Patents by Inventor Fern Lan Ng

Fern Lan Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating microelectromechanical system structures
    Patent number: 7405466
    Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: July 29, 2008
    Assignee: Agency for Science, Technology and Research
    Inventors: Jun Wei, Stephen Chee Khuen Wong, Yongling Wu, Fern Lan Ng
  • Method of fabricating microelectromechanical system structures
    Patent number: 7153759
    Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: December 26, 2006
    Assignee: Agency for Science Technology and Research
    Inventors: Jun Wei, Stephen Chee Khuen Wong, Yongling Wu, Fern Lan Ng