Abstract: This disclosure, in general, relates to nonwoven abrasive belts including flexible butt joints and methods of making and using such belts and joints.

Abstract: Articles and methods regarding the making and use of low-shedding nonwoven abrasive articles, such as abrasive wheels and hand pads, that have a low shed rate and achieve a high grind ratio. The abrasive articles comprise a blend of a plurality of primary abrasive particles and a plurality of reinforcing abrasive particles that is disposed on a nonwoven web substrate. The primary abrasive particles have an average particle size equal to or larger than the average fiber diameter of the substrate fibers, and the reinforcing abrasive particles have an average particle size smaller than the average fiber diameter.

Abstract: The present disclosure relates to abrasive articles that include abrasive aggregates of silicon carbide with a vitrified bond, and methods of making and using such abrasive articles and abrasive aggregates. In particular, the abrasive aggregates can possess a combination of beneficial properties and comprise a vitreous binder composition having a specific composition, sintering temperature, glass transition temperature, or a combination thereof.

Abstract: The present disclosure relates to abrasive articles that include abrasive aggregates of silicon carbide with a vitrified bond, and methods of making and using such abrasive articles and abrasive aggregates. In particular, the abrasive aggregates can possess a combination of beneficial properties and comprise a vitreous binder composition having a specific composition, sintering temperature, glass transition temperature, or a combination thereof.

Abstract: This disclosure, in general, relates to nonwoven abrasive belts including flexible butt joints and methods of making and using such belts and joints.

Abstract: Articles and methods regarding the making and use of low-shedding nonwoven abrasive articles, such as abrasive wheels and hand pads, that have a low shed rate and achieve a high grind ratio. The abrasive articles comprise a blend of a plurality of primary abrasive particles and a plurality of reinforcing abrasive particles that is disposed on a nonwoven web substrate. The primary abrasive particles have an average particle size equal to or larger than the average fiber diameter of the substrate fibers, and the reinforcing abrasive particles have an average particle size smaller than the average fiber diameter.

Abstract: The present disclosure relates to abrasive articles that include abrasive aggregates of silicon carbide with a vitrified bond, and methods of making and using such abrasive articles and abrasive aggregates. In particular, the abrasive aggregates can possess a combination of beneficial properties and comprise a vitreous binder composition having a specific composition, sintering temperature, glass transition temperature, or a combination thereof.

Abstract: An abrasive article comprising a nonwoven substrate material having a top surface and a bottom surface; a woven cloth; a thermoplastic fastener; and a plurality of abrasive particles, wherein the cloth layer is adhered to the top surface of the nonwoven substrate material; wherein the thermoplastic fastener is disposed on the cloth, and wherein the plurality of abrasive particles are disposed on at least the bottom surface of the nonwoven abrasive substrate.

Abstract: An abrasive article comprising a nonwoven substrate material having a top surface and a bottom surface; a woven cloth; a thermoplastic fastener; and a plurality of abrasive particles, wherein the cloth layer is adhered to the top surface of the nonwoven substrate material; wherein the thermoplastic fastener is disposed on the cloth, and wherein the plurality of abrasive particles are disposed on at least the bottom surface of the nonwoven abrasive substrate.

Abstract: Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.

Abstract: A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension.

Abstract: Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.

Abstract: A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are arranged in rows and columns to form a grid array. A first circuit board such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e. the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls are provided with each ball being positioned on top of a corresponding pin so that each solder ball forms a solder connection between a pin and a corresponding conductive pad or trace. A second circuit board such as a computer mother board has a pin connector mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins.

Abstract: A printed circuit board assembly which comprises a plurality of primary printed circuit boards, a plurality of card edge connectors, at least one secondary printed circuit board and means for predictable separation of the boards from each other. Each of the card edge connectors is fixedly mounted to a respective primary printed circuit board. The secondary printed circuit board is directly removably connected between two card edge connectors. The secondary printed circuit board has an aperture at an edge which is inserted into a card edge connector. The aperture is contacted by a spring element in the card edge connector providing the means for predictable separation of the boards from each other.

Abstract: A card edge connector comprising a housing, electrical contacts, and ejectors. The housing has a middle section with a card edge receiving area, two guide projections at opposite ends of the middle section, and a keeper section. The electrical contacts extend from the middle section, through the keeper, to a bottom of the housing. The housing is suitably configured to receive a daughter printed circuit board at an angle of about 30.degree. relative to a mother printed circuit board. The ejectors are adapted to lock the daughter board to the connector and, eject the daughter board from the connector.

Abstract: A combined electrical connector and connector nesting assembly has a frame with a first section adapted to receive an edge of a printed circuit board and a second section adapted to receive a connector of a cable assembly. The first section has a card edge receiving slot and spring contacts can be inserted thereinto. The second section is located parallel to, but offset from the first section such that when a printed circuit board is inserted into the assembly, a connector located in the second section can receive contact pins projecting from the printed circuit board. The assembly frame can be snap-locked into an electronic component chassis and the connector can be snap-locked into the second section of the frame.

Abstract: A card edge connector of the type used to connect a daughter printed circuit board with a mother printed circuit board. The connector has a housing, a plurality of signal contacts, and an electromagnetic grounding shield to prevent electromagnetic impulses from generating or degrading signals in the signal contacts.