Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

Abstract: A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.

Abstract: A power delivery system for a hardware processor includes a motherboard (MB), a voltage regulator (VR), an elastomer computer socket, and a plurality of power delivery paths within the socket. The socket connects the MB to the processor and comprises a first set of power pins that is connected to the processor by surface mount elements, and a second set of power pins that is not connected to the processor by surface mount elements. The plurality of electrical power delivery paths deliver VR power from the second set of C power pins to the first set of power pins for power delivery to the processor. The alignment frame aligns the processor, the plurality of power pins, and the MB. The plurality of power paths alone may meet the power demands of the processor. If not, a power plane from the MB provides additional power.

Abstract: An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.

Abstract: An embodiment includes a system comprising: a polymer substrate including a plurality of voids; and a plurality of metal pins; wherein a first pin, included within the plurality of metal pins, includes: (a)(i) first and second arms that couple to each other by way of an arcuate member, (a)(ii) a middle portion including a middle diameter, a proximal portion including a proximal diameter, and a distal portion including a distal diameter; wherein (b)(i) the middle portion is between the proximal and distal portions, (b)(ii) the middle diameter is less than the proximal and distal diameters, and (b)(iii) the proximal portion, but not the distal portion, is included within one of the plurality of voids. Other embodiments are described herein.