Abstract: A method and substrate are provided for supporting one or more electronic devices including a first layer having a plurality of interconnected metallic frames laid out in a predetermined pattern. Each frame includes a frame member surrounding at least a portion of each frame, one or more metal pads and a plurality of metal tabs. Each tab connects to at least one of a metal pad and the frame member. A second generally planar nonconductive layer is secured to and covering at least a portion of a first surface of one or more metal pads. The nonconductive layer insulates the covered portion of the first surface of the at least one metal pad. A third generally planar layer that has a plurality of conductive traces is provided. Each trace has a first surface that is secured to and covers at least a portion of the nonconductive layer and a second surface that receives and supports an electronic device.

Abstract: A semiconductor package comprises a plurality of metal contacts, each contact having a first surface, a second surface opposite the first surface, and a locking mechanism to lock the contacts with an encapsulant material of the package. A plurality of extended metallic interconnections are provided, each having a first surface and a second surface opposite the first surface and being configured based on the configuration of interconnect regions of a semiconductor device within the package. An inverted semiconductor device is positioned on the first surfaces of the extended metallic interconnections. A plurality of uncoated metallic bumps are each electrically connected between an interconnect region of the semiconductor device and the first surface of the corresponding extended metallic interconnection. An encapsulant material covers the semiconductor device and at least a portion of each of the contacts, so that at least the second surface of the contacts is exposed.