induction heating of the component by high frequency current with the component leads covered by heat insulating material, and subjecting the heated component to a vortex bath of synthetic resin powder so as to fuse or sinter the powder to the component. Because the leads have not been heated, no resin is sintered thereto, so that scraping or other removal of resin from the leads to make electrical contact therewith need not be undertaken as an additional step. During hardening of the resin the heat insulation may be left in place on the leads to allow the hardened resin to form "feet" on a base of the component, or the heat insulation may be displaced slightly to allow flow of the hardening resin around the lead without forming a fillet.
    Type: Grant
    Filed: June 18, 1979
    Date of Patent: September 8, 1981
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ferdinand Utner
  • Patent number: 4264549
    Abstract: A process for simultaneously batch-coating a number of electric components having radial connections wires extending in approximately parallel relation from the element to be covered utilizes a plate having a hole pattern therein for receiving the wires to retain the elements during coating. A synthetic foil is first placed over the plate and the wires are forced through the foil into the holes. A grid having openings therein formed by perpendicular walls for surrounding the elements is placed over the plate for use as a casting mold. A casting resin is deposited over the grid in excess quantity, and is then smoothed by moving a doctor over the grid. After the resin has hardened, the grid is removed and the individual elements, with the resin adhering to the synthetic foil, are separated.
    Type: Grant
    Filed: June 18, 1979
    Date of Patent: April 28, 1981
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ferdinand Utner
  • Patent number: 4250604
    Abstract: A process for producing electric stacked capacitors including forming a folded track of capacitor materials which is only a fraction of the thickness of the final capacitor, cutting the folded track into segments equalling the length of the capacitor, stacking the segments on a conveyor belt, hardening the stack, providing external contacts and encasing the capacitor. The process may include placing the folded track on their folded edges and applying pressure between a pair of clamps which have recesses to allow the subsequent forming of the contact regions by a metal spraying process.
    Type: Grant
    Filed: December 19, 1978
    Date of Patent: February 17, 1981
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ferdinand Utner, Harald Vetter, Gerhart Vilsmeier
  • Patent number: 4213817
    Abstract: Apparatus is disclosed for the production of an electric stack or layer capacitor of metallized synthetic material films. The capacitor is produced by bending or folding a film by means of a set of folding wheels which are spaced double the folding width at the film inflow and are spaced as close as possible to one another at the film outflow. The invention is advantageously utilized for the production of layer capacitors.
    Type: Grant
    Filed: July 27, 1978
    Date of Patent: July 22, 1980
    Assignee: Siemens Aktiengesellschaft
    Inventors: Friedrich J. Gaenge, Ferdinand Utner, Harald Vetter, Gerhart Vilsmeier
  • Patent number: 4128926
    Abstract: A method and apparatus is disclosed for the production of an electric stack or layer capacitor of metallized synthetic material films. The capacitor is produced by bending or folding a film by means of a set of folding wheels which are spaced double the folding width at the film inflow and are spaced as close as possible to one another at the film outflow. The invention is advantageously utilized for the production of layer capacitors.
    Type: Grant
    Filed: July 13, 1977
    Date of Patent: December 12, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Friedrich J. Gaenge, Ferdinand Utner, Harald Vetter, Gerhart Vilsmeier
  • Patent number: 4080647
    Abstract: A voltage multiplier cascade assembly contains diodes and two capacitor blocks. The capacitor blocks are severed from a mother capacitor and subdivided by way of slots through the Schoop layers and the capacitance-effective areas of the capacitor to form a row of intergrally interconnected layer capacitors having several contact surfaces. The diodes are placed between the capacitor blocks to improve heat disipation and enhance the screening of interference radiation from the diodes. Connections are affected by a metal mounting lattice having terminal plates and contact strips. The entire assembly is cast in a cup and preferably serves for use in television apparatus.
    Type: Grant
    Filed: July 15, 1976
    Date of Patent: March 21, 1978
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ludwig Berg, Ferdinand Utner