Patents by Inventor Fernando A. Magsombol

Fernando A. Magsombol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9286922
    Abstract: A device may comprise a machine vision system in a first zone of the device. The machine vision system may be configured to provide measurements of gaps between selected portions of a head gimbal assembly (HGA) and selected portions of arms of a head stack assembly (HSA) of a data storage device. A first adhesive tacking system may be provided in a second zone of the device, and configured to sequentially apply adhesive to the gaps based upon the measurements of the gaps provided by the machine vision system. A transport mechanism may be configured to sequentially carry the HSA of the data storage device to the first zone to enable the machine vision system to measure the gaps and from the first zone to the second zone of the device to enable the first adhesive tacking system to apply the adhesive to the gaps.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: March 15, 2016
    Assignee: Western Digital Technologies, Inc.
    Inventors: Fernando A. Magsombol, Arnon Amornmannun, Saravut Ashametra, Nitipat Songwiroj
  • Patent number: 9214174
    Abstract: A method to manufacture a head stack assembly for a disk drive, the method comprising: attaching a head gimbal assembly that includes a flexure tail having flexure bond pads to an actuator that includes a flexible printed circuit (FPC) with FPC bond pads; folding each of the flexure bond pads upon itself such that the flexure tail is substantially thicker at each of the folded flexure bond pads; aligning the flexure bond pads with the FPC bond pads; introducing an adhesive material that includes electrically conductive beads of substantially similar size between each of the flexure bond pads and corresponding ones of the FPC bond pads; and bringing a thermode tool into contact with the flexure bond pads after folding, with the thermode tool pressing the flexure bond pads against the FPC bond pads for a period.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: December 15, 2015
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Fernando A. Magsombol
  • Patent number: 8467153
    Abstract: A head gimbal assembly for a disk drive includes a read head and a suspension assembly. The suspension assembly includes a load beam and a laminate flexure. The laminate flexure includes a structural layer, a dielectric layer, and a conductive layer. The laminate flexure includes a tongue portion that connects to the read head and a flexure tail that extends away from the tongue portion. The flexure tail includes a plurality of flexure bond pads. Each of the plurality of flexure bond pads is folded upon itself.
    Type: Grant
    Filed: October 29, 2010
    Date of Patent: June 18, 2013
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Fernando A. Magsombol
  • Patent number: 8068314
    Abstract: A novel head stack assembly (HSA) is disclosed and claimed. The HSA includes an actuator including an actuator body and an actuator arm extending from the actuator body, and a flexible printed circuit (FPC) adjacent the actuator body. The FPC includes a slit therethrough. A head gimbal assembly (HGA) is attached to the actuator arm. The HGA includes a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure has a flexure tail that includes an intermediate region that is disposed adjacent the actuator arm, and a terminal region that is electrically connected to the FPC. The terminal region is substantially orthogonal to the intermediate region. The intermediate region of the flexure tail extends into the slit, interferes with the slit, and contacts and deforms the FPC adjacent the slit.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: November 29, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Shufun Ho, Gregory Tran, Fernando A. Magsombol