Patents by Inventor Fernando Chen

Fernando Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11476208
    Abstract: Semiconductor devices may include a substrate and a backside-biased semiconductor die supported above the substrate. A backside surface of the backside-biased semiconductor die may be spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Methods of making semiconductor devices may involve supporting a backside-biased semiconductor die supported above a substrate, a backside surface of the backside-biased semiconductor die being spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Systems may include a sensor device, a nontransitory memory device, and at least one semiconductor device operatively connected thereto. The at least one semiconductor device may include a substrate and a backside-biased semiconductor die supported above the substrate.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: October 18, 2022
    Assignee: Microchip Technology Incorporated
    Inventors: Behrooz Mehr, Fernando Chen, Emmanuel de los Santos, Alex Kungo
  • Publication number: 20200365530
    Abstract: Semiconductor devices may include a substrate and a backside-biased semiconductor die supported above the substrate. A backside surface of the backside-biased semiconductor die may be spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Methods of making semiconductor devices may involve supporting a backside-biased semiconductor die supported above a substrate, a backside surface of the backside-biased semiconductor die being spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Systems may include a sensor device, a nontransitory memory device, and at least one semiconductor device operatively connected thereto. The at least one semiconductor device may include a substrate and a backside-biased semiconductor die supported above the substrate.
    Type: Application
    Filed: August 5, 2020
    Publication date: November 19, 2020
    Inventors: Behrooz Mehr, Fernando Chen, Emmanuel de los Santos, Alex Kungo
  • Patent number: 10741507
    Abstract: Semiconductor devices may include a substrate and a backside-biased semiconductor die supported above the substrate. A backside surface of the backside-biased semiconductor die may be spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Methods of making semiconductor devices may involve supporting a backside-biased semiconductor die supported above a substrate, a backside surface of the backside-biased semiconductor die being spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Systems may include a sensor device, a nontransitory memory device, and at least one semiconductor device operatively connected thereto. The at least one semiconductor device may include a substrate and a backside-biased semiconductor die supported above the substrate.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: August 11, 2020
    Assignee: Microchip Technology Incorporated
    Inventors: Behrooz Mehr, Fernando Chen, Emmanuel de los Santos, Alex Kungo
  • Publication number: 20180233463
    Abstract: Semiconductor devices may include a substrate and a backside-biased semiconductor die supported above the substrate. A backside surface of the backside-biased semiconductor die may be spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Methods of making semiconductor devices may involve supporting a backside-biased semiconductor die supported above a substrate, a backside surface of the backside-biased semiconductor die being spaced from the substrate. The backside surface may be electrically connected to ground by wire bonds extending to the substrate. Systems may include a sensor device, a nontransitory memory device, and at least one semiconductor device operatively connected thereto. The at least one semiconductor device may include a substrate and a backside-biased semiconductor die supported above the substrate.
    Type: Application
    Filed: February 8, 2018
    Publication date: August 16, 2018
    Inventors: Behrooz Mehr, Fernando Chen, Emmanuel de los Santos, Alex Kungo
  • Publication number: 20170025388
    Abstract: An integrated circuit (IC) device may include a substrate including a first mounting area and a ground ring, a first integrated circuit die attached to the first mounting area, a die attach paddle mounted onto the ground ring and extending above the first integrated circuit die, and a second integrated circuit die mounted on a second mounting area, wherein the die attach paddle defines the second mounting area above the first integrated circuit die. The second integrated circuit die may have a backside oriented toward the substrate and connected to ground.
    Type: Application
    Filed: July 21, 2016
    Publication date: January 26, 2017
    Applicant: Microchip Technology Incorporated
    Inventors: Hazel Caballero, Fernando Chen