Abstract: This present disclosure provides devices, systems, and methods relating to the modulation of tissue temperature. In particular, the present disclosure provides devices, systems, and methods for rapidly cooling or heating tissue in a subject as a therapeutic and/or prophylactic means for treating tissue that has been injured or damaged.

Abstract: A laundry machine includes an agitator, an electric machine, a first pulley, a second pulley, and a belt. The electric machine is configured to generate power. The first pulley is connected to the electric machine. The second pulley is connected to the agitator. The belt connects the first pulley to the second pulley. The first pulley, the second pulley, and the belt are configured to collectively (i) deliver power from the electric machine to the agitator and (ii) reduce a rotational speed of the agitator relative to a rotational speed of the electric machine.

Abstract: The present invention relates to a medical article for fixation of a wound dressing as well as its use and manufacturing method. The medical article comprises a non-woven backing layer. A plastic film layer is attached to the bottom side of the non-woven backing layer. An adhesive silicone gel layer is then in turn attached to the bottom side of the plastic film layer. Preferably, the medical article is provided in the form of a roll. The medical article according to the present invention may provide an easy to apply, secure, skin-friendly, painless and gentle fixation of a primary dressing such as a compress on the body of a patient.

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

Abstract: The present invention concerns a wound dressing with improved adhesive and atraumatic properties. The wound dressing comprises a backing layer, an absorbent wound pad and a perforated atraumatic wound contact layer. The absorbent wound pad comprises super absorbent fibers and a net layer. The atraumatic wound contact layer comprises a polyurethane layer, an adhesive acrylic layer and an adhesive silicone layer as skin adherent. The backing layer and the perforated atraumatic wound contact layer are bonded together at the edge region.

Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: The present invention relates to microorganism compositions and fertilisers comprising them, which reduce soil nitrate accumulation and their use for avoiding nitrogen leaching.

Abstract: An apparatus includes a single sense pin connected to a line of a device connected to the apparatus, a gate pin configured to produce a gate signal to enable or disable a switch connected between the line of the device connected to the apparatus and a system ground, and control logic. The control logic is configured to at the single sense pin, determine a short between the device and the system ground, and, based upon the determination of the short, disable the switch.

Abstract: A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

Abstract: A quantum device is disclosed having an LC resonator circuit for performing qubit measurement or readout. The device comprises a silicon layer (601), a dielectric layer (603) disposed upon and forming a functional interface with the silicon layer (601), a first metallic region (614) disposed upon the dielectric layer 603, and a second metallic region (624) disposed upon the dielectric layer 603 and laterally separated from the first metallic region (614). The first and second metallic regions (614, 624) are arranged to be electrically connected such that a double quantum dot, forming a qubit having a first state and a second state, can be induced beneath the first and second metallic regions (614, 624) at the functional interface. The double quantum dot provides a capacitor C1 in the LC resonator circuit and the capacitance of the double quantum dot is dependent on the state of the qubit.

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: A cloud computing capacity management system can include a fine-grained admission control layer, a policy engine, and an enforcement layer. The fine-grained admission control layer can be configured to ingest capacity signals and create a capacity mitigation policy, based at least in part on the capacity signals, to protect available capacity of a cloud computing system for prioritized users. The capacity mitigation policy can be directed to users of the cloud computing system. The policy engine can be configured to control how the capacity mitigation policy is applied to the cloud computing system. The enforcement layer can be configured to handle incoming resource requests and to enforce resource limits based on the capacity mitigation policy as applied by the policy engine.

Abstract: A base sheet formed from a nonwoven web and having a microstructured topography is provided. A plurality of staple fibers modified with a cation are affixed to the nonwoven web via an adhesive modified with an anion in order to improve one or more attributes of the nonwoven web, such as softness, absorption, abrasion, and barrier properties. The present disclosure also provides a method of forming a base sheet which includes printing the adhesive on the nonwoven web, and passing the nonwoven web through an electroplating module.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

Abstract: A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.

Abstract: A cloud computing capacity management system can include a fine-grained admission control layer, a policy engine, and an enforcement layer. The fine-grained admission control layer can be configured to ingest capacity signals and create a capacity mitigation policy, based at least in part on the capacity signals, to protect available capacity of a cloud computing system for prioritized users. The capacity mitigation policy can be directed to users of the cloud computing system. The policy engine can be configured to control how the capacity mitigation policy is applied to the cloud computing system. The enforcement layer can be configured to handle incoming resource requests and to enforce resource limits based on the capacity mitigation policy as applied by the policy engine.